Multi-array parallel optical links
An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.
1 . An optical interconnect, comprising:
a first IC chip having a first array of optoelectronic elements including a first sub-array of microLEDs and a first sub-array of photodetectors;
a second IC chip having a second array of optoelectronic elements including a second sub-array of microLEDs and a second sub-array of photodetectors; and
a fiber bundle including a plurality of fiber sub-bundles, each of the fiber sub-bundles comprise a plurality of fibers, each of the plurality of fibers including a core concentrically surrounded by cladding, with the first sub-array of microLEDs being optically coupled to the second sub-array of photodetectors and the second sub-array of microLEDs being optically coupled to the first sub-array of photodetectors by fiber elements of different ones of the fiber sub-bundles;
wherein fiber elements of each fiber sub-bundle are arranged on a grid;
wherein each fiber sub-bundle comprises an inner region containing the fiber elements and an outer region, the outer region having outer boundary dimensions that are independent of variations in size and position of the fiber elements of the fiber sub-bundle; and
wherein the fiber sub-bundles are accurately positioned relative to each other only near ends of the fiber bundle.
2 . The optical interconnect of claim 1 , further comprising filler material between fiber elements of each fiber sub-bundle.
3 . The optical interconnect of claim 1 , wherein the grid is a hexagonal close packed grid.
4 . The optical interconnect of claim 1 , wherein the grid is a square grid.
5 . The optical interconnect of claim 1 , wherein ends of the fiber bundle are circumferentially encased by an outer jacket.
6 . The optical interconnect of claim 5 , wherein the outer jacket includes a flat edge, allowing for determination of rotational orientation of the fiber bundle.
7 . The optical interconnect of claim 1 , wherein the fiber bundle includes at least one fiducial feature.
8 . An optical interconnect, comprising:
a first IC chip having a first plurality of sub-arrays of optoelectronic elements arranged in a first array shape;
a second IC chip having a second plurality of sub-arrays of optoelectronic elements arranged in a second array shape the same as the first array shape; and
a fiber bundle including a plurality of fiber sub-bundles, each of the fiber sub-bundles comprise a plurality of fibers, each of the plurality of fibers including a core concentrically surrounded by cladding, with optoelectronic elements of different ones of the first plurality of sub-arrays of optoelectronic elements optically coupled to optoelectronic elements of different ones of the second plurality of sub-arrays by fiber elements of different ones of the fiber sub-bundles;
wherein the plurality of fiber sub-bundles are arranged on a grid having a same shape as the first array shape and the second array shape;
wherein each fiber sub-bundle comprises an inner region containing the fiber elements and an outer region, the outer region having outer boundary dimensions that are independent of variations in size and position of the fiber elements of the fiber sub-bundle; and
wherein the fiber sub-bundles are accurately positioned relative to each other only near ends of the fiber bundle.
9 . The optical interconnect of claim 8 , wherein the first plurality of sub-arrays of optoelectronic elements comprises microLEDs and the second plurality of sub-arrays of optoelectronic elements comprises photodetectors.
10 . The optical interconnect of claim 9 , wherein the photodetectors are monolithically integrated with the second IC chip.
11 . The optical interconnect of claim 9 , wherein the microLEDs are solder-bonded to a top metal layer of the first IC chip.
12 . The optical interconnect of claim 8 , wherein the first array shape of the first plurality of sub-arrays of optoelectronic elements is square-shaped.
13 . The optical interconnect of claim 8 , wherein the first array shape of the first plurality of sub-arrays of optoelectronic elements is hexagonal-shaped.
14 . The optical interconnect of claim 9 , wherein the microLEDs and the photodetectors are arranged in a rectangular pattern.
15 . The optical interconnect of claim 9 , wherein the microLEDs and the photodetectors are arranged in a hexagonal pattern.