Irradiating module, and apparatus for treating substrate with the same

1 . A substrate treating apparatus comprising:

a support unit configured to support and rotate a substrate at a treating space;

a liquid supply unit configured to supply a liquid to the substrate supported by the support unit;

a housing having an installation space;

a laser unit configured to include

a laser in the installation space which emits a laser light in a first direction,

a reflector directing the laser light in a second direction, and

an irradiation end extending in the second direction through a bottom surface of the housing and configured to emit the laser light toward the substrate supported by the support unit; and

a cover having an inner space into which the irradiation end protrudes from the housing,

wherein the cover is connected to the bottom surface of the housing,

wherein the irradiation end is disposed in a space defined by the bottom surface of the housing and the cover, and

wherein the cover includes an opening at a bottom of the cover and the laser light emitted from the irradiation end passes through the opening of the cover.

2 . The substrate treating apparatus of claim 1 further comprising:

a purge gas supply unit for supplying a purge gas to the inner space.

3 . The substrate treating apparatus of claim 2 , further comprising:

a dividing member having a ring shape surrounding a portion of the irradiation end and dividing the inner space into a buffer space and a bottom space,

wherein the buffer space is a portion of the inner space above the dividing member and the bottom space is a portion of the inner space below the dividing member.

4 . The substrate treating apparatus of claim 3 ,

wherein the dividing member comprises:

a first slit formed at a region which is adjacent to a part at which the purge gas is supplied to in the inner space among the inner space, and which has a first opening area; and

a second slit formed at a region facing the part at which the purge gas is supplied to in the inner space among the inner space, and which has a second opening area, and

wherein the first opening area is smaller than the second opening area.

5 . The substrate treating apparatus of claim 3 ,

wherein the dividing member comprises:

a plurality of first holes formed at a region adjacent to a portion at which the purge gas is supplied to the inner space among the inner space; and

a plurality of second holes formed at a region facing the portion at which the purge gas is supplied to the inner space among the inner space, and

wherein an average diameter of the plurality of first holes is smaller than an average diameter of the plurality of second holes.

6 . The substrate treating apparatus of claim 2 , further comprising:

a purge port connected to the purge gas supply unit at an end of the housing;

a supply port connected to a side of the cover and supplying the purge gas to the inner space; and

a flow cover connected to the side of the cover, wherein a space between the flow cover and the bottom surface of the housing is a flow passage between the purge port and the supply port.

7 . The substrate treating apparatus of claim 6 ,

wherein the supply port is at a position spaced apart from a central axis of the irradiation end and connects the flow passage to the inner space.

8 . The substrate treating apparatus of claim 7 , further comprising:

a cover plate provided to cover the opening and including a transparent material through which the laser light passes.

9 . The substrate treating apparatus of claim 1 , further comprising:

an imaging unit for imaging the laser light irradiated from the laser unit,

wherein the imaging unit is positioned at the installation space.

10 . The substrate treating apparatus of claim 9 ,

wherein the laser unit further comprises:

a beam expander for controlling a characteristic of the laser light irradiated by the laser unit,

wherein the imaging unit comprises:

a camera unit configured to image an image of the laser light irradiated from the laser unit and/or the substrate; and

a lighting unit configured to provide a light for acquiring the image of the camera unit, and

wherein an irradiation direction of the laser light, an imaging direction of the camera unit, and an irradiation direction of light are aligned in the second direction.

11 . An irradiating module for irradiating a light to a substrate comprising:

a housing having an installation space;

a laser unit configured to include a laser irradiation unit positioned in the installation space which irradiates a laser light, and an irradiation end having an end positioned to protrude from the housing and which irradiates the laser light irradiated from the laser irradiation unit to the substrate; and

a cover having an inner space and positioned so an end of the irradiation end protruding from the housing is positioned in the inner space,

wherein the cover is connected to a bottom surface of the housing,

wherein the irradiation end is disposed in a space defined by the bottom surface of the housing and the cover, and

wherein an opening is formed at a bottom end of the cover to overlap the laser light irradiated from the irradiation end when seen from above.

12 . The irradiating module of claim 11 , further comprising a purge gas supply unit for supplying a purge gas to the inner space.

13 . The irradiating module of claim 12 ,

wherein a dividing member in a ring shape is installed at the inner space of the cover to divide the inner space into a buffer space which is above and a bottom space.

14 . The irradiating module of claim 13 ,

wherein the dividing member comprises:

a first slit formed at a region which is adjacent to a part at which the purge gas is supplied to in the inner space among the inner space, and which has a first opening area; and

a second slit formed at a region facing the part at which the purge gas is supplied to in the inner space among the inner space, and which has a second opening area, and

wherein the first opening area is smaller than the second opening area.

15 . The irradiating module of claim 12 , further comprising:

a purge port formed and connected to the purge gas supply unit at an end of the housing;

a supply port installed at a side of the cover which is spaced apart from a central axis of the irradiation end when seen from the front and supplying the purge gas to the inner space; and

a flow cover combined to the side of the cover to connect the purge port and the supply port and having flow space for flowing the purge gas within.

16 . The irradiating module of claim 11 , further comprising a cover plate provided to cover the opening and which is provided as a material which passes the laser light through.

17 . A substrate treating apparatus for treating a mask having a plurality of cells comprising:

a support unit configured to support and rotate the mask on which a first pattern is formed within the plurality of cells and a second pattern is formed outside a region at which the plurality of cells are formed;

a liquid supply unit configured to supply a liquid to the mask supported at the support unit;

a housing having an installation space;

a laser unit configured to include a laser irradiation unit positioned in the installation space which irradiates a laser light, and an irradiation end having an end positioned to protrude from the housing and which irradiates the laser light irradiated from the laser irradiation unit to the second pattern among the first pattern and the second pattern; and

a cover having an inner space and positioned so an end of the irradiation end protruding from the housing is positioned in the inner space,

wherein the cover is connected to a bottom surface of the housing,

wherein the irradiation end is disposed in a space defined by the bottom surface of the housing and the cover, and

wherein an opening is formed at a bottom end of the cover to overlap a laser light irradiated from the irradiation end when seen from the above.

18 . The substrate treating apparatus of claim 17 , further comprising a purge gas supply unit for supplying a purge gas to the inner space.

19 . The substrate treating apparatus of claim 18 ,

wherein a dividing member in a ring shape is installed at the inner space of the cover to divide the inner space into a buffer space which is above and a bottom space,

wherein the dividing member comprises:

a first slit formed at a region which is adjacent to a part at which the purge gas is supplied to in the inner space among the inner space, and which has a first opening area; and

a second slit formed at a region facing the part at which the purge gas is supplied to in the inner space among the inner space, and which has a second opening area, and

wherein the first opening area is smaller than the second opening area.

20 . The substrate treating apparatus of claim 18 , further comprising:

a purge port is-formed and connected to the purge gas supply unit at an end of the housing;

a supply port installed at a side of the cover which is spaced apart from a central axis of the irradiation end when seen from the front, and which supplies the purge gas to the inner space; and

a flow cover combined to the side of the cover to connect the purge port and the supply port, which has a flow space for flowing the purge gas within.