Semiconductor devices and methods of manufacturing semiconductor devices

1 . An electronic device, comprising:

a substrate comprising a top side, a bottom side, a lateral side, and a conductive structure;

a first electronic component over the top side of the substrate and coupled with the conductive structure;

an encapsulant contacting the top side of the substrate, the bottom side of the substrate, and the lateral side of the substrate;

a lid over the first electronic component and over the encapsulant; and

a second electronic component over the top side of the substrate and coupled with the conductive structure, wherein the second electronic component is between the first electronic component and the lateral side of the substrate;

wherein the second electronic component is external to the encapsulant.

2 . The electronic device of claim 1 , further comprising:

an internal interconnect over the top side of the substrate and coupled with the conductive structure;

wherein the encapsulant contacts a lateral side of the internal interconnect.

3 . The electronic device of claim 1 , further comprising:

a plurality of external interconnects on the bottom side of the substrate and coupled with the conductive structure;

wherein a first external interconnect of the plurality of external interconnects is external to the encapsulant, and the encapsulant contacts a second external interconnect of the plurality of external interconnects.

4 . The electronic device of claim 3 , wherein:

the second external interconnect comprises a solder-coated metal core solder ball.

5 . The electronic device of claim 1 , further comprising:

a dam on the top side of the substrate; and

an underfill between the top side of the substrate and a bottom side of the first electronic component;

wherein the dam is between the underfill and the second electronic component.

6 . An electronic device, comprising:

a substrate comprising a top side, a bottom side, a lateral side, and a conductive structure;

a first electronic component over the top side of the substrate and coupled with the conductive structure, wherein the first electronic component comprises a component interconnect on a bottom side of the first electronic component;

a second electronic component over the top side of the substrate and coupled with the conductive structure;

an encapsulant contacting the top side of the substrate, the bottom side of the substrate, and the lateral side of the substrate;

a lid over the first electronic component, over the second electronic component, and over the encapsulant; and

an underfill between the top side of the substrate and the bottom side of the first electronic component and contacting the component interconnect, wherein the second electronic component is external to the underfill.

7 . The electronic device of claim 6 , further comprising:

a dam on the top side of the substrate;

wherein the underfill is between the dam and the component interconnect, and the dam is between the underfill and the second electronic component.

8 . The electronic device of claim 6 , further comprising:

a thermal interface material between a top side of the first electronic component and a bottom side of the lid.

9 . The electronic device of claim 8 , further comprising:

a backside metallization (BSM) on the top side of the first electronic component and contacting the thermal interface material.

10 . The electronic device of claim 6 , further comprising:

an internal interconnect over the top side of the substrate and coupled with the conductive structure;

wherein the internal interconnect is in the encapsulant.

11 . The electronic device of claim 6 , wherein

the second electronic component is external to the encapsulant.

12 . The electronic device of claim 6 , wherein:

the second electronic component is in the encapsulant.

13 . The electronic device of claim 6 , wherein:

a top portion of the encapsulant covers a first portion of the conductive structure exposed at the top side of the substrate; and

a bottom portion of the encapsulant covers a second portion of the conductive structure exposed at the bottom side of the substrate.

14 . A method to manufacture an electronic device, comprising:

providing a substrate comprising a top side, a bottom side, a lateral side, a conductive structure, and a first electronic component over the top side of the substrate and coupled with the conductive structure;

providing a top mold chase over the top side of the substrate and a bottom mold chase below the bottom side of the substrate, wherein the top mold chase has a first cavity between a first bar and a second bar, wherein the bottom mold chase has a second cavity;

providing an encapsulant contacting the top side of the substrate, the bottom side of the substrate, and the lateral side of the substrate, wherein the encapsulant is external to the first cavity and is in the second cavity;

removing the top mold chase and the bottom mold chase;

providing a second electronic component over the top side of the substrate and coupled with the conductive structure; and

providing a lid over the top side of the substrate, wherein the lid is over the first electronic component, the second electronic component, and the encapsulant;

wherein the second electronic component is external to the encapsulant.

15 . The method of claim 14 , wherein:

providing top mold chase over the top side of the substrate comprises locating the first electronic component in the first cavity of the top mold chase; and

the first bar prevents the encapsulant from contacting the first electronic component.

16 . The method of claim 14 , wherein:

providing the top mold chase over the top side of the substrate comprises:

locating a pad in the first cavity of the top mold chase; and

locating the first electronic component external to the first cavity of the top mold chase; and

wherein the encapsulant contacts a lateral side of the first electronic component.

17 . The method of claim 14 , further comprising:

providing an internal interconnect over the top side of the substrate and coupled with the conductive structure;

wherein providing the top mold chase over the top side of the substrate comprises locating the internal interconnect external to the first cavity of the top mold chase; and

wherein the encapsulant contacts a lateral side of the internal interconnect.

18 . The method of claim 14 , further comprising:

providing a first external interconnect on the bottom side of the substrate and coupled with the conductive structure; and

providing a second external interconnect on the bottom side of the substrate;

wherein the first external interconnect is external to the encapsulant and the encapsulant contacts the second external interconnect.

19 . An electronic device, comprising:

a substrate comprising a top side, a bottom side, a lateral side, and a conductive structure;

a dam on the top side of the substrate;

a first electronic component over the top side of the substrate and coupled with the conductive structure;

an underfill between the top side of the substrate and a bottom side of the first electronic component;

an encapsulant contacting the top side of the substrate, the bottom side of the substrate, and the lateral side of the substrate;

a lid over the first electronic component and over the encapsulant; and

a second electronic component over the top side of the substrate and coupled with the conductive structure, wherein the second electronic component is between the first electronic component and the lateral side of the substrate;

wherein the dam is between the underfill and the second electronic component.

20 . The electronic device of claim 1 , wherein:

the second electronic component is external to the encapsulant.

21 . The electronic device of claim 1 , further comprising:

a plurality of external interconnects on the bottom side of the substrate and coupled with the conductive structure;

wherein a first external interconnect of the plurality of external interconnects is external to the encapsulant, and the encapsulant contacts a second external interconnect of the plurality of external interconnects.

22 . The electronic device of claim 21 , wherein:

the second external interconnect comprises a solder-coated metal core solder ball.