IP Library Granted Patent US 12687445
Granted Patent B2
US 12687445 · App. 18/459,567 · Granted Jul 21, 2026

Pressure sensor package with a sensor die

Inventors: David Eric Wagner (Fremont, CA); Weijun (Davy) Xie (Shenzhen, CN); Vincent Wong (Fremont, CA)
Assignee: TE CONNECTIVITY SOLUTIONS GmbH
G01L13/026G01L19/0084
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Quick Facts
Patent No.
US 12687445
App. No.
18/459,567
Granted
Jul 21, 2026
Kind
B2
Abstract

A sensor includes a housing having a body and a plurality of ports, a plurality of diaphragms each disposed in one of the ports, and a package having a substrate and a sensor die attached to the substrate. The body has a first face, an opposite second face, and a plurality of passageways extending through the body. The ports extend from the first face of the body. The substrate is attached to the second face of the body and the sensor die is disposed in a sealed containing space defined in part by the substrate. The substrate has a plurality of substrate passageways extending through the substrate. The passageways of the body include a plurality of first passageways that communicate with the substrate passageways.

Claims (29)

1 . A sensor, comprising:

a housing having a body and a plurality of ports, the body has a first face, an opposite second face, and a plurality of passageways extending through the body, the ports extend from the first face of the body;

a plurality of diaphragms each disposed in one of the ports; and

a package having a substrate and a sensor die attached to the substrate, the substrate is attached to the second face of the body and the sensor die is disposed in a sealed containing space defined in part by the substrate, the substrate has a plurality of substrate passageways extending through the substrate, the passageways of the body include a plurality of first passageways that communicate with the substrate passageways.

2 . The sensor of claim 1 , wherein the diaphragms are coplanar with one another.

3 . The sensor of claim 1 , wherein the sensor die is positioned over one of the substrate passageways, the sensor die has a deflectable membrane.

4 . The sensor of claim 1 , wherein an oil is contained in the ports and in the sealed containing space.

5 . The sensor of claim 1 , wherein the package has a plurality of sidewalls extending from the substrate to define the sealed containing space and a gel disposed in the sealed containing space around the sensor die.

6 . The sensor of claim 1 , wherein the body has a plurality of cavities extending into the second face, the passageways of the body include a plurality of second passageways communicating with the cavities.

7 . The sensor of claim 6 , further comprising a passageway seal disposed in each of the cavities and enclosing the second passageways.

8 . The sensor of claim 1 , wherein the package has a cover attached to the substrate on a side of the substrate opposite the second face of the body, the cover and the substrate defining the sealed containing space.

9 . The sensor of claim 8 , wherein the substrate has a contact pad and a trace extending from the sensor die to the contact pad, the contact pad is disposed outside of the sealed containing space.

10 . The sensor of claim 8 , wherein the passageways of the body communicate with the ports.

11 . The sensor of claim 8 , wherein the package has an integrated circuit disposed in the sealed containing space and connected to the sensor die.

12 . A sensor, comprising:

a housing having a body and a plurality of ports, the body has a first face, an opposite second face, and a cavity extending into the second face, the ports extend from the first face of the body;

a plurality of diaphragms each disposed in one of the ports; and

a package having a substrate and a sensor die attached to the substrate, the substrate is attached to the second face of the body and the sensor die is disposed in a sealed containing space defined in part by the substrate, the substrate is attached to the second face over the cavity and the sealed containing space is defined by the substrate and the body.

13 . The sensor of claim 12 , wherein the substrate has a base and a flange extending from the base, the flange is attached to the second face of the body and the base extends into the cavity.

14 . The sensor of claim 12 , wherein the body has a passageway extending through the body and connecting one of the ports with the sealed containing space.

15 . The sensor of claim 12 , wherein the package has a plurality of pins extending through the substrate and electrically connected to the sensor die.

16 . The sensor of claim 12 , wherein the cavity is one of a plurality of cavities extending into the second face and the substrate is one of a plurality of substrates of the package, each of the substrates is attached to the second face over one of the cavities to define a plurality of sealed containing spaces.

17 . The sensor of claim 16 , further comprising a tube extending between the substrates.

18 . The sensor of claim 16 , wherein the package has a pair of sensor dies each attached to one of the substrates.

19 . The sensor of claim 18 , wherein a first sensor die of the sensor dies measures an absolute pressure in one of the sealed containing spaces and a second sensor die of the sensor dies measures a differential pressure between the sealed containing spaces.

20 . A sensor, comprising:

a housing having a body and a plurality of ports, the body has a first face and an opposite second face, the ports extend from the first face of the body;

a plurality of diaphragms each disposed in one of the ports; and

a package having a substrate and a sensor die attached to the substrate, the substrate is attached to the second face of the body and the sensor die is disposed in a sealed containing space defined in part by the substrate, the package has a plurality of sidewalls extending from the substrate to define the sealed containing space, and a gel is disposed in the sealed containing space around the sensor die.