IP Library Granted Patent US 12689207
Granted Patent B2
US 12689207 · App. 18/697,884 · Granted Jul 21, 2026

Power supply control apparatus

Inventors: Ryosuke Masuda (Yokkaichi, JP); Masayuki Kato (Yokkaichi, JP); Takeo Uchino (Yokkaichi, JP)
Assignees: AutoNetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd.
H02H5/047H02H1/0007H02H1/0092
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Quick Facts
Patent No.
US 12689207
App. No.
18/697,884
Granted
Jul 21, 2026
Kind
B2
Abstract

A power supply control apparatus controls the supplying of power through a wire. A fuse and a semiconductor switch are disposed on a current path of a wire current that flows through the wire. The fuse and the semiconductor switch are attached to a circuit board. A plurality of terminals of the fuse are connected by solder to the circuit board. A fusing portion is connected between two terminals out of the plurality of terminals. The two terminals are disposed on the current path of the wire current. The fusing portion blows according to the temperature of the fusing portion. A microcomputer issues an instruction to switch off the semiconductor switch according to the wire temperature of the wire.

Claims (28)

1 . A power supply control apparatus that controls supplying of power through a wire, the power supply control apparatus comprising:

a fuse and a semiconductor switch disposed on a current path of a wire current that flows through the wire;

a circuit board to which the fuse and the semiconductor switch are attached; and

a processing unit for executing processing,

wherein the fuse includes:

a plurality of terminals that are connected to the circuit board by solder; and

a fusing portion connected between two terminals out of the plurality of terminals, the two terminals out of the plurality of terminals are disposed on the current path, the fusing portion blows according to a temperature of the fusing portion, and the processing unit issues an instruction to switch off the semiconductor switch according to a wire temperature of the wire.

2 . The power supply control apparatus according to claim 1 , wherein the processing unit issues the instruction to switch off the semiconductor switch when the wire temperature has become a temperature threshold or higher, and

when the semiconductor switch is on, the wire temperature reaches the temperature threshold or higher before the fusing portion blows.

3 . The power supply control apparatus according to claim 1 , wherein the fuse includes a housing that covers part of the plurality of terminals and the fusing portion, and

the housing is resistant to a temperature of 300 degrees Celsius or higher.

4 . The power supply control apparatus according to claim 1 , wherein the circuit board includes:

an insulating board;

a plurality of through holes that pass through the insulating board, and

a plurality of pieces of board plating that cover the insulating board;

the plurality of terminals of the fuse are inserted into a plurality of through holes, and are connected by the solder to the plurality of pieces of board plating on the circuit board.

5 . The power supply control apparatus according to claim 1 , wherein the plurality of terminals each include:

a metal body; and

terminal plating that is made of tin and covers a surface of the metal body.

6 . The power supply control apparatus according to claim 1 , further comprising a switching circuit for switching the semiconductor switch on or off,

wherein the switching circuit switches the semiconductor switch off when a voltage across both ends of the fusing portion of the fuse has reached a predetermined temperature or higher.

7 . The power supply control apparatus according to claim 1 , wherein the processing unit repeatedly calculates the wire temperature based on a voltage value across both ends of the fusing portion of the fuse.

8 . The power supply control apparatus according to claim 1 , wherein the fuse includes a housing that covers a part of the plurality of terminals and the fusing portion, and

each of the plurality of terminals includes a first plate part in a shape of a long plate that is partially covered by the housing and a second plate part connected to the first plate part, and wherein for each of the plurality of terminals,

one end of the first plate part protrudes from a same one face of the housing,

the second plate part protrudes from a part of a front end face of the first plate part that protrudes from the housing,

the circuit board includes a plurality of through holes, the second plate parts of the plurality of terminals are inserted into the plurality of through holes, and

the first plate parts of the plurality of terminals contact the circuit board.