Method for manufacturing a printed circuit board with an embedded shield
This invention introduces an advanced method for manufacturing printed circuit boards (PCBs) featuring an embedded shield, enhancing the integrity and functionality of electronic devices. The process involves forming trenches on the PCB, filling them with solder paste, and seamlessly integrating a shield with a frame through a meticulous soldering procedure. This refined technique offers superior reliability and paves the way for more intricate and robust electronic designs.
1 . A method for manufacturing a printed circuit board (PCB) with an embedded shield, comprising:
providing a PCB;
forming at least one trench at the PCB;
electroplating the trench with a metal layer to form an electroplated trench;
filling a solder paste in the electroplated trench;
disposing a shield with at least one frame at the PCB; and
soldering the PCB with the shield;
wherein the frame of the shield is disposed in the electroplated trench, and a portion of the frame is immersed in the solder paste, such that the frame of the shield is seamlessly integrated with the metal layer.
2 . The method for manufacturing the PCB with the embedded shield according to claim 1 , wherein in the step of forming the trench at the PCB, the trench is formed by CNC milling (computer numerical control milling) process, laser carving or engraving process.
3 . The method for manufacturing the PCB with the embedded shield according to claim 1 , wherein the metal layer is made of copper, gold, nickel, ENG (electrolytic nickel/gold), ENIG (electroless nickel immersion gold), or HASL (hot-air solder leveling).
4 . The method for manufacturing the PCB with the embedded shield according to claim 1 , wherein after the frame of the shield is immersed in the solder paste, the PCB is heated through a heating device.
5 . The method for manufacturing the PCB with the embedded shield according to claim 4 , wherein the heating device is a reflow oven.
6 . The method for manufacturing the PCB with the embedded shield according to claim 4 , wherein the solder paste is melted to secure the frame of the shield to the PCB via the melted solder paste in the electroplated trench.
7 . A PCB with an embedded shield, comprising:
a PCB having at least one trench formed thereon, the trench being electroplated with a metal layer;
a shield with at least one frame, wherein the shield is disposed at and soldered to the PCB; and
a solder paste filled in the electroplated trench;
wherein the frame of the shield is disposed in the electroplated trench, and a portion of the frame is immersed in the solder paste, such that the frame of the shield is seamlessly integrated with the metal layer.
8 . The PCB with the embedded shield according to claim 7 , wherein the trench is formed by CNC milling (computer numerical control milling) process, laser carving or engraving process.
9 . The PCB with the embedded shield according to claim 7 , wherein the metal layer is made of copper, gold, nickel, ENG (electrolytic nickel/gold), ENIG (electroless nickel immersion gold), or HASL (hot-air solder leveling).
10 . The PCB with the embedded shield according to claim 7 , wherein the PCB is heated through a heating hating-device.
11 . The PCB with the embedded shield according to claim 10 , wherein the heating device is a reflow oven.
12 . The PCB with the embedded shield according to claim 10 , wherein the solder paste is melted to secure the frame of the shield to the PCB via the melted solder paste in the electroplated trench.