IP Library Granted Patent US 12687437
Granted Patent B2
US 12687437 · App. 18/088,611 · Granted Jul 21, 2026

Electronic device including sensor module

Inventors: Hyunguk Yoo (Suwon-si, KR); Injo Jeong (Suwon-si, KR); Jeahyuck Lee (Suwon-si, KR); Seongwook Jo (Suwon-si, KR); Younghyun Kim (Suwon-si, KR); Seungwon Lee (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
G01K1/143G01J5/06G01J5/08G01K1/16G01K13/20G01J2005/065
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Quick Facts
Patent No.
US 12687437
App. No.
18/088,611
Granted
Jul 21, 2026
Kind
B2
Abstract

An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.

Claims (37)

1 . An electronic device comprising:

a housing including a first area provided to transmit light and a sensor hole formed in the first area;

a circuit board disposed inside the housing;

a first sensor connected to the circuit board and disposed in at least a portion of the sensor hole; and

a shield member configured to block the sensor hole and prevent foreign matter from being introduced through the sensor hole,

wherein a conductive material for heat conduction is coated on an inner surface of the sensor hole.

2 . The electronic device of claim 1 , wherein the first sensor is a body temperature measurement sensor.

3 . The electronic device of claim 1 , further comprising a connector configured to connect with the first sensor and the circuit board.

4 . The electronic device of claim 1 , wherein the sensor hole comprises a first opening area connected to the exterior of the housing and a second opening area extending from the first opening area and connected to an interior of the housing,

the first sensor is disposed within the second opening area, and

the shield member is disposed in the first opening area.

5 . The electronic device of claim 4 , wherein a width of first opening area is larger than a width of the second opening area.

6 . The electronic device of claim 1 , further comprising a second sensor connected to the circuit board and disposed adjacent to the first sensor,

wherein the second sensor comprises a light-emitting element and a light-receiving element.

7 . The electronic device of claim 6 , wherein the light-emitting element and the light-receiving element are disposed to surround the first sensor.

8 . The electronic device of claim 6 , wherein the housing further comprises an auxiliary hole provided in the first area and an auxiliary shield member configured to block the auxiliary hole, and

wherein the light-emitting element is disposed in the auxiliary hole.

9 . The electronic device of claim 8 , wherein the auxiliary shield member is made of a light-transmitting material, and

wherein the shield member is made of a light-blocking material.

10 . The electronic device of claim 6 , wherein the housing comprises a second area disposed to surround the first area and configured to block light, and

the first sensor and the second sensor are disposed to overlap the first area.

11 . The electronic device of claim 10 , wherein the first area and the second area are integrally formed.

12 . An electronic device comprising:

a housing including a first area provided to transmit light and a sensor hole formed in the first area;

a circuit board disposed inside the housing;

a first sensor electrically connected to the circuit board, the first sensor disposed in at least a portion of the sensor hole;

a second sensor disposed to overlap the first area and including a light-emitting element and a light-receiving element; and

a shield member configured to block the sensor hole and prevent foreign matter from being introduced through the sensor hole,

wherein a conductive material for heat conduction is coated on an inner surface of the sensor hole.

13 . The electronic device of claim 12 , wherein the first sensor is a body temperature sensor.

14 . The electronic device of claim 12 , wherein the light-emitting element and the light-receiving element are disposed to surround the first sensor.

15 . The electronic device of claim 12 , wherein the housing further comprises a second area disposed around the first area, and

wherein the second area comprises a light-blocking material to block light incident on the light-receiving element.

16 . The electronic device of claim 12 , wherein the first area is made of at least one of glass, sapphire, plastic, or transparent ceramic.

17 . The electronic device of claim 12 , further comprising an optical film disposed adjacent to the light-emitting element.

18 . The electronic device of claim 17 , wherein the optical film comprises a light-emitting area capable of arranging to overlap the light-emitting element and a light-receiving area capable of arranging to overlap with the light-receiving element, and

wherein the light-emitting area and the light-receiving area comprise a fresnel structure.