IP Library Granted Patent US 12688967
Granted Patent B2
US 12688967 · App. 17/644,340 · Granted Jul 21, 2026

Inductor device

Inventor: Hsiao-Tsung Yen (Hsinchu, TW)
Assignee: Realtek Semiconductor Corporation
H01F27/40H01F27/28
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Quick Facts
Patent No.
US 12688967
App. No.
17/644,340
Granted
Jul 21, 2026
Kind
B2
Abstract

An inductor device includes an inductor element, a substrate and a ground plane is disclosed. The ground plane includes several sub ground planes. The inductor element is set above the substrate, and the substrate is set above the ground plane. When at least one of several connection relationships between the several sub ground planes change, an inductance value of the inductor element changes.

Claims (31)

1 . An inductor device, comprising:

an inductor element;

a substrate;

a ground plane, comprising a plurality of sub ground planes, wherein the inductor element is set above the substrate, and the substrate is set above the ground plane; and

at least one first switch, connected between the plurality of sub ground planes,

wherein an inductance value of the inductor element changes according to whether at least one of a plurality of connection relationships between the sub ground planes changes from connected to disconnected or from disconnected to connected,

wherein the at least one first switch is configured to control the plurality of connection relationships between the plurality of sub ground plane.

2 . The inductor device of claim 1 , wherein the plurality of sub ground planes comprise a first sub ground plane and a second sub ground plane, wherein between the first sub ground plane and the second sub ground plane comprises a third switch of the at least one first switch, and between the first sub ground plane and the second sub ground plane comprises a first connection relationship of the plurality of connection relationships, wherein when the third switch is conducted, the first connection relationship is connected, and when the third switch is not conducted, the first connection relationship is not connected.

3 . The inductor device of claim 2 , wherein the third switch comprises:

a first sub switch, connected to the first sub ground plane; and

a second sub switch, connected to the second sub ground plane.

4 . The inductor device of claim 3 , wherein when the first sub switch and the second sub switch are conducted, the third switch is conducted; wherein when the first sub switch and the second sub switch are not conducted, the third switch is not conducted.

5 . The inductor device of claim 1 , further comprising:

at least one second switch, configured to control the ground plane to be either grounded or floated,

wherein the inductance value of the inductor element differs depending on whether the ground plane is grounded or floated.

6 . The inductor device of claim 5 , wherein the plurality of sub ground planes comprise a first sub ground plane, the at least one second switch comprises a fourth switch, and the first sub ground plane and the fourth switch are connected, wherein when the fourth switch is conducted, the first sub ground plane is grounded, and when the fourth switch is not conducted, the first sub ground plane is floated.

7 . The inductor device of claim 1 , further comprising:

a through silicon via (TSV), connected to the substrate and the ground plane, and is perpendicular to the ground plane.

8 . The inductor device of claim 1 , further comprising:

a through silicon via, connected to the substrate and one of the plurality of sub ground planes, and perpendicular to the one of the plurality of sub ground planes.

9 . The inductor device of claim 8 , wherein when the ground plane is directly grounded and the inductor element and the substrate are connected to the ground plane through the through silicon via, the inductor element and the substrate are grounded, and when the ground plane is directly grounded but the inductor element and the substrate are not connected to the ground plane through the through silicon via, the inductor element and the substrate are not grounded.

10 . The inductor device of claim 1 , wherein the plurality of sub ground planes comprise a first sub ground plane and a second sub ground plane, and between the first sub ground plane and the second sub ground plane comprises an opening.

11 . The inductor device of claim 10 , wherein the inductor element is set above the opening, and the inductor element partially overlaps with the opening.

12 . The inductor device of claim 1 , further comprising: at least one second switch, connected to at least one of the plurality of sub ground planes, configured to control a grounding relationship of the ground plane.

13 . The inductor device of claim 12 , wherein the substrate is set at a first side of the ground plane, and the at least one first switch is set at a second side of the ground plane, wherein one switch of the at least one first switch is vertically aligned with or under the substrate, while another switch of the at least one first switch is vertically offset from or not under the substrate.

14 . The inductor device of claim 12 , wherein when a conducting state of one of the at least one first switch and the at least one second switch changes, the inductance value of the inductor element changes,

wherein the inductance value of the inductor element differs depending on whether the sub ground planes are connected through the at least one first switch; and

wherein the inductance value of the inductor element varies when the at least one second switch changes a grounding relationship of at least one of the sub ground planes.

15 . The inductor device of claim 12 , wherein when the inductor element is a single ended inductor element, the inductance value of the inductor element changes when a conducting state of one of the at least one first switch and the at least one second switch changes,

wherein the inductance value of the inductor element differs depending on whether the sub ground planes are connected through the at least one first switch; and

wherein the inductance value of the inductor element varies when the at least one second switch changes a grounding relationship of at least one of the sub ground planes.