IP Library › Granted Patent US 12686052
Granted Patent B2
US 12686052 · App. 17/754,125 · Granted Jul 21, 2026

Sintering composition

Inventors: Shamik Ghoshal (Waterbury, CT); Nirmalya Kumar Chaki (Waterbury, CT); Remya Chandran (Waterbury, CT); Manoharan Venodh (Waterbury, CT); Bawa Singh (Waterbury, CT); Barun Das (Waterbury, CT); Niveditha Nagarajan (Waterbury, CT); Rahul Raut (Waterbury, CT); Oscar Khaselev (Waterbury, CT); Ranjit Pandher (Waterbury, CT); Supriya Devarajan (Waterbury, CT); Anubhav Rustogi (Waterbury, CT)
Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
B22F7/04B05D5/12B22F1/107B22F9/30B23K35/3006H01B1/02H01B1/20H01B13/01209H05K1/097H05K3/1216H05K3/1283H05K3/3485H05K3/3494B22F2007/047B22F2203/11B22F2302/45B22F2303/40B23K2101/38B23K2101/40B23K2101/42H10W72/01323H10W72/07331H10W72/07336H10W72/07341H10W72/352H10W90/734
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Quick Facts
Patent No.
US 12686052
App. No.
17/754,125
Granted
Jul 21, 2026
Kind
B2
Abstract

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

Claims (39)

1 . A sintering composition, consisting of:

a solvent; and

a metal complex dissolved in the solvent,

wherein:

the sintering composition contains at least 75 wt. % of the metal complex, based on the total weight of the sintering composition;

the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition; and

the solvent is supersaturated with the metal complex.

2 . The sintering composition of claim 1 in the form of a gel.

3 . The sintering composition of claim 1 , wherein the metal complex substantially decomposes over a temperature range of less than 20° C.

4 . The sintering composition of claim 1 , wherein the sintering composition contains the metal complex in an amount of up to 95 wt. % based on the total weight of the sintering composition.

5 . The sintering composition of claim 1 , wherein the sintering composition contains at least 25 wt. % metal based on the total weight of the sintering composition.

6 . The sintering composition of claim 1 , wherein the metal complex substantially decomposes at a temperature of less than 200° C.

7 . The sintering composition of claim 1 , wherein the solvent and/or the ligand of the metal complex has a boiling point of less than 300° C.

8 . The sintering composition of claim 1 , wherein the metal of the metal complex is selected from one or more of silver, gold, platinum, palladium, nickel, copper and molybdenum.

9 . The sintering composition of claim 1 , wherein the solvent comprises an organic solvent selected from one or more of propane-1-2-diol, terpineol, triethylene glycol, glycerol and 2-methyl-1,3-propanediol.

10 . The sintering composition of claim 1 , wherein the metal complex is a metal carboxylate, wherein the carboxylate has the structure RCOO − wherein R is a branched or unbranched hydrocarbon chain having 14 carbon atoms or less.

11 . The sintering composition of claim 1 , wherein the metal complex is selected from one or more of silver neodecanoate, silver 2-ethyl hexanoate, silver oxalate, silver lactate, silver hexafluoroacetylacetonate cyclooctadiene, copper formate tetrahydrate and copper acetate.

12 . The sintering composition of claim 1 , wherein the viscosity of the sintering composition is from 60,000 to 120,000 cP.

13 . The sintering composition of claim 1 in the form of a free-standing film or foil.

14 . The sintering composition of claim 1 , applied, deposited, printed or laminated on a wafer.

15 . The sintering composition of claim 1 , applied, deposited, printed or laminated on a substrate fabricated from glass and/or ceramic and/or a metal and/or a polymeric film and/or a composite material used as a printed circuit board.

16 . The sintering composition of claim 1 , wherein the solvent comprises an organic solvent selected from one or more of terpineol and glycerol.

17 . The sintering composition of claim 1 , wherein the metal complex is selected from one or more of silver neodecanoate and copper formate tetrahydrate.

18 . A method of manufacturing the sintering composition of claim 1 , the method comprising:

providing the solvent;

providing the metal complex; and

dissolving the metal complex in the solvent at a temperature of from 60° C. to 180° C. to form the composition.

19 . A sintering composition, consisting of:

a solvent selected from one or more of propane-1-2-diol, terpineol, triethylene glycol, glycerol and 2-methyl-1,3-propanediol; and

a metal complex dissolved in the solvent,

wherein:

the sintering composition contains at least 70 wt. % of the metal complex, based on the total weight of the sintering composition;

the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition; and

the solvent is supersaturated with the metal complex.

20 . The sintering composition of claim 19 , wherein the solvent is selected from one or more of propane-1-2-diol, triethylene glycol, glycerol and 2-methyl-1,3-propanediol.

21 . A method of manufacturing the sintering composition of claim 19 , the method comprising:

providing the solvent;

providing the metal complex; and

dissolving the metal complex in the solvent at a temperature of from 60° C. to 180° C. to form the composition.