Circuit board and method for manufacturing the same
Disclosed is a circuit board including: an insulation layer for burying at least one wire layer and at least one via layer and having a first side and a second side facing each other, and a first wire layer partly protruding over the first side of the insulation layer and partly buried in the insulation layer, wherein the insulation layer has a concave cavity dented from the first side, and part of the via layer is exposed from the insulation layer through a bottom side of the cavity.
1 . A circuit board comprising:
an insulation layer, in which at least one wire layer and a via layer are disposed, the insulating layer having a first side and a second side opposing each other; and
a first wire layer partly protruding over the first side of the insulation layer and partly disposed in the insulation layer,
wherein the insulation layer has a concave cavity dented in a thickness direction of the circuit board from the first side,
the via layer includes one via having a part exposed from the insulation layer through a bottom side of the cavity and another via connected to the first wire layer, and
a thickness of the one via in the thickness direction is less than a thickness of the another via in the thickness direction.
2 . The circuit board of claim 1 , further comprising
a surface processing layer disposed on a surface of the first wire layer protruding from the first side of the insulation layer.
3 . The circuit board of claim 2 , wherein
the surface processing layer includes nickel, palladium, and gold.
4 . The circuit board of claim 2 , wherein
the surface processing layer includes nickel, palladium, or gold.
5 . The circuit board of claim 1 , wherein
a bottom side and an internal side of the cavity have a same surface roughness.
6 . The circuit board of claim 1 , further comprising
a solder resist layer disposed on the second side of the insulation layer.
7 . The circuit board of claim 1 , wherein
a surface roughness of the bottom side of the cavity is the same as the surface roughness of the first side of the insulation layer.
8 . The circuit board of claim 1 , wherein
the one via of the via layer has a tapered shape such that an end of the one via exposed from the insulation layer has a width less than that of another end of the one via embedded in the insulation layer.