Package architecture with memory chips having different process regions
Embodiments of a microelectronic assembly include: a first integrated circuit (IC) die having a first memory circuit and a second memory circuit; a second IC die; a third IC die; and a package substrate. The first IC die is between the second IC die and the package substrate. The first IC die comprises: a first portion comprising a first active region and a first backend region in contact with the first active region; and a second portion comprising a second active region and a second backend region in contact with the second active region. The first memory circuit is in the first portion, the second memory circuit is in the second portion, the first active region comprises transistors that are larger than transistors in the second active region, and the first backend region comprises conductive traces that have a larger pitch than conductive traces in the second backend region.
1 . A microelectronic assembly, comprising:
a first integrated circuit (IC) die having a first memory circuit and a second memory circuit;
a second IC die;
a third IC die; and
a package substrate,
wherein:
the first IC die is between the second IC die and the package substrate,
the first IC die comprises:
a first portion comprising a first active region and a first backend region in contact with the first active region; and
a second portion comprising a second active region and a second backend region in contact with the second active region,
the first memory circuit is in the first portion,
the second memory circuit is in the second portion,
the first active region comprises transistors that are larger than transistors in the second active region, and
the first backend region comprises conductive traces that have a larger pitch than conductive traces in the second backend region.
2 . The microelectronic assembly of claim 1 , wherein:
the first IC die is coupled to the second IC die on a first side of the second IC die, and
the third IC die is coupled to the second IC die on an opposing second side of the second IC die.
3 . The microelectronic assembly of claim 2 , wherein:
the first IC die is surrounded by an organic dielectric material, and
through-dielectric vias (TDVs) through the organic dielectric material conductively couple the second IC die and the package substrate.
4 . The microelectronic assembly of claim 1 , further comprising a fourth IC die having the first memory circuit and the second memory circuit, wherein:
the first IC die is coupled to the second IC die,
the third IC die is adjacent to the second IC die,
the fourth IC die is coupled to the third IC die,
the first IC die is between the second IC die and a package substrate, and
the fourth IC die is between the third IC die and the package substrate.
5 . The microelectronic assembly of claim 1 , wherein:
the first IC die and the third IC die are coupled to the second IC die, and
the first IC die and the third IC die are between the second IC die and a package substrate.
6 . The microelectronic assembly of claim 5 , further comprising a fourth IC die, wherein the fourth IC die is coupled to a side of the second IC die that is opposite to the first IC die.
7 . The microelectronic assembly of claim 6 , wherein:
the first IC die and the third IC die are surrounded by an organic dielectric material, and
TDVs through the organic dielectric material conductively couple the second IC die and the package substrate.
8 . The microelectronic assembly of claim 7 , further comprising a structure for delivering power, wherein:
the fourth IC die is between the structure and the second IC die,
the structure is to deliver power to the fourth IC die, and
the TDVs are to deliver power to the second IC die from the package substrate.
9 . An IC structure, comprising:
a substrate;
a first portion comprising a first active region and a first backend region; and
a second portion comprising a second active region and a second backend region,
wherein:
the first portion is in contact with the second portion along an interface,
the first active region and the second active region are in the substrate,
the first active region comprises transistors that are larger than transistors in the second active region,
the first backend region comprises conductive traces that have a larger pitch than conductive traces in the second backend region, and
the IC structure is part of an IC die embedded in an interposer comprising organic dielectric material.
10 . The IC structure of claim 9 , wherein:
the first active region does not contain any through-substrate vias (TSVs) therethrough, and
the second active region comprises one or more TSVs therethrough.
11 . The IC structure of claim 9 , wherein:
the first backend region does not contain metal-insulator-metal (MIM) capacitors, and
the second backend region comprises MIM capacitors.
12 . The IC structure of claim 9 , wherein:
the first active region does not contain trench capacitors, and
the second active region comprises trench capacitors.
13 . The IC structure of claim 9 , wherein:
the first backend region comprises a first inorganic dielectric material,
the second backend region comprises a second inorganic dielectric material, and
the first inorganic dielectric material is different from the second inorganic dielectric material.
14 . The IC structure of claim 9 , wherein the second backend region further extends over the first backend region.
15 . The IC structure of claim 9 , wherein the first portion is surrounded by the second portion.
16 . The IC structure of claim 9 , wherein the second portion is surrounded by the first portion.
17 . An IC structure, comprising:
a substrate having a first side and a second side;
a first portion comprising a first active region and a first backend region; and
a second portion comprising a second active region and a second backend region,
wherein:
the first portion is on the first side of the substrate,
the second portion is on the second side of the substrate,
the first active region comprises transistors that are larger than transistors in the second active region,
the first backend region comprises conductive traces that have a larger pitch than conductive traces in the second backend region, and
the IC structure is part of an IC die embedded in an interposer comprising organic dielectric material.
18 . The IC structure of claim 17 , further comprising: TSVs through the substrate, conductively coupling the first portion and the second portion.
19 . The IC structure of claim 17 , further comprising first interconnects coupled to the first portion and second interconnects coupled to the second portion, wherein the first interconnects have a larger pitch than the second interconnects.
20 . The IC structure of claim 19 , further comprising a first redistribution layer in contact with the first portion and a second redistribution layer in contact with the second portion, wherein:
the first interconnects are in the first redistribution layer, and
the second interconnects are in the second redistribution layer.