IP Library › Granted Patent US 12686182
Granted Patent B2
US 12686182 · App. 17/588,187 · Granted Jul 21, 2026

Multifunctional pressure pads for induction welding

Inventors: Francis J. Samalot (St. Louis, MO); Pedro P. Martin (Madrid, ES); Yannick Buser (Overijssel, NL)
Assignee: The Boeing Company
B29C66/8122B29C65/20B29C65/32B29C66/81261B29C66/81262B29C66/81611B29L2031/3076
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Quick Facts
Patent No.
US 12686182
App. No.
17/588,187
Granted
Jul 21, 2026
Kind
B2
Abstract

A compression load distributor includes a support layer and a heat spreading layer. The support layer includes a flexible carrier configured to distribute a load from a compression load applying device. The heat spreading layer is coupled to and carried on the support layer, the heat spreading layer comprising a heat sink configured to transfer heat throughout the compression load distributor. The heat sink is thermally conductive and electrically non-conductive.

Claims (42)

1 . A compression load distributor for use in induction welding, the compression load distributor comprising:

a support layer comprising a flexible carrier, wherein the support layer is configured to distribute a load from a compression load applying device;

a heat spreading layer coupled to the support layer, the heat spreading layer comprising a heat sink, wherein the heat sink is configured to transfer heat throughout the compression load distributor, wherein the heat sink comprises a plurality of ceramic tiles with gaps between adjacent ceramic tiles to maintain flexibility of the compression load distributor, and wherein the heat sink is thermally conductive and electrically non-conductive; and

a polyimide film covering the heat spreading layer, wherein the polyimide film is configured to contact a component during induction welding and to prevent deformation of the flexible carrier and imprinting on the component when the load is applied.

2 . The compression load distributor of claim 1 , wherein the plurality of ceramic tiles is embedded within the flexible carrier to form a flexible plate.

3 . The compression load distributor of claim 1 , wherein:

the flexible carrier comprises a flexible plate configured to be coupled to the compression load applying device; and

the flexible plate and the plurality of ceramic tiles define a semi-rigid pad.

4 . The compression load distributor of claim 3 , wherein the plurality of ceramic tiles are bottom-bonded to the flexible plate in a configuration to maintain an arrangement of the plurality of ceramic tiles on the flexible plate.

5 . The compression load distributor of claim 1 , wherein the heat sink is configured to dissipate heat from a surface during induction welding, the heat generated from a magnetic flux applied to the surface by an induction welding coil.

6 . The compression load distributor of claim 1 , wherein the plurality of ceramic tiles is fabricated from aluminum nitride.

7 . The compression load distributor of claim 1 , wherein the plurality of ceramic tiles is fabricated from boron nitride (BN).

8 . The compression load distributor of claim 1 , wherein the flexible carrier comprises a flexible plate fabricated from a glass fiber.

9 . The compression load distributor of claim 1 , wherein the flexible carrier comprises a flexible plate fabricated from a quartz fiber or basalt fiber.

10 . A compression load distributor for use in induction welding, the compression load distributor comprising:

a support layer comprising a flexible carrier, wherein the support layer is configured to distribute a load from a compression load applying device;

a heat spreading layer coupled to the support layer and comprising a heat sink, wherein the heat sink is configured to transfer heat throughout the compression load distributor, wherein the heat sink is thermally conductive and electrically non-conductive;

a polyimide film covering the heat spreading layer, wherein the polyimide film is configured to contact a component during induction welding; and

a silicone rubber layer covering the support layer opposite the heat spreading layer, wherein the silicone rubber layer is configured to contact the compression load applying device during induction welding, wherein the support layer is positioned between the heat spreading layer and the silicone rubber layer, and wherein the silicone rubber layer is less rigid than the support layer.

11 . The compression load distributor of claim 10 , wherein cross-sectional properties of at least one of the support layer and the heat spreading layer vary longitudinally.

12 . The compression load distributor of claim 10 , wherein the flexible carrier comprises a flexible plate configured to be coupled to the compression load applying device.

13 . The compression load distributor of claim 10 , wherein the heat sink comprises a plurality of ceramic tiles.

14 . The compression load distributor of claim 13 , wherein the plurality of ceramic tiles comprises aluminum nitride.

15 . The compression load distributor of claim 13 , wherein the plurality of ceramic tiles comprises boron nitride (BN).

16 . The compression load distributor of claim 10 , wherein the flexible carrier comprises glass fiber.

17 . The compression load distributor of claim 10 , wherein the flexible carrier comprises quartz fiber.

18 . The compression load distributor of claim 10 , wherein the flexible carrier comprises basalt fiber.

19 . An induction welding system comprising:

an induction welding coil;

a compression load applying device; and

a compression load distributor positioned between the induction welding coil and the compression load applying device and comprising:

a support layer comprising a flexible carrier, wherein the support layer is configured to distribute a load from the compression load applying device;

a heat spreading layer coupled to the support layer and comprising a heat sink, wherein the heat sink is configured to transfer heat throughout the compression load distributor, wherein the heat sink comprises a plurality of ceramic tiles with gaps between adjacent ceramic tiles to maintain flexibility of the compression load distributor, and wherein the heat sink is thermally conductive and electrically non-conductive; and

a polyimide film covering the heat spreading layer, wherein the polyimide film is configured to contact a component during induction welding and to prevent deformation of the flexible carrier and imprinting on the component when the load is applied.

20 . The system of claim 19 , wherein cross-sectional properties of at least one of the support layer and the heat spreading layer vary in at least one direction.

21 . The system of claim 19 , wherein the flexible carrier is coupled to the compression load applying device.

22 . The system of claim 19 , wherein:

the flexible carrier comprises a flexible plate configured to be coupled to the compression load applying device; and

the flexible plate and the plurality of ceramic tiles define a semi-rigid pad.

23 . The system of claim 19 , wherein the plurality of ceramic tiles comprises aluminum nitride.

24 . The system of claim 19 , wherein the plurality of ceramic tiles comprises boron nitride (BN).

25 . The system of claim 19 , wherein the flexible carrier comprises at least one of glass fiber, quartz fiber, or basalt fiber.