I/O module arrangement
An I/O module arrangement for a process control system having a first base plate for at least one I/O module, the first base plate including a first socket for a first I/O module and a first set of connection terminals for connection of the first I/O module to a first set of wires leading to a first group of field devices of the process control system, the first base plate being adapted to allow the first and any other I/O module that is attached to it to be any type of I/O module operating on input and output of any type of field device.
1 . An Input/Output, I/O, module arrangement for a process control system, the I/O module arrangement comprising:
a first base plate for at least one I/O module, the first base plate having a first socket for a first I/O module and a first set of connection terminals for connection of the first I/O module to a first set of wires leading to a first group of field devices of the process control system, the first base plate being adapted to allow the first and any other I/O module that is attached to it to be any type of I/O module operating on input and output signals of any type of field device; and
a second socket for a second I/O module and a second set of connection terminals for connection of the second I/O module to a second set of wires leading to a second group of field devices of the process control system;
wherein the first I/O module only operates on analog input signals and analog output signals and the second I/O module only operates on digital input signals and digital output signals;
wherein the first set of connection terminals is to be connected to the first group of field devices via one or more multicore cables only carrying analog input signals and analog output signals and the second set of connection terminals is to be connected to the second group of field devices using one or more multicore cables only carrying digital input signals and digital output signals.
2 . The I/O module arrangement according to claim 1 , wherein the number of connection terminals in the first set corresponds to the number of field device connections that can be made to an I/O module.
3 . The I/O module arrangement according to claim 1 , wherein the connection terminals in the first set comprise three or more connection terminals per connectable field device.
4 . The I/O module arrangement according to claim 1 , wherein the first socket has connection terminals for mating with corresponding connection terminals of the first I/O module and the connection terminals of the first set of connection terminals are interconnected with connection terminals of the first socket by conductors running in the first base plate and the distance between the connection terminals of the first set of connection terminals, the distance between the conductors and the distance between the connection terminals of the first socket are based on the creepage and clearance distances associated with a signal voltage level of the input and output signals.
5 . The I/O module arrangement according to claim 1 , wherein the first I/O module operates on input and output signals of the first set of wires that have a first voltage level and the second I/O module operates on input and output signals of the second set of wires that have a second voltage level.
6 . The I/O module arrangement according to claim 1 , wherein first I/O module and/or the second I/O module is capable of operating on more than one voltage level.
7 . The I/O module arrangement according to claim 1 , further comprising a signal bridge for interconnecting one set of connection terminals associated with a socket for one I/O module with another set of connection terminals associated with another socket for another I/O module.
8 . The I/O module arrangement according to claim 1 , wherein the first base plate has a rectangular shape and the first set of connection terminals are provided along a first side of the first base plate.
9 . The I/O module arrangement according to claim 1 , wherein the first base plate has a rectangular shape and the first set of connection terminals are provided along a first side of the first base plate.
10 . The I/O module arrangement according to claim 9 , further comprising a second base plate and wherein the second socket and the second set of connection terminals are provided on the second base plate.
11 . The I/O module arrangement according to claim 9 , wherein the second set of connection terminals are provided on the first base plate along the first side.
12 . The I/O module arrangement according to claim 9 , wherein the second set of connection terminals are provided on the first base plate along a second side of the first base plate opposite of the first side.
13 . The I/O module arrangement according to claim 12 , wherein the first base plate has a horizontal orientation when being mounted in a mounting cabinet and one of the first and second sides is directed upwards and the other downwards.
14 . The I/O module arrangement according to claim 12 , wherein the first base plate has a vertical orientation when being mounted in a mounting cabinet and one of the first and second sides is provided on a left side and the other on a right side of the base plate.
15 . The I/O module arrangement according to claim 1 , wherein the first I/O module comprises AI RTD/TC, AI mA, AO mA, AI V, AO V, DI 24V to 230V, DO 24V to 230V, or HART.
16 . The I/O module arrangement according to claim 1 , wherein the first group of field devices comprises at least one of a 2-wire field device, a 3-wire field device, a 4-wire field device, a sink field device, or a source field device.