Wiring circuit board
A wiring circuit board includes a first insulating layer, a conductive pattern disposed at one side of the first insulating layer in a thickness direction and having a terminal and a wire connected with the terminal, and a second insulating layer for suppressing release of the terminal from the first insulating layer. The second insulating layer has a first portion disposed at the one side of the first insulating layer in the thickness direction and a second portion disposed at one side of a peripheral edge portion of the terminal in the thickness direction and covering the peripheral edge portion.
1 . A wiring circuit board comprising:
a first insulating layer;
a conductive pattern disposed at one side of the first insulating layer in a thickness direction and having a terminal and a wire connected with the terminal; and
a second insulating layer for suppressing release of the terminal from the first insulating layer, the second insulating layer having a first portion disposed at the one side of the first insulating layer in the thickness direction and a second portion disposed at the one side of a peripheral edge portion of the terminal in the thickness direction and covering the peripheral edge portion,
wherein the terminal has
a connecting portion disposed in a central part of the terminal and surrounded by the peripheral edge portion, the connecting portion in which the second insulating layer is not disposed.
2 . The wiring circuit board according to claim 1 ,
wherein the terminal includes:
a first conductive layer disposed at the one side of the first insulating layer in the thickness direction; and
a second conductive layer made of a material identical to a material of the first conductive layer and disposed at the one side of the first insulating layer in the thickness direction.
3 . The wiring circuit board according to claim 2 ,
wherein the first conductive layer has the peripheral edge portion,
wherein the peripheral edge portion is disposed outside an edge of the second conductive layer in a direction orthogonal to the thickness direction, and
wherein the second portion of the second insulating layer does not cover the second conductive layer, but covers the peripheral edge portion of the first conductive layer.
4 . The wiring circuit board according to claim 2 ,
wherein the second conductive layer has the peripheral edge portion,
wherein the peripheral edge portion is disposed outside an edge of the first conductive layer in a direction orthogonal to the thickness direction, and
wherein the second portion of the second insulating layer covers the peripheral edge portion of the second conductive layer.
5 . The wiring circuit board according to claim 2 ,
wherein the terminal protrudes toward the one side in the thickness direction as compared with the second insulating layer.
6 . The wiring circuit board according to claim 2 ,
wherein the second conductive layer is thicker than the first conductive layer.
7 . The wiring circuit board according to claim 1 ,
wherein the second portion of the second insulating layer covers the peripheral edge portion on an entire periphery of the terminal.
8 . The wiring circuit board according to claim 1 ,
wherein the peripheral edge portion has:
a first peripheral edge portion connected with the wire; and
a second peripheral edge portion disposed at a side opposite to the wire relative to the first peripheral edge portion in a first direction orthogonal to the thickness direction, and
wherein the second portion of the second insulating layer does not cover the first peripheral edge portion, but covers the second peripheral edge portion.
9 . The wiring circuit board according to claim 1 , further comprising a metal supporting layer disposed at the other side of the first insulating layer in the thickness direction.