Projection device
A projection device including a casing, an operation module, a main board, and a conducting element is provided. The operation module includes an operation element and an operation circuit board. The operation element is disposed on the casing to execute a first operation. The operation circuit board is coupled to the operation element. The operation circuit board includes a wireless signal emitter and a first conducting portion. The operation circuit board generates a first operation signal in response to the first operation, and the wireless signal emitter emits the first operation signal. The main board includes a wireless signal receiver and a second conducting portion. The wireless signal receiver is configured to receive the first operation signal, and the main board is configured to execute a first action corresponding to the first operation signal. The conducting element is electrically connected to the first conducting portion and the second conducting portion.
1 . A projection device, comprising a casing, an operation module, a main board, and a conducting element, wherein
the operation module comprises an operation element and an operation circuit board;
the operation element is disposed on the casing to execute a first operation; and
the operation circuit board is disposed inside the casing and coupled to the operation element, and the operation circuit board comprises a wireless signal emitter and a first conducting portion, wherein an operation circuit on the operation circuit board is configured to generate a first operation signal in response to the first operation, and the wireless signal emitter is configured to emit the first operation signal;
the main board is disposed inside the casing, and the main board comprises a wireless signal receiver and a second conducting portion, wherein the wireless signal receiver is configured to wirelessly receive the first operation signal from the wireless signal emitter in the casing and to wirelessly receive a second operation signal from outside the casing, and a main circuit on the main board is configured to execute a first action corresponding to the first operation signal and to execute a second action corresponding to the second operation signal; and
the conducting element is electrically connected to the first conducting portion and the second conducting portion.
2 . The projection device according to claim 1 , wherein the casing comprises a light-transmitting region, the light-transmitting region is correspondingly disposed on a receiving axis of the wireless signal receiver to receive the second operation signal from outside the casing, so that the second operation signal penetrates the light-transmitting region and then enters the casing, and is received by the wireless signal receiver of the main board.
3 . The projection device according to claim 2 , further comprising a lens disposed on the casing, wherein at least a part of the lens is disposed on the light-transmitting region.
4 . The projection device according to claim 3 , further comprising at least one signal reflection surface to reflect the first operation signal emitted by the wireless signal emitter to be received by the wireless signal receiver, wherein the at least one signal reflection surface comprises at least one of an inner surface of the casing, an upper surface of the main board, a lower surface of the main board, an upper surface of the operation circuit board, a lower surface of the operation circuit board, and an inner surface of the lens.
5 . The projection device according to claim 2 , further comprising a remote control device, wherein the remote control device is configured to emit the second operation signal from outside the casing.
6 . The projection device according to claim 1 , further comprising at least one signal reflection surface to reflect the first operation signal emitted by the wireless signal emitter, wherein the first operation signal is received by the wireless signal receiver, and the at least one signal reflection surface comprises at least one of an inner surface of the casing, an upper surface of the main board, a lower surface of the main board, an upper surface of the operation circuit board, and a lower surface of the operation circuit board.
7 . The projection device according to claim 1 , wherein the conducting element is an elastic metal element.
8 . The projection device according to claim 1 , wherein the operation circuit board comprises an upper surface and a lower surface, and the wireless signal emitter of the operation circuit board is disposed on one of the upper surface or the lower surface.
9 . The projection device according to claim 1 , wherein the operation circuit board comprises a lateral surface, and the wireless signal emitter of the operation circuit board is disposed on the lateral surface.
10 . The projection device according to claim 9 , wherein the wireless signal receiver of the main board is disposed on an extension plane of the operation circuit board.
11 . The projection device according to claim 1 , wherein the first operation signal is one of an infrared (IR) signal, a visible light signal, or a Bluetooth signal.
12 . The projection device according to claim 1 , wherein the wireless signal emitter comprises an emission axis, the wireless signal receiver comprises a receiving axis, and the emission axis is not parallel to the receiving axis.
13 . The projection device according to claim 1 , wherein the wireless signal emitter comprises an emission axis, the wireless signal receiver comprises a receiving axis, and the emission axis is perpendicular to the receiving axis.
14 . The projection device according to claim 1 , wherein a configuration surface of the wireless signal emitter is disposed opposite to a configuration surface of the wireless signal receiver.
15 . The projection device according to claim 1 , wherein the wireless signal receiver comprises a receiving axis, and the receiving axis is perpendicular to a planar extending direction of the main board.
16 . The projection device according to claim 1 , wherein the second conducting portion of the main board is configured to supply power to the first conducting portion of the operation circuit board.