Semiconductor memory device and method of operating the same

1 . A semiconductor memory device comprising:

a first page including first memory cells, each storing N bits;

a second page including second memory cells, each storing N−1 bits;

a third page Including third memory cells, each storing N−2 bits;

a peripheral circuit configured to perform a first program operation that results in a threshold voltage of each of the first memory cells to be included in any one of 2 N states, configured to perform a second program operation that results in a threshold voltage of each of the second memory cells to be included in any one of 2 N−1 states, and configured to perform a third program operation that results in a threshold voltage of each of the third memory cells to be included in any one of 2 N−2 states; and

a control logic configured to control the first and second program operations through the peripheral circuit,

wherein the control logic is configured to control the peripheral circuit to perform the second program operation by using at least one, but not all, of a plurality of verify voltages that are used in the first program operation, and

wherein, during the first program operation, the control logic Is configured to control the peripheral circuit to program the first memory cells by using first to (2 N −1)-th verify voltages such that the threshold voltage of each of the first memory cells belongs to any one of an erased state and first to (2 N −1)-th program states,

wherein the control logic is configured to control the peripheral circuit to perform the third program operation by using at least one, but not all, of the plurality of verify voltages that are used in the first program operation,

wherein N is a natural number greater than or equal to 3.

2 . The semiconductor memory device according to claim 1 , wherein during the second program operation, the control logic is configured to:

select 2 N−1 states in which a K-th bit, among first to N-th bits that are stored in each of the first memory cells, is 1 from among the erased state and the first to (2 N −1)-th program states,

select (2 N−1 −1) verify voltages, respectively corresponding to upper (2 N−1 −1) states, among the selected 2 N−1 states, from among the first to (2 N −1)-th verify voltages that are used in the first program operation, and

control the peripheral circuit to perform the second program operation by using the selected (2 N−1 −1) verify voltages,

wherein K is a natural number that is greater than or equal to 1 and less than or equal to N.

3 . The semiconductor memory device according to claim 2 , wherein the control logic is configured to control the peripheral circuit to perform a read operation on the first page by using first to (2 N −1)-th read voltages.

4 . The semiconductor memory device according to claim 3 , wherein the control logic is configured to:

select (2 N−1 −1) read voltages from among the first to (2 N −1)-th read voltages, and

control the peripheral circuit to perform a read operation on the second page by using the selected (2 N−1 −1) read voltages.

5 . The semiconductor memory device according to claim 1 , wherein, during the second program operation, the control logic is configured to:

select 2 N−1 states in which a K-th bit, among first to N-th bits that are stored in each of the first memory cells, is 0 from among the erased state and the first to (2 N −1)-th program states,

select (2 N−1 −1) verify voltages, respectively corresponding to upper (2 N−1 −1) states, among the selected 2 N−1 states, from among the first to (2 N −1)-th verify voltages that are used in the first program operation, and

control the peripheral circuit to perform the second program operation by using the selected (2 N−1 −1) verify voltages,

wherein K is a natural number that is greater than or equal to 1 and less than or equal to N.

6 . The semiconductor memory device according to claim 1 , wherein during the third program operation, the control logic is configured to:

select 2 N−2 states in which an H-th bit and a K-th bit, among first to N-th bits that are stored in each of the first memory cells, are 1 from among the erased state and first to (2 N −1)-th program states,

select (2 N−2 −1) verify voltages, respectively corresponding to upper (2 N−2 −1) states, among the selected 2 N−2 states, from among the first to (2 N −1)-th verify voltages, and

control the peripheral circuit to perform the third program operation by using the selected (2 N−2 −1) verify voltages,

wherein H is a natural number that is greater than or equal to 1 and less than or equal to N, and

wherein K is a number that is different from H, among natural numbers that are greater than or equal to 1 and less than or equal to N.

7 . The semiconductor memory device according to claim 6 , wherein the control logic is configured to:

control the peripheral circuit to perform a read operation on the first page by using first to (2 N −1)-th read voltages,

select (2 N−2 −1) read voltages from among the first to (2 N −1)-th read voltages, and

control the peripheral circuit to perform a read operation on the third page by using the selected (2 N−2 −1) read voltages.

8 . The semiconductor memory device according to claim 1 , wherein, during the second program operation, the control logic is configured to:

select 2 N−2 states in which in which a H-th bit and a K-th bit, among first to N-th bits that are stored in each of the first memory cells, are 0 from among the erased state and the first to (2 N −1)-th program states,

select (2 N−2 −1) verify voltages, respectively corresponding to upper (2 N−2 −1) states, among the selected 2 N−2 states, from among the first to (2 N −1)-th verify voltages, and

control the peripheral circuit to perform the third program operation by using the selected (2 N−2 −1) verify voltages,

wherein H is a natural number that is greater than or equal to 1 and less than or equal to N, and

wherein K is a number that is different from H, among natural numbers that are greater than or equal to 1 and less than or equal to N.

9 . A method of operating a semiconductor memory device, the method comprising:

performing a first program operation on a first page including first memory cells, each storing N bits; and

performing a second program operation on a second page including second memory cells, each storing N-M bits, using at least one, but not all, of a plurality of verify voltages that are used in the first program operation,

wherein performing the first program operation comprises programming the first memory cells by using first to (2 N −1)-th verify voltages such that a threshold voltage of each of the first memory cells is included in any one of an erased state and first to (2 N −1)-th program states, and

wherein M is 2, and performing the second program operation comprises:

selecting 2 N−2 states in which an H-th bit and a K-th bit, among first to N-th bits that are stored in each of the first memory cells, are 1 from among the erased state and first to (2 N -1)-th program states;

selecting (2 N−2 −1) verify voltages, respectively corresponding to upper (2 N−2 −1) states, among the selected 2 N−2 states, from among the first to (2 N−1 )-th verify voltages that are used in the first program operation; and

performing a program operation on the second memory cells by using the selected (2 N−2 −1) verify voltages such that a threshold voltage of each of the second memory cells is included in any one of the 2 N−2 states,

wherein H is a natural number that is greater than or equal to 1 and less than or equal to N, and

wherein K is a number that is different from H, among natural numbers that are greater than or equal to 1 and less than or equal to N.

10 . A method of operating a semiconductor memory device, comprising:

performing a first program operation on a first page including first memory cells, each storing N bits; and

performing a second program operation on a second page including second memory cells, each storing N-M bits, using at least one, but not all, of a plurality of verify voltages that are used in the first program operation,

wherein N is a natural number greater than or equal to 2,

wherein performing the first program operation comprises programming the first memory cells by using first to (2 N −1)-th verify voltages such that a threshold voltage of each of the first memory cells is included in any one of an erased state and first to (2 N −1)-th program states,

wherein M is 2, and performing the second program operation comprises:

selecting 2 N−2 states in which an H-th bit and a K-th bit, among first to N-th bits that are stored in each of the first memory cells, are 0 from among the erased state and first to (2 N −1)-th program states;

selecting (2 N−2 −1) verify voltages, respectively corresponding to upper (2 N−2 −1) states, among the selected 2 N−2 states, from among the first to (2 N −1)-th verify voltages that are used in the first program operation; and

performing a program operation on the second memory cells by using the selected (2 N−2 −1) verify voltages such that a threshold voltage of each of the second memory cells is included in any one of the 2 N−2 states;

wherein H is a natural number that is greater than or equal to 1 and less than or equal to N; and

wherein K is a number different from H, among natural numbers that are greater than or equal to 1 and less than or equal to N.