Frequency modulation based IR sensing and imaging and related methods
View Patent ↗An IR sensor comprises a substrate, a rear reflector on the substrate, a supporting layer a PCM layer carried by the supporting layer, and first and second electrically conductive contacts carried by the substrate and coupled to opposing sides of the PCM layer. The IR sensor also includes a circuit coupled to the first and second electrically conductive contacts and configured to apply an electrical bias signal to the PCM layer to generate an electrical oscillation, and detect the frequency modulation (FM) of the oscillation signal based upon IR radiation received by the PCM layer.
1 . An infrared (IR) sensor comprising:
a substrate;
a rear reflector on the substrate;
a support layer carried by the substrate;
a phase change material (PCM) layer carried by the support layer, the rear reflector being spaced apart from the PCM layer, the PCM layer and the rear reflector defining an optical cavity therebetween;
first and second electrically conductive contacts carried by the substrate and coupled to opposing sides of the PCM layer; and
a circuit coupled to the first and second electrically conductive contacts and configured to
apply an electrical bias signal to the PCM layer to cause an oscillation signal to be generated within the PCM layer, and
detect frequency changes in the oscillation signal based upon IR radiation received by the PCM layer.
2 . The IR sensor of claim 1 wherein the circuit is configured to detect a frequency modulation (FM) of the oscillation signal based upon the IR radiation received by the PCM layer.
3 . The IR sensor of claim 1 wherein the electrical bias signal causes the PCM layer to change phase periodically.
4 . The IR sensor of claim 1 wherein the optical cavity comprises an open optical cavity.
5 . The IR sensor of claim 1 wherein the circuit is configured to detect changes in the oscillation signal based upon longwave infrared (LWIR) radiation received by the PCM layer.
6 . The IR sensor of claim 1 wherein the circuit comprises a capacitor coupled in parallel to the first and second electrically conductive contacts, and a resistor coupled in parallel to the first and second electrically conductive contacts.
7 . The IR sensor of claim 1 wherein the PCM layer comprises vanadium dioxide.
8 . The IR sensor of claim 1 wherein the substrate comprises silicon oxide; wherein the support layer comprises at least one of silicon oxide, silicon nitride, and sapphire; and wherein the first and second electrically conductive contacts each comprises chromium.
9 . A method for operating an infrared (IR) sensor comprising a substrate, a support layer carried by the substrate, a phase change material (PCM) layer carried by the support layer, a rear reflector on the substrate and being spaced apart from the PCM layer, the PCM layer and the rear reflector defining an optical cavity therebetween, and first and second electrically conductive contacts carried by the substrate and coupled to opposing sides of the PCM layer, the method comprising:
applying an electrical bias signal to the first and second electrically conductive contacts of the PCM layer to cause an oscillation signal to be generated within the PCM layer; and
detecting frequency changes in the oscillation signal based upon IR radiation received by the PCM layer.
10 . The method of claim 9 wherein the detecting of change comprises detecting a frequency modulation (FM) of the oscillation signal based upon the IR radiation received by the PCM layer.
11 . The method of claim 9 wherein the oscillation signal causes the PCM layer to change phase periodically.
12 . The method of claim 9 wherein the detecting of change comprises detecting changes in the oscillation signal based upon longwave infrared (LWIR) radiation received by the PCM layer.
13 . The method of claim 9 further comprising operating a capacitor coupled in parallel to the first and second electrically conductive contacts, and a resistor coupled in parallel to the first and second electrically conductive contacts.
14 . The method of claim 9 wherein the PCM layer comprises vanadium dioxide; wherein the substrate comprises silicon oxide; wherein the support layer comprises at least one of silicon oxide, silicon nitride, and sapphire; and wherein the first and second electrically conductive contacts each comprises chromium.
15 . A method for making an infrared (IR) sensor comprising:
forming a rear reflector on a substrate, the forming of the rear reflector comprising a deposition of metallic material on the substrate;
forming a support layer on the substrate;
forming a phase change material (PCM) layer on the support layer;
forming first and second electrically conductive contacts on the substrate and coupled to opposing sides of the PCM layer; and
coupling a circuit coupled to the first and second electrically conductive contacts, the circuit configured to
apply an electrical bias signal to the PCM layer to cause an oscillation signal to be generated within the PCM layer, and
detect frequency changes in the oscillation signal based upon IR radiation received by the PCM layer.
16 . The method of claim 15 wherein the forming of the support layer comprises a chemical vapor deposition on the substrate.
17 . The method of claim 15 wherein the forming of the PCM layer comprises a sputtering of the PCM layer.
18 . The method of claim 15 wherein the circuit is configured to detect a frequency modulation (FM) of the oscillation signal based upon the IR radiation received by the PCM layer.
19 . The method of claim 15 wherein the electrical bias signal causes the PCM layer to change phase periodically.
20 . The method of claim 15 wherein the rear reflector is spaced apart from the PCM layer, the PCM layer and the rear reflector defining an optical cavity therebetween; and wherein the optical cavity comprises an open optical cavity.