IP Library Granted Patent US 12,686,210
Granted Patent B2
US 12,686,210 · App. 18/588,524 · Granted Jul 21, 2026

Liquid ejection head and method of manufacturing liquid ejection head

Inventors: Mitsuru Chida (Kanagawa, JP); Junichiro Iri (Kanagawa, JP)
Assignee: Canon Kabushiki Kaisha
B41J2/16B41J2/14B41J2002/14491
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Quick Facts
Patent No.
US 12,686,210
App. No.
18/588,524
Granted
Jul 21, 2026
Kind
B2
Abstract

A liquid ejection head includes: a housing; an element substrate disposed on a first surface of the housing and including an energy generation element to eject a liquid; a relay wiring member disposed on a second surface at a position protruding in a liquid ejection direction more than the first surface and surrounding the element substrate; a lead connecting the element substrate with the relay wiring member; a filling portion provided between the housing and a side surface of the element substrate; a connection portion surrounded between the housing and the element substrate, connected with the filling portion, and adjacent to the lead; and a sealant sealing the filling portion, the connection portion, and the lead, in which a distance between the housing and the element substrate is smaller in a portion adjacent to the second surface than in a portion between the first surface and the second surface.

Claims (41)

1 . A liquid ejection head, comprising:

a housing;

an element substrate that is disposed on a first surface of the housing and comprises an energy generation element to eject a liquid;

a relay wiring member that is disposed on a second surface at a position protruding in a liquid ejection direction more than the first surface of the housing and that surrounds the element substrate;

a lead that electrically connects the element substrate with the relay wiring member;

a filling portion that is provided between the housing and a side surface of the element substrate in a planar view from the liquid ejection direction;

a connection portion that is surrounded between the housing and the element substrate, connected with the filling portion, and adjacent to the lead; and

a sealant that seals the filling portion, the connection portion, and the lead, wherein

a distance between the housing and the element substrate in a direction parallel to the first surface in the connection portion is shorter in a portion adjacent to the second surface than in a portion between the first surface and the second surface, and

in the connection portion, the housing comprises an inclined surface connected with the first surface and the second surface.

2 . The liquid ejection head according to claim 1 , wherein

the element substrate comprises an electric connection portion electrically connected with the lead, and the sealant seals the electric connection portion.

3 . The liquid ejection head according to claim 1 , wherein

the distance between the housing and the element substrate in the direction parallel to the first surface in the connection portion becomes shorter from a portion adjacent to the first surface toward a portion adjacent to the second surface.

4 . A liquid ejection head, comprising:

a housing;

an element substrate that is disposed on a first surface of the housing and comprises an energy generation element to eject a liquid;

a relay wiring member that is disposed on a second surface at a position protruding in a liquid ejection direction more than the first surface of the housing and that surrounds the element substrate;

a lead that electrically connects the element substrate with the relay wiring member;

a filling portion that is provided between the housing and a side surface of the element substrate in a planar view from the liquid ejection direction;

a connection portion that is surrounded between the housing and the element substrate, connected with the filling portion, and adjacent to the lead; and

a sealant that seals the filling portion, the connection portion, and the lead, wherein

a distance between the housing and the element substrate in a direction parallel to the first surface in the connection portion is shorter in a portion adjacent to the second surface than in a portion between the first surface and the second surface, and

the element substrate comprises an inclined surface facing the housing in the connection portion.

5 . The liquid ejection head according to claim 1 , further comprising:

a second sealant that covers the lead.

6 . A method of manufacturing a liquid ejection head that comprises:

a housing;

an element substrate that is disposed on a first surface of the housing and comprises an energy generation element to eject a liquid;

a relay wiring member that is disposed on a second surface at a position protruding in a liquid ejection direction more than the first surface of the housing and that surrounds the element substrate;

a lead that electrically connects the element substrate with the relay wiring member;

a filling portion that is provided between the housing and a side surface of the element substrate in a planar view from the liquid ejection direction;

a connection portion that is surrounded between the housing and the element substrate, connected with the filling portion, and adjacent to the lead; and

a sealant that seals the filling portion, the connection portion, and the lead, the method comprising:

filling the sealant into the filling portion and applying the sealant to the lead from the filling portion through the connection portion, wherein

a distance between the housing and the element substrate in a direction parallel to the first surface in the connection portion is shorter in a portion adjacent to the second surface than in a portion between the first surface and the second surface, and

in the connection portion, the housing comprises an inclined surface connected with the first surface and the second surface.

7 . The method of manufacturing the liquid ejection head according to claim 6 , further comprising:

sealing by applying the sealant to an electric connection portion of the element substrate, the electric connection portion being electrically connected with the lead.

8 . The method of manufacturing the liquid ejection head according to claim 6 , further comprising:

sealing the lead by applying a second sealant over the lead.