Top side frame stiffener structure for a printed circuit board (PCB) stack
A top side frame stiffener structure for a printed circuit board (PCB) stack. The structure is placed between a cooling component and a backing plate, in an area surrounding a substrate package. The structure does not cause the overall height of the PCB stack to increase.
1 . An apparatus, comprising:
a backing plate (BP);
a printed circuit board (PCB) located on the BP;
a package substrate comprising a die attached to the PCB;
a cooling component located over the package substrate and attached to the BP;
a structure located in between the PCB and the cooling component, the structure external to a periphery of the package substrate; and
a standoff comprising a first end and a second end, wherein the standoff is attached at the first end to the BP and the cooling component is attached to the standoff at the second end.
2 . The apparatus of claim 1 , wherein the structure comprises stainless steel.
3 . The apparatus of claim 1 , wherein the cooling component comprises a vapor chamber.
4 . The apparatus of claim 1 , further comprising a fastener means that is adjustable to secure the cooling component to the standoff.
5 . The apparatus of claim 4 , further comprising a spring element coiled around a part of the fastener means and located above the cooling component.
6 . The apparatus of claim 1 , wherein the structure comprises an opening that is positioned over the second end and located under the cooling component.
7 . The apparatus of claim 1 , wherein the die comprises a central processing unit (CPU) or graphics processing unit (GPU).
8 . The apparatus of claim 1 , wherein the structure comprises a bend toward the BP.
9 . An apparatus, comprising:
a backing plate (BP);
a printed circuit board (PCB) located on the BP;
a package substrate comprising a die attached to the PCB;
a cooling component located over the package substrate and attached to the BP;
a structure located in between the PCB and the cooling component, the structure external to a periphery of the package substrate; and
a standoff comprising a first end and a second end, wherein the standoff is attached at the first end to the BP and the second end of the standoff comprises a threaded opening therein.
10 . The apparatus of claim 9 , further comprising a screw having a region that is threaded, and wherein the cooling component is attached to the standoff with the screw in the threaded opening.
11 . The apparatus of claim 10 , further comprising a spring element coiled around a part of the screw and located above the cooling component.
12 . The apparatus of claim 9 , wherein the structure comprises stainless steel.
13 . The apparatus of claim 9 , wherein the cooling component comprises a vapor chamber.
14 . The apparatus of claim 9 , wherein the die comprises a central processing unit (CPU) or graphics processing unit (GPU).
15 . The apparatus of claim 9 , wherein the structure comprises stainless steel.
16 . The apparatus of claim 9 , wherein the cooling component comprises a vapor chamber.
17 . An apparatus, comprising:
a backing plate;
a printed circuit board attached to the backing plate;
a package substrate attached to the printed circuit board, wherein the printed circuit board is located between the backing plate and the package substrate;
a die attached to the package substrate;
a cooling component located over the die;
a frame located between the printed circuit board and the cooling component, wherein the frame defines an opening extending through the frame, the package substrate is positioned within the opening, and the frame is laterally outward of a periphery of the package substrate;
a standoff extending from the backing plate, the standoff comprising a threaded opening; and
a screw received in the threaded opening, the screw comprising:
a first region at a distal end of the screw, the first region having a first diameter and external threads engaged with the threaded opening of the standoff;
a second region spaced from the distal end, the second region having a second diameter greater than the first diameter; and
a transition region between the first region and the second region, the transition region defining a shoulder.
18 . The apparatus of claim 17 , wherein the opening is a first opening, the frame comprises a second opening aligned with the threaded opening of the standoff, the second opening having a diameter that is greater than the first diameter and less than the second diameter, such that the shoulder is axially engaged with the frame.
19 . The apparatus of claim 17 , wherein the cooling component comprises an opening aligned with the threaded opening of the standoff, the opening having a diameter greater than the second diameter such that a portion of the second region of the screw extends through the opening.
20 . The apparatus of claim 17 , further comprising a coil spring disposed coaxially around the second region of the screw, wherein the coil spring is positioned between a head of the screw and the cooling component to apply a compressive spring force upon tightening of the screw.
21 . The apparatus of claim 20 , wherein the coil spring has an outer diameter greater than a diameter of an opening of the cooling component.
22 . The apparatus of claim 17 , wherein the frame comprises a first portion in a first plane and a second portion in a second plane different from the first plane.
23 . The apparatus of claim 17 , wherein the die comprises a central processing unit (CPU) or graphics processing unit (GPU).
24 . The apparatus of claim 17 , wherein the frame comprises stainless steel.
25 . The apparatus of claim 17 , wherein the cooling component comprises a vapor chamber.