Laser processing method and laser processing system
A laser processing method and a laser processing system are provided. The laser processing method includes: irradiating a processing area of a workpiece with an electromagnetic wave; and after irradiating the processing area of the workpiece with the electromagnetic wave, irradiating the processing area of the workpiece with a processing pulse.
1 . A laser processing system, comprising:
a laser configured to generate a processing pulse;
a beam splitter disposed on a transmission path of the laser pulse emitted from the laser and configured to split the laser pulse into a first laser pulse and a second laser pulse;
an electromagnetic-wave source configured to generate an electromagnetic wave, wherein the processing pulse comprises femtosecond laser pulses, and the electromagnetic wave comprises terahertz waves, megahertz waves, micron waves, or microwaves, wherein the electromagnetic-wave source is disposed on a transmission path of the first laser pulse, and the electromagnetic-wave source is irradiated by the first laser pulse to generate the electromagnetic wave;
a first beam splitter disposed on a transmission path of the second laser pulse to split the second laser pulse into a processing pulse and the excitation pulse;
a delay optical path disposed on a transmission path of the processing pulse from the first beam splitter; and
a second beam splitter disposed on a transmission path of the excitation pulse from the first beam splitter and the transmission path of the processing pulse from the delay optical path and configured to combine the transmission path of the excitation pulse and the transmission path of the processing pulse.
2 . The laser processing system according to claim 1 , wherein a material of the electromagnetic-wave source comprises zinc telluride or other nonlinear materials, and the electromagnetic wave comprises the terahertz waves or the megahertz waves.
3 . The laser processing system according to claim 1 , further comprising:
a first off-axis parabolic mirror disposed on a transmission path of the electromagnetic wave from the electromagnetic-wave source; and
a second off-axis parabolic mirror disposed on the transmission path of the electromagnetic wave from the first off-axis parabolic mirror and having a through hole, wherein the excitation pulse and the processing pulse from the second beam splitter pass through the through hole to reach to a workpiece.