Cure promoter compositions and methods for the same
A cure promoter composition is disclosed, including an accelerator which may include a thiocarbamate, a hydrated thiocarbamate, a dithiocarbamate, a thiazole, a mercaptothiazole, a sulfenamide, a thiazolesulfenamide, a metal salt of thiocarbamate, sulfur chloride, or combinations thereof. The cure promoter composition also includes a compatibilizing carrier, one or more organic solvents, a catalyst, an optional reducing agent, an optional reactive silane, an optional reactive organometallic, an optional gelling agent, and an optional aqueous component. A method for applying the cure promoter composition is disclosed, including contacting the organic solvents, the accelerator, the carrier, the reactive silanes, the reactive organometallics, the reducing agents, and the catalyst with one another to prepare the cure promoter composition, homogenizing the cure promoter composition, pausing after homogenizing to allow the cure promoter time to react, applying a sealant onto a substrate, and applying the cure promoter composition to a surface of the sealant.
1 . A cure promoter composition, comprising:
an accelerator comprising disulfiram;
a compatibilizing carrier comprising pentaerythritol tetrakis (3-mercaptopropionate);
one or more organic solvents comprising a ketone; and
a catalyst, comprising a diazole, comprising 1-methylimidazole;
wherein the composition has a shear viscosity at 25° C. of from 0.01 to 10 Pa·s; and, when brushed onto an uncured polysulfide sealant, produces a tack-free surface in less than 60 minutes at 25° C.
2 . The cure promoter composition of claim 1 , wherein the accelerator further comprises a thiocarbamate, a hydrated thiocarbamate, a dithiocarbamate, a thiazole, a mercaptothiazole, a sulfenamide, a thiazolesulfenamide, a metal salt of thiocarbamate, or combinations thereof.
3 . The cure promoter composition of claim 1 , wherein the compatibilizing carrier further comprises a monomer, an oligomer, a low molecular weight poly sulfides, a low molecular weight poly thiol, a low molecular weight vinyl functional compound, an organic solvent, or combinations thereof.
4 . The cure promoter composition of claim 3 , further comprising tris (3-mercaptopropionate), 2,2′-thiodiethanethiol, 2,2′-trimethylolpropane (ethylenedioxy) diethanethiol, tris (mercaptoalkyl) cyclohexanes, or combinations thereof.
5 . The cure promoter composition of claim 1 , wherein the compatibilizing carrier further comprises allyl monosulfide, allyl disulfide, ethyl vinyl sulfide, phenyl vinyl sulfide, styrene, or combinations thereof.
6 . The cure promoter composition of claim 1 , wherein the one or more organic solvents comprise an aliphatic hydrocarbon, an aromatic compound, a ketone, an amine, an ester, an alcohol, an aldehyde, an ether, or combinations thereof.
7 . The cure promoter composition of claim 1 , further comprising:
a reducing agent comprising an amine-functional reducing agent selected from 1-methylimidazole, m-xylylenediamine, and 4,N,N-trimethyl aniline;
optionally, one or more reactive silanes;
optionally, one or more reactive organometallics;
optionally, one or more gelling agents; and
optionally, an aqueous component.
8 . The cure promoter composition of claim 1 , wherein the catalyst further comprises an amine.
9 . A cure promoter composition, comprising:
disulfiram;
pentaerythritol tetrakis (3-mercaptopropionate);
an accelerator comprising sulfur chloride;
one or more organic solvents comprising a ketone;
a catalyst comprising 1-methylimidazole;
one or more reactive silanes;
one or more reactive organometallics;
one or more gelling agents;
a catalyst, comprising an amidine; and
an aqueous component;
wherein the cure promoter composition has a shear viscosity at 25° C. of from 0.01 to 10 Pa·s; and, when brushed onto an uncured polysulfide sealant, produces a tack-free surface in less than 60 minutes at 25° C.
10 . The cure promoter composition of claim 9 , further comprising a monomer, an oligomer, a low molecular weight poly sulfides, a low molecular weight poly thiol, a low molecular weight vinyl functional compound, an organic solvent, or combinations thereof.
11 . The cure promoter composition of claim 10 , further comprising trimethylolpropane tris (3-mercaptopropionate), 2,2′-thiodiethanethiol, 2,2′-(ethylenedioxy) diethanethiol, tris (mercaptoalkyl) cyclohexanes, or combinations thereof.
12 . The cure promoter composition of claim 10 , wherein the one or more reactive silanes comprises a glycidoxypropyltrimethoxysilane.
13 . The cure promoter composition of claim 10 , wherein the one or more reactive silanes comprises a mercaptopropyltrimethoxysilane.
14 . The cure promoter composition of claim 9 , further comprising allyl monosulfide, allyl disulfide, ethyl vinyl sulfide, phenyl vinyl sulfide, styrene, or combinations thereof.
15 . A method for applying the cure promoter composition of claim 1 , the method comprising:
contacting the one or more organic solvents, the accelerator, the compatibilizing carrier, and the catalyst with one another to prepare the cure promoter composition;
homogenizing the cure promoter composition;
pausing after homogenizing to allow the cure promoter time to react;
applying a sealant, resin, paint layer, or combinations thereof onto a substrate; and
applying the cure promoter composition to a surface of the sealant, resin, paint layer, or combinations thereof.
16 . The method of claim 15 , further comprising pausing to allow the sealant, resin, paint layer, or combinations thereof to cure completely.
17 . The method of claim 15 , further comprising abrading the surface of the sealant, resin, paint layer, or combinations thereof.
18 . The method of claim 15 , further comprising:
contacting a first portion comprising the one or more organic solvents, the accelerator, and the catalyst in a first container;
contacting a second portion comprising the one or more organic solvents, the compatibilizing carrier, and the one or more reducing agents in a second container; and
contacting contents of the first container with contents of the second container prior to applying the cure promoter composition to the substrate.
19 . The method of claim 15 , wherein the substrate comprises an aluminum surface, a carbon fiber composite surface, or combinations thereof.
20 . A method for applying a cure promoter composition, comprising:
contacting one or more organic solvents comprising a ketone, an accelerator comprising disulfiram, a compatibilizing carrier, comprising pentaerythritol tetrakis (3-mercaptopropionate), one or more optional reactive silanes, one or more optional organometallics, and a catalyst comprising a diazole, comprising 1-methylimidazole, with one another to prepare a cure promoter composition having a shear viscosity at 25° C. of from 0.01 to 10 Pa·s;
homogenizing the cure promoter composition;
applying a sealant, resin, paint layer, or combinations thereof onto a substrate;
applying the cure promoter composition to a surface of the sealant, resin, paint layer, or combinations thereof;
evaporating the one or more organic solvents from the cure promoter composition; and
pausing to allow the cure promoter time to react;
wherein the composition, when brushed onto an uncured polysulfide sealant, produces a tack-free surface in less than 60 minutes at 25° C.
21 . The method of claim 20 , wherein the contacting one or more organic solvents, the accelerator, a compatibilizing carrier, one or more optional reactive silanes, and one or more optional organometallics with one another to prepare a cure promoter composition further comprises contacting one or more gelling agents.