IP Library Granted Patent US 12689352
Granted Patent B2
US 12689352 · App. 18/435,564 · Granted Jul 21, 2026

Acoustic wave device, filter, and multiplexer

Inventors: Koichi Sato (Tokyo, JP); Shinji Yamamoto (Tokyo, JP)
Assignee: TAIYO YUDEN CO., LTD.
H03H9/13H03H9/05H03H9/15H03H9/568H03H9/70
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Quick Facts
Patent No.
US 12689352
App. No.
18/435,564
Filed
Feb 7, 2024
Granted
Jul 21, 2026
Kind
B2
Art Unit
2843
USPC
333/186
Abstract

An acoustic wave device includes a support substrate, a piezoelectric layer provided on the support substrate, at least one pair of comb-shaped electrodes provided on the piezoelectric layer, the at least one pair of comb-shaped electrodes including a plurality of electrode fingers, a first intermediate layer provided between the support substrate and the piezoelectric layer, a second intermediate layer provided between the support substrate and the first intermediate layer, the second intermediate layer having a porosity higher than a porosity of the first intermediate layer, and a third intermediate layer provided between the support substrate and the second intermediate layer, the third intermediate layer having a porosity lower than the porosity of the second intermediate layer.

Claims (34)

1 . An acoustic wave device comprising:

a support substrate;

a piezoelectric layer provided on the support substrate;

at least one pair of comb-shaped electrodes provided on the piezoelectric layer, the at least one pair of comb-shaped electrodes including a plurality of electrode fingers;

a first intermediate layer provided between the support substrate and the piezoelectric layer;

a second intermediate layer provided between the support substrate and the first intermediate layer, the second intermediate layer having a porosity higher than a porosity of the first intermediate layer; and

a third intermediate layer provided between the support substrate and the second intermediate layer, the third intermediate layer having a porosity lower than the porosity of the second intermediate layer.

2 . The acoustic wave device according to claim 1 ,

wherein the first intermediate layer has a porosity of 3% or less,

wherein the second intermediate layer has a porosity of 5% or greater, and

wherein a porosity of the third intermediate layer is 3% or less.

3 . The acoustic wave device according to claim 1 , wherein the second intermediate layer and the third intermediate layer are made of the same material.

4 . The acoustic wave device according to claim 1 , wherein the third intermediate layer has a thickness of 15 nm or greater and 1500 nm or less.

5 . The acoustic wave device according to claim 1 , wherein the third intermediate layer is provided between the second intermediate layer and the first intermediate layer and on a side surface of the second intermediate layer.

6 . The acoustic wave device according to claim 1 , wherein the first intermediate layer includes: a fourth intermediate layer that is a silicon oxide film; and a fifth intermediate layer that is provided between the silicon oxide film and the second intermediate layer and is an aluminum oxide film, an aluminum nitride film, an aluminum oxynitride film, a silicon nitride film, or a silicon carbide film.

7 . The acoustic wave device according to claim 6 , wherein the piezoelectric layer is a monocrystalline lithium tantalate substrate or a monocrystalline lithium niobate substrate.

8 . The acoustic wave device according to claim 1 , wherein a thickness of the piezoelectric layer is equal to or less than two times an average pitch of the plurality of electrode fingers.

9 . A filter comprising the acoustic wave device according to claim 1 .

10 . A multiplexer comprising the filter according to claim 9 .

11 . An acoustic wave device comprising:

a support substrate;

a piezoelectric layer provided on the support substrate;

at least one pair of comb-shaped electrodes provided on the piezoelectric layer, the at least one pair of comb-shaped electrodes including a plurality of electrode fingers;

a first intermediate layer provided between the support substrate and the piezoelectric layer;

a second intermediate layer provided between the support substrate and the first intermediate layer, the second intermediate layer having a Q factor smaller than a Q factor of the first intermediate layer; and

a third intermediate layer provided between the support substrate and the second intermediate layer, the third intermediate layer having a Q factor larger than the Q factor of the second intermediate layer.

12 . The acoustic wave device according to claim 11 , wherein the second intermediate layer and the third intermediate layer are made of the same material.

13 . The acoustic wave device according to claim 11 , wherein the third intermediate layer has a thickness of 15 nm or greater and 1500 nm or less.

14 . The acoustic wave device according to claim 11 , wherein the third intermediate layer is provided between the second intermediate layer and the first intermediate layer and on a side surface of the second intermediate layer.

15 . The acoustic wave device according to claim 11 , wherein the first intermediate layer includes: a fourth intermediate layer that is a silicon oxide film; and a fifth intermediate layer that is provided between the silicon oxide film and the second intermediate layer and is an aluminum oxide film, an aluminum nitride film, an aluminum oxynitride film, a silicon nitride film, or a silicon carbide film.

16 . The acoustic wave device according to claim 15 , wherein the piezoelectric layer is a monocrystalline lithium tantalate substrate or a monocrystalline lithium niobate substrate.

17 . The acoustic wave device according to claim 11 , wherein a thickness of the piezoelectric layer is equal to or less than two times an average pitch of the plurality of electrode fingers.

18 . A filter comprising the acoustic wave device according to claim 11 .

19 . A multiplexer comprising the filter according to claim 18 .