Metal PCB for topside power delivery
Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die on the package substrate. In an embodiment, the electronic package further comprises a voltage regulator on the package substrate adjacent to the die, and a metal printed circuit board (PCB) heat spreader. In an embodiment, a trace on the metal PCB heat spreader couples the die to the voltage regulator.
1 . An electronic package, comprising:
a package substrate;
a die on the package substrate;
a voltage regulator on the package substrate, the voltage regulator laterally spaced apart from the die; and
a metal printed circuit board (PCB) heat spreader, wherein a trace on the metal PCB heat spreader couples the die to the voltage regulator.
2 . The electronic package of claim 1 , wherein the metal PCB heat spreader comprises a metal core, and wherein a dielectric layer is between the metal core and the trace.
3 . The electronic package of claim 2 , wherein a thickness of the metal core is approximately 5.0 mm or less.
4 . The electronic package of claim 2 , wherein the metal core is grounded.
5 . The electronic package of claim 2 , wherein the metal core comprises copper.
6 . The electronic package of claim 1 , wherein a footprint of the metal PCB heat spreader is larger than a combined footprint of the die and the voltage regulator.
7 . The electronic package of claim 1 , wherein the metal PCB heat spreader is coupled to the package substrate by a stiffener.
8 . The electronic package of claim 1 , wherein the metal PCB heat spreader is coupled to the package substrate by a sealant.
9 . The electronic package of claim 1 , wherein metal PCB heat spreader comprises legs that are coupled to the package substrate by a sealant.
10 . The electronic package of claim 1 , further comprising a stiffener surrounding the die.
11 . The electronic package of claim 1 , further comprising an integrated heat spreader over the PCB heat spreader.
12 . The electronic package of claim 1 , further comprising a second die between the die and the package substrate.
13 . A metal PCB heat spreader, comprising:
a metal layer;
a dielectric layer over the metal layer;
a first trace on a surface of the dielectric layer; and
a second trace that passes through the dielectric layer and is coupled to the metal layer, the second trace and the first trace configured to couple a die and a voltage regulator, the die laterally spaced apart from the voltage regulator.
14 . The metal PCB heat spreader of claim 13 , wherein the metal layer comprises copper.
15 . The metal PCB heat spreader of claim 13 , wherein the metal layer has a thickness of approximately 5.0 mm or less.
16 . The metal PCB heat spreader of claim 13 , further comprising legs that extend down from the metal layer, wherein the legs are coupled to the metal layer.
17 . The metal PCB heat spreader of claim 13 , wherein the first trace is electrically isolated from the metal layer.
18 . An electronic system, comprising:
a board;
a package substrate coupled to the board;
a first die on the package substrate;
a second die on the package substrate;
a voltage regulator on the package substrate between and laterally spaced apart from the first die and the second die; and
a metal printed circuit board (PCB) heat spreader, wherein a first trace on the metal PCB heat spreader couples the first die to the voltage regulator and a second trace on the metal PCB heat spreader couples the second die to the voltage regulator.
19 . The electronic system of claim 18 , wherein the metal PCB heat spreader comprises a metal core, and wherein a dielectric layer is between the metal core and the first trace and the second trace.
20 . The electronic package of claim 19 , wherein a thickness of the metal core is approximately 5.0 mm or less.