Microneedle patch, manufacturing mold therefor, and manufacturing method therefor
The present invention provides a transdermally deliverable microneedle patch, a manufacturing mold therefor, and a manufacturing method therefor. The transdermally deliverable microneedle patch includes: a basal layer for attaching to an epidermis, and a microneedle array and a bump array arranged on the basal layer. The microneedle array includes a plurality of microneedles that protrude and extend away from the basal layer. The microneedles are made of a predetermined medicament and a first dissolvable carrier component, and diameters or maximum dimensions of the cross section of ends of the microneedles opposite to the basal layer are less than 50 μm. The bump array includes a plurality of bumps that protrude and extend away from the basal layer. Diameters or maximum dimensions of the cross section of ends of the bumps opposite to the basal layer are greater than 50 μm. The bumps are arranged at intervals along a periphery of the microneedle array, and heights by which the bumps protrude from the basal layer are less than heights by which the microneedles protrude from the basal layer.
1 . A transdermally deliverable microneedle patch, comprising:
a basal layer, for attaching to an epidermis;
a microneedle array, arranged on the basal layer and comprising a plurality of microneedles that protrude and extend away from the basal layer, wherein the microneedles are made of a predetermined medicament and a first dissolvable carrier component, and diameters or maximum dimensions of the cross section of ends of the microneedles opposite to the basal layer are less than 50 μm; and
a bump array, arranged on the basal layer and comprising a plurality of bumps that protrude and extend away from the basal layer, wherein diameters or maximum dimensions of the cross section of ends of the bumps opposite to the basal layer are greater than 50 μm; and
the bumps are arranged at intervals along a periphery of the microneedle array, and heights by which the bumps protrude from the basal layer are less than heights by which the microneedles protrude from the basal layer,
wherein the microneedles and the bumps are spaced apart from each other on the basal layer without overlapping, and
wherein the plurality of microneedles are configured to pierce the epidermis and reach a dermis to release the predetermined medicament, and the plurality of bumps are configured to abut the epidermis such that the epidermis deforms or is pierced by the plurality of bumps when the plurality of microneedles pierce and reach the dermis.
2 . The transdermally deliverable microneedle patch according to claim 1 , wherein
the heights by which the microneedles protrude from the basal layer are between 100 μm and 1500 μm.
3 . The transdermally deliverable microneedle patch according to claim 1 , wherein
the heights by which the bumps protrude from the basal layer are between 10 μm and 150 μm.
4 . The transdermally deliverable microneedle patch according to claim 1 , wherein the bumps are made of the predetermined medicament and the first dissolvable carrier component.
5 . The transdermally deliverable microneedle patch according to claim 1 , wherein the bumps are made of a dissolvable carrier component, and the dissolvable carrier component is the first dissolvable carrier component or a second dissolvable carrier component different from the first dissolvable carrier component.
6 . The transdermally deliverable microneedle patch according to claim 1 , wherein the diameters or maximum dimensions of the cross section of the ends of the microneedles opposite to the basal layer are greater than 3 μm.
7 . The transdermally deliverable microneedle patch according to claim 1 , wherein the microneedles are polygonal pyramids or cones, and the bumps are polygonal columns, cylinders, incomplete spheres, or incomplete ellipsoids.