Press-fit connector and receptacle
A semiconductor device includes an electronics carrier, an electrically conductive receptacle attached to a first pad of the electronics carrier, and an electrically conductive press-fit connector including a flange and a base portion extending from the flange to a first end of the press-fit connector, wherein the press-fit connector is in a secured position whereby the base portion is disposed within and securely retained by the receptacle, and wherein the base portion of the press-fit connector is configured to maintain vertical separation between the flange and an upper end of the receptacle in the secured position.
1 . A semiconductor device assembly, comprising:
an electronics carrier;
an electrically conductive receptacle attached to a first pad of the electronics carrier; and
an electrically conductive press-fit connector comprising a flange, a base portion extending from the flange to a first end of the press-fit connector, and a second end opposite from the first end;
wherein the press-fit connector is in a secured position whereby the base portion is disposed within and securely retained by the receptacle, and
wherein the base portion of the press-fit connector is configured to maintain vertical separation between the flange and an upper end of the receptacle in the secured position,
wherein in the secured position the second end of the electrically conductive press-fit connector is exposed.
2 . The semiconductor device assembly of claim 1 , wherein the electronics carrier comprises a structured metallization layer, and wherein the structured metallization layer comprises the first pad.
3 . The semiconductor device assembly of claim 1 , wherein the electronics carrier comprises an electrically conductive lead frame, the lead frame further comprising the first pad.
4 . The semiconductor device assembly of claim 1 , wherein the receptacle comprises a sleeve mechanically and electrically connected to an upper surface of the first pad, and wherein the base portion of the press-fit connector is configured to maintain the vertical separation by a friction fit with the sleeve.
5 . The semiconductor device assembly of claim 4 , wherein the base portion has a first diameter, and wherein the first diameter is equal to or greater than a minimum diameter of the sleeve.
6 . The semiconductor device assembly of claim 4 , wherein the receptacle has a cylindrical cross-sectional geometry, and wherein the base portion has a polygonal cross-sectional geometry, and wherein edges of the base portion engage with the sleeve to provide the friction fit.
7 . The semiconductor device assembly of claim 1 , wherein the vertical separation distance between the flange and the upper end of the receptacle in the secured position is between 50 μum and 500 μm.
8 . The semiconductor device assembly of claim 7 , wherein the vertical separation distance between the flange and the upper end of the receptacle in the secured position is between 200 μm and 300 μm.
9 . The semiconductor device assembly of claim 1 , wherein a ratio between the vertical separation distance and the overall height of the receptacle is between 1:100 and 1:5.
10 . The semiconductor device assembly of claim 9 , wherein the ratio between the vertical separation distance and the overall height of the receptacle is between 2:25 and 3:25.
11 . The semiconductor device assembly of claim 1 , further comprising a first semiconductor die mounted on the electronics carrier, wherein the press-fit connector is electrically connected to a terminal of the first semiconductor die via the receptacle and the first pad of the structured metallization layer.
12 . The semiconductor device assembly of claim 11 , wherein the first semiconductor die is a power device, and wherein the electronics carrier is any one of: a DCB substrate, an IMS substrate, or an AMB substrate.
13 . The semiconductor device assembly of claim 1 , wherein the press-fit connector comprises a mating feature disposed at the second end of the press-fit connector.
14 . The semiconductor device assembly of claim 13 , wherein the mating feature is a spring-loaded contact mechanism.
15 . An electronics carrier interconnection system, comprising:
an electrically conductive receptacle that is configured to be affixed to an electronics carrier;
an electrically conductive press-fit connector comprising a flange and a base portion extending from the flange to a first end of the press-fit connector;
wherein the press-fit connector is configured to be mechanically and electrically connected to the receptacle in a secured position whereby the base portion is disposed within and securely retained by the receptacle,
wherein the base portion of the press-fit connector is configured to maintain vertical separation between the flange and an upper end of the receptacle in the secured position, and
wherein in the secured position the second end of the electrically conductive press-fit connector is exposed.
16 . The electronics carrier interconnection system of claim 15 , wherein the base portion that has a first diameter, and wherein the first diameter is equal to or greater than a minimum diameter of the sleeve.
17 . The electronics carrier interconnection system of claim 15 , wherein the receptacle has a cylindrical cross-sectional geometry, and wherein the base portion has a polygonal cross-sectional geometry, and wherein edges of the base portion engage with the sleeve to provide the friction fit.
18 . The electronics carrier interconnection system of claim 15 , wherein the vertical separation distance between the flange and the upper end of the receptacle in the secured position is between 50 μm and 500 μm.
19 . The electronics carrier interconnection system of claim 15 , wherein the press-fit connector comprises a mating feature disposed at the second end of the press-fit connector.
20 . The electronics carrier interconnection system of claim 19 , wherein the mating feature is a spring-loaded contact mechanism.