Stack packages

1 . A stack package comprising:

a package substrate comprising a first bond finger and a second bond finger, the first bond finger spaced apart from the second bond finger;

a first semiconductor die disposed over a portion of the package substrate between the first bond finger and the second bond finger;

a second semiconductor die stacked over the first semiconductor die;

a first connector connecting the first semiconductor die to the first bond finger; and

a second connector connecting the second semiconductor die to the second bond finger, the second connector comprising a length substantially the same as a length of the first connector,

wherein a first distance in which the first bond finger is spaced apart from a first side surface of the first semiconductor die is greater than a second distance in which the second bond finger is spaced apart from a position where a second side surface of the second semiconductor die adjacent to the second bond finger overlaps with the package substrate.

2 . The stack package of claim 1 ,

wherein the first connector comprises a first bonding wire, and

wherein the second connector comprises a second bonding wire.

3 . The stack package of claim 1 ,

wherein the second semiconductor die is disposed over the first semiconductor die so that a portion of the first semiconductor die protrudes out of the second semiconductor die.

4 . The stack package of claim 3 ,

wherein the first semiconductor die further comprises a first connection pad disposed on the portion of the first semiconductor die, protruding out of the second semiconductor die, the first connector being connected to the first connection pad.

5 . The stack package of claim 1 ,

wherein the second semiconductor die is disposed over the first semiconductor die so that a portion of the second semiconductor die protrudes out of the first semiconductor die.

6 . The stack package of claim 5 ,

wherein the second semiconductor die further comprises a second connection pad disposed on the portion of the second semiconductor die, protruding out of the first semiconductor die, the second connector being connected to the second connection pad.

7 . The stack package of claim 1 , further comprising:

a third semiconductor die disposed between the first semiconductor die and the second semiconductor die; and

a third connector connecting the third semiconductor die to the first semiconductor die and connected to the first connector.

8 . The stack package of claim 7 ,

wherein the first semiconductor die, the third semiconductor die, and the second semiconductor die are stacked over the package substrate while being sequentially offset in a first direction toward the second bond finger and away from the first bond finger.

9 . The stack package of claim 7 , further comprising:

a fourth semiconductor die disposed over the second semiconductor die; and

a fourth connector connecting the fourth semiconductor die to the second semiconductor die and connected to the second connector.

10 . The stack package of claim 9 ,

wherein the fourth semiconductor die is stacked over the second semiconductor die while being offset with respect to the second semiconductor die in a second direction toward the first bond finger and away from the second bond finger.

11 . The stack package of claim 9 , further comprising a fifth semiconductor die substantially completely overlapping with the first semiconductor die.

12 . A stack package comprising:

a package substrate comprising a first bond finger and a second bond finger, the first bond finger spaced apart from the second bond finger;

a first semiconductor die disposed over a portion of the package substrate between the first bond finger and the second bond finger;

a second semiconductor die stacked over the first semiconductor die;

a first connector connecting the first semiconductor die to the first bond finger; and

a second connector connecting the second semiconductor die to the second bond finger,

wherein a second distance in which the second bond finger is spaced apart from a position where a second side surface of the second semiconductor die adjacent to the second bond finger overlaps with the package substrate is shorter than a first distance in which the first bond finger is spaced apart from a first side surface of the first semiconductor die.

13 . The stack package of claim 12 ,

wherein the first connector has substantially the same length as the second connector.

14 . The stack package of claim 12 , further comprising:

a third semiconductor die disposed between the first semiconductor die and the second semiconductor die; and

a third connector connecting the third semiconductor die to the first semiconductor die and connected to the first connector.

15 . The stack package of claim 14 ,

wherein the first semiconductor die, the third semiconductor die, and the second semiconductor die are stacked over the package substrate while being sequentially offset in a first direction toward the second bond finger and away from the first bond finger.

16 . The stack package of claim 12 , further comprising:

a fourth semiconductor die disposed over the second semiconductor die; and

a fourth connector connecting the fourth semiconductor die to the second semiconductor die and connected to the second connector.

17 . The stack package of claim 16 ,

wherein the fourth semiconductor die is stacked over the second semiconductor die while being offset with respect to the second semiconductor die in a second direction toward the first bond finger and away from the second bond finger.

18 . The stack package of claim 17 , further comprising a fifth semiconductor die substantially completely overlapping with the first semiconductor die.