Radio-frequency module
A radio-frequency module includes: a module substrate; multiple external connection terminals that are arranged on a main surface of the module substrate; an integrated circuit that is arranged on a main surface of the module substrate; a shield layer that is arranged above the main surface of the integrated circuit; and a metal member that is arranged between the main surface of the integrated circuit and the shield layer. The integrated circuit includes transistors arranged on the main surface and constituting a power amplifier and via conductors connecting the transistors to the metal member. The metal member at least partially overlaps the via conductors and at least partially overlaps the shield layer in a plan view of the module substrate.
1 . A radio-frequency module comprising:
a module substrate that includes a first main surface and a second main surface that are opposite to each other;
multiple external connection terminals that are arranged on the second main surface of the module substrate;
a first integrated circuit that is arranged on the first main surface of the module substrate and includes a third main surface facing the first main surface and a fourth main surface opposite to the third main surface;
a shield layer that is arranged above the fourth main surface of the first integrated circuit; and
a first metal member that is arranged between the fourth main surface of the first integrated circuit and the shield layer, wherein
the first integrated circuit includes
a first transistor arranged on the third main surface and constituting a first power amplifier and
at least one via conductor connecting the first transistor to the first metal member, and
the first metal member at least partially overlaps the at least one via conductor and at least partially overlaps the shield layer in a plan view of the module substrate.
2 . The radio-frequency module according to claim 1 , further comprising:
a bonding layer that bonds the first metal member to the fourth main surface of the first integrated circuit.
3 . The radio-frequency module according to claim 2 , wherein
the first metal member is bonded to the shield layer.
4 . The radio-frequency module according to claim 2 , wherein
the first metal member includes
a first portion that covers at least a portion of the fourth main surface of the first integrated circuit, and
a second portion that covers at least a portion of a side surface of the first integrated circuit and connects the first portion to the first main surface of the module substrate.
5 . The radio-frequency module according to claim 4 , further comprising:
a circuit component that is arranged on the first main surface of the module substrate, wherein
the second portion of the first metal member is arranged between the first integrated circuit and the circuit component.
6 . The radio-frequency module according to claim 5 , wherein
the circuit component includes a filter.
7 . The radio-frequency module according to claim 5 , wherein
the circuit component includes a second integrated circuit that includes a second transistor constituting a second power amplifier.
8 . The radio-frequency module according to claim 4 , wherein
the second portion of the first metal member covers only a portion of the side surface of the first integrated circuit.
9 . The radio-frequency module according to claim 2 , wherein
the first metal member is made of copper.
10 . The radio-frequency module according to claim 2 , further comprising:
a second metal member that is arranged adjacent to the first integrated circuit on the first main surface of the module substrate and extends from the first main surface of the module substrate to the shield layer.
11 . The radio-frequency module according to claim 10 , further comprising:
a circuit component that is arranged on the first main surface of the module substrate, wherein
the second metal member is arranged between the first integrated circuit and the circuit component.
12 . The radio-frequency module according to claim 11 , wherein
the circuit component includes a filter.
13 . The radio-frequency module according to claim 11 , wherein
the circuit component includes a second integrated circuit that includes a second transistor constituting a second power amplifier.
14 . The radio-frequency module according to claim 10 , wherein
the first metal member and the second metal member are made of copper.
15 . The radio-frequency module according to claim 2 , wherein
the first metal member covers only a portion of the fourth main surface of the first integrated circuit.
16 . The radio-frequency module according to claim 2 , further comprising:
a resin member that covers at least a portion of the first main surface of the module substrate and at least a portion of the first integrated circuit, wherein
the shield layer covers at least a portion of a surface of the resin member.
17 . The radio-frequency module according to claim 2 , wherein
the first integrated circuit includes a first side in a plan view of the module substrate,
the first transistor is arranged along the first side, and
the at least one via conductor includes a plurality of via conductors arranged along the first transistor.
18 . The radio-frequency module according to claim 17 , wherein
the first integrated circuit further includes a bump electrode that is arranged on the third main surface and connected to the first main surface of the module substrate, and
the bump electrode at least partially overlaps the first transistor and at least partially overlaps the plurality of via conductors in a plan view of the module substrate.
19 . The radio-frequency module according to claim 1 , wherein
the first metal member includes
a first portion that covers at least a portion of the fourth main surface of the first integrated circuit, and
a second portion that covers at least a portion of a side surface of the first integrated circuit and connects the first portion to the first main surface of the module substrate.
20 . The radio-frequency module according to claim 1 , further comprising:
a second metal member that is arranged adjacent to the first integrated circuit on the first main surface of the module substrate and extends from the first main surface of the module substrate to the shield layer.