Anti-microbial packaging assembly
An anti-microbial packaging includes an innermost decontamination layer defining an inside and exposed surface of the packaging against which items in the packaging would contact. A fiber substrate layer is fixed to the innermost decontamination layer which itself is a metal or a metallic-alloy layer.
1 . An anti-microbial packaging, comprising:
an innermost decontamination layer having a thickness between 300-400 angstroms, said innermost decontamination layer defining an inside and exposed surface of said packaging against which items in said packaging would contact;
a paper substrate layer fixed to said innermost decontamination layer;
a metallic foil layer on an opposing side of said paper substrate layer from said innermost decontamination layer;
a plastic or polymer film layer disposed between said innermost decontamination layer and said paper substrate layer; and
a polymer layer covering said metallic foil layer, said polymer layer being a non-porous material;
wherein each of said innermost decontamination layer, said paper substrate layer, said metallic foil layer, said plastic or polymer film layer, and said polymer layer have a length and width that are coextensive with one another;
wherein said innermost decontamination layer is comprised of one of a metal and a metallic-alloy;
wherein said innermost decontamination layer forms an entirety of said inside and exposed surface of said packaging;
and
wherein said paper substrate layer is disposed between said innermost decontamination layer and said metallic foil layer.
2 . The anti-microbial packaging according to claim 1 , wherein:
said metal and said metallic-alloy contains copper.
3 . The anti-microbial packaging according to claim 1 , wherein:
said metal and said metallic-alloy that form said innermost decontamination layer are deposited on said paper substrate layer.
4 . The anti-microbial packaging according to claim 3 , wherein:
said metallic foil layer contains one of aluminum and copper.
5 . The anti-microbial packaging according to claim 1 , wherein:
said paper substrate layer is impregnated with an anti-microbial agent.
6 . The anti-microbial packaging according to claim 1 , wherein:
said metal and said metallic-alloy that form said innermost decontamination layer contains silver.
7 . The anti-microbial packaging according to claim 1 , wherein:
said metallic foil layer supports a holographic image thereon.
8 . The anti-microbial packaging according to claim 1 , wherein:
said polymer layer forms an outer, exposed surface of the anti-microbial packaging such that said metallic foil layer is viewable through said polymer layer from outside said anti-microbial packaging.
9 . An anti-microbial packaging, comprising:
an innermost decontamination layer having a thickness between 300-400 angstroms, said innermost decontamination layer defining an inside and exposed surface of said packaging against which items in said packaging would contact;
a substrate layer fixed to said innermost decontamination layer;
a metallic foil layer fixed to an opposite side of the substrate layer from the innermost decontamination layer;
a polymer layer covering said metallic foil layer, said polymer layer being a non-porous material; and
a plastic or polymer film layer disposed between said innermost decontamination layer and said substrate layer;
wherein each of said innermost decontamination layer, said substrate layer, said metallic foil layer, said polymer layer, and said plastic or polymer film layer have a length and a width that are coextensive with one another;
wherein said innermost decontamination layer is comprised of copper;
wherein said innermost decontamination layer forms a substantial entirety of said inside and exposed surface of said packaging;
wherein said innermost decontamination layer is a separate and distinct layer from said substrate layer; and
wherein said plastic or polymer film layer is a separate and distinct layer from said innermost decontamination layer and said substrate layer.
10 . The anti-microbial packaging of claim 9 , wherein:
said metallic foil layer comprises at least one holographic image or pattern.
11 . The anti-microbial packaging of claim 10 , wherein:
said metallic foil layer comprises copper or a copper-containing alloy.