IP Library Granted Patent US 12686072
Granted Patent B2
US 12686072 · App. 18/966,707 · Granted Jul 21, 2026

Conductive pins, power modules, ultrasonic welding systems, and methods of using the same

Inventors: Todd J. Walker (Huntington Beach, CA); Omid Niayesh (Irvine, CA); Henri Seppaenen (Irvine, CA)
Assignee: Kulicke and Soffa Industries, Inc.
B23K20/106H10W72/50B23K2101/36H10W70/093
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Quick Facts
Patent No.
US 12686072
App. No.
18/966,707
Granted
Jul 21, 2026
Kind
B2
Abstract

A conductive pin for ultrasonic welding is provided. The conductive pin includes a body portion. The conductive pin also includes a pin head at one end of the body portion. The pin head defines a bonding surface configured to be ultrasonically welded to a workpiece. The bonding surface includes at least one of (i) a nonplanar surface and (ii) an aperture defined in a central region of the bonding surface.

Claims (24)

1 . A method of ultrasonically welding a conductive pin to a workpiece, the method comprising steps of:

(a) providing the workpiece; and

(b) ultrasonically welding a bonding surface of the conductive pin to the workpiece to create a welded side of the conductive pin, the conductive pin including a body portion, and a pin head at one end of the body portion, the pin head defining the bonding surface configured to be ultrasonically welded to the workpiece, the bonding surface including a conical aperture defined in a central region of the bonding surface.

2 . The method of claim 1 wherein step (b) includes applying process parameters, using a control system, during the ultrasonic welding based on the bonding surface.

3 . The method of claim 1 wherein the workpiece includes at least one of a power module, a lead frame, and a battery module.

4 . The method of claim 1 wherein step (b) includes applying process parameters, using a control system, during the ultrasonic welding based on the aperture defined in the central region.

5 . The method of claim 1 wherein the bonding surface further includes a nonplanar surface, and step (b) includes applying process parameters, using a control system, during the ultrasonic welding based on the nonplanar surface and the aperture defined in the central region of the nonplanar surface.

6 . The method of claim 1 wherein step (b) includes applying process parameters, using a control system, during the ultrasonic welding, wherein the process parameters include at least one of bonding force, bonding energy, and bonding time.

7 . The method of claim 1 wherein step (b) includes applying process parameters, using a control system, during the ultrasonic welding, wherein the ultrasonic welding utilizes torsional vibration applied by a sonotrode configured to ultrasonically weld the conductive pin to the workpiece.

8 . The method of claim 1 wherein the aperture has a width of 0.1-3 mm.

9 . The method of claim 1 wherein the aperture includes an angle of 60-170 degrees.

10 . The method of claim 1 wherein the aperture includes a depth of 10-1000 μm.

11 . A method of ultrasonically welding a conductive pin to a workpiece, the method comprising steps of:

(a) providing the workpiece; and

(b) ultrasonically welding the conductive pin to the workpiece, the conductive pin including a body portion, and a pin head at one end of the body portion, the pin head defining a bonding surface configured to be ultrasonically welded to the workpiece, the bonding surface including a nonplanar surface, and an aperture defined in a central region of teh bonding surface,

wherein the conductive pin, including the pin head, has a round cross section along its length in a direction from the bonding surface towards the body portion.

12 . The method of claim 11 wherein step (b) includes applying process parameters, using a control system, during the ultrasonic welding based on the bonding surface.

13 . The method of claim 11 wherein step (b) includes applying process parameters, using a control system, during the ultrasonic welding based on the nonplanar surface.

14 . The method of claim 11 wherein step (b) includes applying process parameters, using a control system, during the ultrasonic welding based on the nonplanar surface and the aperture.

15 . The method of claim 11 wherein step (b) includes applying process parameters, using a control system, during the ultrasonic welding, wherein the process parameters include at least one of bonding force, bonding energy, and bonding time.

16 . The method of claim 11 wherein step (b) includes applying process parameters, using a control system, during the ultrasonic welding, wherein the ultrasonic welding utilizes torsional vibration applied by a sonotrode configured to ultrasonically weld the conductive pin to the workpiece.

17 . The method of claim 11 wherein the workpiece includes at least one of a power module, a lead frame, and a battery module.

18 . The method of claim 11 wherein the nonplanar surface includes a curved surface having a radius of curvature of 1-1000 mm.

19 . The method of claim 11 wherein the nonplanar surface includes a curved surface having a radius of curvature of 2-100 mm.