Cleaner for chemical mechanical polishing apparatus

1 . A cleaner for a chemical mechanical polishing (CMP) apparatus, the cleaner comprising:

a cleaning body with an interior space, the interior space being configured to accommodate a cleaning solution for cleaning a polishing head, and the cleaning body being arranged under the polishing head that holds a substrate;

cleaning nozzles extending from the cleaning body, the cleaning nozzles being configured to inject the cleaning solution to the polishing head;

a vision system configured to photograph the polishing head to obtain an image of the polishing head; and

a controller configured to individually control amounts of the cleaning solution injected from the cleaning nozzles based on the image of the polishing head.

2 . The cleaner as claimed in claim 1 , wherein the cleaning body is positioned between a platen with a polishing pad and a load/unload stage of the polishing head.

3 . The cleaner as claimed in claim 2 , wherein the cleaning body has a curvature corresponding to a curvature of an outer circumferential surface of the platen, the cleaning body being in direct contact with the outer circumferential surface of the platen.

4 . The cleaner as claimed in claim 1 , wherein the cleaning body includes inlet holes at opposite side surfaces of the cleaning body, the inlet holes being connected to a cleaning solution supply.

5 . The cleaner as claimed in claim 4 , further comprising:

a fitting connected to one of the inlet holes, the fitting being selectively connected to a duct of the cleaning solution supply; and

a cover connected to another of the inlet holes, the cover covering the interior space of the cleaning body.

6 . The cleaner as claimed in claim 4 , wherein the cleaning nozzles extend vertically from an upper surface of the cleaning body, the upper surface of the cleaning body being perpendicular to the opposite side surfaces of the cleaning body.

7 . The cleaner as claimed in claim 6 , wherein the cleaning nozzles include:

main nozzles arranged in a first curvature line of the cleaning body; and

at least one auxiliary nozzle arranged in a second curvature line of the cleaning body.

8 . The cleaner as claimed in claim 7 , wherein outermost ones of the main nozzles and the at least one auxiliary nozzle are positioned at an edge of the cleaning body, the outermost ones of the main nozzles and the at least one auxiliary nozzle being configured to inject the cleaning solution to a membrane, a retainer ring, and a gap between the membrane and the retainer ring.

9 . The cleaner as claimed in claim 1 , wherein the vision system includes:

an illuminator configured to illuminate the polishing head; and

a camera configured to photograph the polishing head illuminated by the illuminator.

10 . The cleaner as claimed in claim 9 , wherein the vision system further includes a blower configured to inject a gas toward the polishing head.

11 . The cleaner as claimed in claim 1 , wherein the cleaning nozzles are connected to cleaning solution lines, respectively, each of the cleaning solution lines including a valve independently controllable by the controller.

12 . A cleaner for a chemical mechanical polishing (CMP) apparatus, the cleaner comprising:

a cleaning body under a polishing head, which is configured to hold a substrate, the cleaning body being configured to receive a cleaning solution for cleaning the polishing head;

cleaning nozzles extending from the cleaning body, the cleaning nozzles being configured to inject the cleaning solution to a lower surface of the polishing head;

a vision system configured to photograph the lower surface of the polishing head to obtain an image of the lower surface of the polishing head; and

a controller configured to individually control amounts of the cleaning solution injected from the cleaning nozzles based on the image of the lower surface of the polishing head,

wherein the cleaning body has an arc shape having a curvature corresponding to a curvature of an outer circumferential surface of a platen under the polishing head, the cleaning body being in direct contact with the outer circumferential surface of the platen,

wherein the cleaning nozzles include main nozzles arranged in a first curvature line of the cleaning body, and at least one auxiliary nozzle arranged in a second curvature line of the cleaning body,

wherein the vision system includes an illuminator configured to illuminate the polishing head, a camera configured to photograph the polishing head illuminated by the illuminator, and a blower configured to inject a gas to the polishing head, and

wherein the cleaning nozzles are connected to cleaning solution lines, respectively, each of the cleaning solution lines including a valve controlled by the controller.

13 . The cleaner as claimed in claim 12 , wherein the cleaning body is positioned between the platen and a load/unload stage of the polishing head.

14 . The cleaner as claimed in claim 12 , wherein the cleaning body includes inlet holes at opposite side surfaces of the cleaning body, the inlet holes being connected to a cleaning solution supply.

15 . The cleaner as claimed in claim 14 , further comprising:

a fitting connected to one of the inlet holes, the fitting being selectively connected to a duct of the cleaning solution supply; and

a cover connected to another of the inlet holes, the cover covering an interior space of the cleaning body.

16 . The cleaner as claimed in claim 12 , wherein:

the main nozzles are arranged in a single row along the first curvature line; and

the at least one auxiliary nozzle arranged is in the second curvature line at an edge of the cleaning body, a radius of the second curvature line being larger than a radius of the first curvature line, and an outermost one of the main nozzles with the at least one auxiliary nozzle define a column of at least two nozzles along the edge of the cleaning body.

17 . A cleaner for a chemical mechanical polishing (CMP) apparatus, the cleaner comprising:

a cleaning body with an interior space, the interior space being configured to accommodate a cleaning solution for cleaning a polishing head, and the cleaning body being arranged under the polishing head that holds a substrate;

cleaning nozzles extending from the cleaning body, the cleaning nozzles being configured to inject the cleaning solution to the polishing head;

a vision system configured to photograph the polishing head to obtain an image of the polishing head; and

a controller configured to individually control amounts of the cleaning solution injected from the cleaning nozzles based on the image of the polishing head,

wherein the cleaning body is positioned between a platen with a polishing pad and a load/unload stage of the polishing head,

wherein the cleaning body includes inlet holes at opposite side surfaces of the cleaning body, the inlet holes being connected to a cleaning solution supply,

wherein a fitting is connected to one of the inlet holes, the fitting being selectively connected to a duct of the cleaning solution supply, and a cover is connected to another of the inlet holes, the cover covering the interior space of the cleaning body.

18 . The cleaner as claimed in claim 17 , wherein the cleaning body has a curvature corresponding to a curvature of an outer circumferential surface of the platen, the cleaning body being in direct contact with the outer circumferential surface of the platen.

19 . The cleaner as claimed in claim 17 , wherein the cleaning nozzles extend vertically from an upper surface of the cleaning body, the upper surface of the cleaning body being perpendicular to the opposite side surfaces of the cleaning body.

20 . The cleaner as claimed in claim 19 , wherein the cleaning nozzles include:

main nozzles arranged in a first curvature line of the cleaning body; and

at least one auxiliary nozzle arranged in a second curvature line of the cleaning body.