Switching device electrically connected to a lead frame by a bonding material
Provided is a semiconductor device reducing local increase in temperature caused by a void in a bonding material. A semiconductor device includes a conductive member, a semiconductor element, a bonding part, and a lead. The semiconductor element includes a switching element. The semiconductor element is held by the conductive member via a first bonding material. The bonding part is provided on an upper surface of the semiconductor element. The bonding part is electrically connected to an electrode of the switching element other than a gate electrode. The lead is bonded to the bonding part via a second bonding material. The bonding part and the second bonding material are provided in a region including a center part of the upper surface of the semiconductor element.
1 . A semiconductor device, comprising:
a conductive member;
a semiconductor element including a switching element and held by the conductive member via a first bonding material;
at least one bonding part provided on an upper surface of the semiconductor element and electrically connected to an electrode of the switching element other than a gate electrode; and
a lead bonded to the bonding part via a second bonding material, wherein
the bonding part and the second bonding material are provided in a region including a center part of the upper surface of the semiconductor element,
a horizontal-vertical ratio of the semiconductor element in a plan view is equal to or larger than 1.5 and equal to or smaller than 2.5, and an area of the semiconductor element is equal to or smaller than 150 mm 2 , the lead includes a through hole in a bonding surface where the lead is bonded to the bonding part, and the through hole is provided not to be overlapped with the center part in a plan view.
2 . The semiconductor device according to claim 1 , further comprising:
a sealing material sealing the conductive member, the first bonding material, the semiconductor element, the bonding part, the second bonding material, and a part of the lead.
3 . The semiconductor device according to claim 1 , wherein
a total number of the bonding parts provided on the upper surface of the semiconductor element is only one.
4 . The semiconductor device according to claim 1 , further comprising
a plurality of gate lines provided to pass across the upper surface of the semiconductor element and electrically connected to the gate electrode of the switching element, wherein
the plurality of gate lines are provided not to pass through the center part.
5 . The semiconductor device according to claim 1 , further comprising
a plurality of gate lines provided to pass across the upper surface of the semiconductor element and electrically connected to the gate electrode of the switching element, wherein
the bonding part includes a first bonding part provided to the region including the center part and a plurality of second bonding parts provided to a region other than the first bonding part, and
the plurality of gate lines are provided not to pass through the center part.
6 . The semiconductor device according to claim 1 , wherein
an area of the first bonding material is equal to or larger than 50% of an area of the second bonding material.
7 . The semiconductor device according to claim 1 , wherein
a thickness of the semiconductor element is equal to or smaller than 150 μm.
8 . The semiconductor device according to claim 1 , wherein
the semiconductor element includes:
an element formation part corresponding to a region where the switching element is formed in a plan view; and
a plurality of signal pads provided in a region in the upper surface of the semiconductor element other than the element formation part for transmitting or receiving a signal for controlling or protecting the switching element,
the plurality of signal pads are provided along one side of the semiconductor element in a plan view, and
a part of the element formation part is provided side by side with the plurality of signal pads on the one side of the semiconductor element in a plan view.
9 . The semiconductor device according to claim 1 , wherein
the semiconductor element includes an RC-IGBT as the switching element.
10 . The semiconductor device according to claim 1 , wherein
the semiconductor element is made up of a wide bandgap semiconductor.
11 . The semiconductor device according to claim 10 , wherein
the wide bandgap semiconductor includes a silicon carbide, a gallium nitride series material, or diamond.
12 . The semiconductor device according to claim 1 , wherein
the first bonding material includes a void, and
the void is located on a lower side of the center part.
13 . A semiconductor device, comprising:
a conductive member;
a plurality of semiconductor elements each including a switching element and held by the conductive member via a first bonding material;
a bonding part provided on an upper surface of each of the plurality of semiconductor elements and electrically connected to an electrode of the switching element other than a gate electrode; and
a lead bonded to the bonding part via a second bonding material, wherein
the plurality of semiconductor elements are connected in parallel to each other,
the bonding part and the second bonding material are provided in a region including a center part of the upper surface of each of the plurality of semiconductor elements,
a horizontal-vertical ratio of the semiconductor element in a plan view is equal to or larger than 1.5 and equal to or smaller than 2.5, and an area of the semiconductor element is equal to or smaller than 150 mm 2 , the lead includes a through hole in a bonding surface where the lead is bonded to the bonding part, and the through hole is provided not to be overlapped with the center part in a plan view.
14 . A semiconductor device, comprising: a conductive member; a semiconductor element including a switching element and held by the conductive member via a first bonding material; at least one bonding part provided on an upper surface of the semiconductor element and electrically connected to an electrode of the switching element other than a gate electrode; and a lead bonded to the bonding part via a second bonding material, wherein the bonding part and the second bonding material are provided in a region including a center part of the upper surface of the semiconductor element, and a horizontal-vertical ratio of the semiconductor element in a plan view is equal to or larger than 1.5 and equal to or smaller than 2.5, and an area of the semiconductor element is equal to or smaller than 150 mm 2 , the first bonding material includes a void, and the void is located on a lower side of the center part.
15 . A semiconductor device, comprising: a conductive member; a plurality of semiconductor elements each including a switching element and held by the conductive member via a first bonding material; a bonding part provided on an upper surface of each of the plurality of semiconductor elements and electrically connected to an electrode of the switching element other than a gate electrode; and a lead bonded to the bonding part via a second bonding material, wherein the plurality of semiconductor elements are connected in parallel to each other, the bonding part and the second bonding material are provided in a region including a center part of the upper surface of each of the plurality of semiconductor elements, and a horizontal-vertical ratio of the semiconductor element in a plan view is equal to or larger than 1.5and equal to or smaller than 2.5, and an area of the semiconductor element is equal to or smaller than 150 mm 2 , the first bonding material includes a void, and the void is located on a lower side of the center part.