Substrate inspecting unit and substrate treating apparatus including the same

1 . An apparatus for processing a substrate comprising:

a process processing unit for supporting a substrate;

an inkjet head unit for discharging a droplet on the substrate while moving in a first direction and a second direction;

a gantry unit for moving the inkjet head unit; and

a substrate inspecting unit for inspecting the substrate in real time based on a plurality of droplets belonging to at least one row or column when the droplet is discharged onto the substrate and formed in the at least one row or column,

wherein the substrate inspecting unit inspects a first defect related to a line caused by the plurality of droplets and/or a second defect related to an area caused by the plurality of droplets,

wherein the substrate inspecting unit is configured to process an image related to the plurality of droplets based on a grey scale and inspect the first defect and/or the second defect based on the grey scaled image related to the plurality of droplets, and

wherein the substrate inspecting unit is configured to inspect the second defect related to an area caused by the plurality of droplets based on a distance between two different droplets aligned on a column.

2 . The apparatus of claim 1 , wherein the substrate inspecting unit inspects the first defect and/or the second defect based on an image obtained according to a swath operation of the inkjet head unit.

3 . The apparatus of claim 2 , wherein the substrate inspecting unit combines a plurality of partial images obtained according to a swath operation of the inkjet head unit, and then inspects the first defect and/or the second defect based on the combined image, or inspects the first defect and/or the second defect based on each partial image.

4 . The apparatus of claim 1 , wherein, when inspecting the first defect, the substrate inspecting unit inspects the first defect based on whether a plurality of droplets belonging to one row or column are located on the same line.

5 . The apparatus of claim 1 , wherein, when inspecting the second defect, the substrate inspecting unit inspects the second defect based on whether a plurality of droplets belonging to at least one row maintain the same distance, or inspects the second defect based on whether a plurality of droplets belonging to at least one column maintain the same distance.

6 . The apparatus of claim 5 , wherein a distance between two different droplets belonging to one row is different from a distance between two different droplets belonging to one column.

7 . The apparatus of claim 1 , wherein, when inspecting the second defect, the substrate inspecting unit inspects the second defect based on whether a plurality of droplets belonging to at least one row and at least one column maintain the same distance.

8 . The apparatus of claim 7 , wherein a distance between two different droplets belonging to one row is the same as a distance between two different droplets belonging to one column.

9 . The apparatus of claim 1 further comprises,

a camera module for obtaining an image related to the plurality of droplets,

wherein the substrate inspecting unit inspects the first defect and/or the second defect based on an image obtained by a camera module.

10 . The apparatus of claim 9 , wherein the camera module is installed in the gantry unit.

11 . The apparatus of claim 10 , wherein the camera module is disposed behind the inkjet head unit or disposed in parallel with the inkjet head unit along a longitudinal direction of the gantry unit.

12 . The apparatus of claim 9 , wherein the camera module includes a line scan camera and an area scan camera.

13 . The apparatus of claim 12 , wherein the substrate inspecting unit inspects the first defect based on an image obtained using the line scan camera, and inspects the second defect based on an image obtained using the area scan camera.

14 . An apparatus for processing a substrate comprising:

a process processing unit for supporting a substrate;

an inkjet head unit for discharging a droplet on the substrate while moving in a first direction and a second direction;

a gantry unit for moving the inkjet head unit; and

a substrate inspecting unit for inspecting the substrate in real time based on a plurality of droplets belonging to at least one row or column when the droplet is discharged onto the substrate and formed in the at least one row or column,

wherein the substrate inspecting unit inspects a first defect related to a line caused by the plurality of droplets and/or a second defect related to an area caused by the plurality of droplets based on an image related to the plurality of droplets and obtained according to a swath operation of the inkjet head unit,

wherein the substrate inspecting unit processes the image related to the plurality of droplets based on a grey scale, and then inspects the first defect and/or the second defect based on the grey scaled image,

wherein, when inspecting the first defect, the substrate inspecting unit inspects the first defect based on whether a plurality of droplets belonging to one row or column are located on the same line,

wherein, when inspecting the second defect, the substrate inspecting unit inspects the second defect based on whether a plurality of droplets belonging to at least one row and/or a plurality of droplets belonging to at least one column maintain the same distance, and

wherein the substrate inspecting unit is configured to inspect the second defect related to an area caused by the plurality of droplets based on a distance between two different droplets aligned on a column.

15 . A unit for inspecting a substrate,

wherein the substrate inspecting unit is provided in a substrate processing apparatus for processing the substrate by discharging a droplet on a substrate using an inkjet head unit,

wherein, when the droplet is discharged onto the substrate and formed in at least one row or column, the substrate inspecting unit inspects the substrate in real time based on a plurality of droplets belonging to the at least one row or column,

wherein the substrate inspecting unit inspects a first defect related to a line caused by the plurality of droplets and/or a second defect related to an area caused by the plurality of droplets based on an image related to the plurality of droplets, and

wherein the substrate inspecting unit is configured to process an image related to the plurality of droplets based on a grey scale and inspect the first defect and/or the second defect based on the grey scaled image related to the plurality of droplets, and

wherein the substrate inspecting unit is configured to inspect the second defect related to an area caused by the plurality of droplets based on a distance between two different droplets aligned on a column.

16 . The unit of claim 15 , wherein the substrate inspecting unit inspects the first defect and/or the second defect based on an image obtained according to a swath operation of the inkjet head unit.

17 . The unit of claim 16 , wherein the substrate inspecting unit combines a plurality of partial images obtained according to a swath operation of the inkjet head unit, and then inspects the first defect and/or the second defect based on the combined image, or inspects the first defect and/or the second defect based on each partial image.