Production process of flexible printed circuit encapsulation structure and flexible printed circuit encapsulation structure
The present disclosure provides a production process of a flexible printed circuit encapsulation structure, includes: a FPC overmolding step: processing the FPC board body and the FPC molding tape into an integrated structure to make the FPC board body and the FPC molding tape fit closely each other; a support body assembly step: assembling two connector assemblies on two ends of the elastic support body respectively; a main body assembly step: assembling a combination obtained by the FPC overmolding step and a combination obtained by the support body assembly step; and a soft rubber overmolding step: performing overmolding on an exterior of an overall structure obtained by assembling the FPC plate body, the FPC molding tape, the elastic support body and the two connector assemblies to form the soft rubber jacket. The present disclosure can meet the requirements of larger deformation amplitude, and high deformation frequency.
1 . A production process of a flexible printed circuit encapsulation structure, wherein the flexible printed circuit encapsulation structure comprises a FPC board body, a FPC molding tape, an elastic support body, two connector assemblies and a soft rubber jacket; and the production process comprises: a FPC over molding step: processing the FPC board body and the FPC molding tape into an integrated structure to make the FPC board body and the FPC molding tape fit closely each other; a support body assembly step: assembling the two connector assemblies on two ends of the elastic support body respectively; a main body assembly step: assembling a combination obtained by the FPC over molding step and a combination obtained by the support body assembly step; and a soft rubber over molding step: performing over molding on an exterior of an overall structure obtained by assembling the FPC board body, the FPC molding tape, the elastic support body and two connector assemblies to form the soft rubber jacket, wherein each connector assembly comprises a functional shell body and an inner connector; the inner connector is embedded in the functional shell body; and the functional shell body and the inner connector are formed by processing with an encapsulation process.
2 . The production process of a flexible printed circuit encapsulation structure according to claim 1 , wherein in a preparation step, a mold forming process of processing the FPC board body and the FPC molding tape into an integrated structure comprises a vacuum cast-molding, a mold injection or a mold hot pressing.
3 . A flexible printed circuit encapsulation structure, comprising: a FPC board body, a FPC molding tape, an elastic support body, two connector assemblies and a soft rubber jacket, wherein the two connector assemblies are respectively located inside left and right ends of the soft rubber jacket; and the FPC board body, the FPC molding tape and the elastic support body are each disposed inside the soft rubber jacket; two ends of the FPC board body respectively extend through and outward from the two connector assemblies; left ends of the elastic support body and the FPC molding tape and their right ends are correspondingly fixed to the two connector assemblies, respectively; the FPC board body and the FPC molding tape are closely fitted to be an integrated structure; and an area of the FPC board body for fitting to the FPC molding tape is provided with a deformation part having multiple bends, wherein each connector assembly comprises a functional shell body and an inner connector, and the inner connector is embedded in the functional shell body.
4 . The flexible printed circuit encapsulation structure according to claim 3 , wherein the deformation part is in a form of wave having an S-shaped bending, a triangle-shaped bending, a square-shaped bending, a V-shaped bending or a trapezoid-shaped bending; or the deformation part is in a form of spiral having a spiral column-shaped bending, a spiral cone shaped-bending or a spiral spindle-shaped bending.
5 . The flexible printed circuit encapsulation structure according to claim 3 , wherein a hardness of the soft rubber jacket is greater than or equal to a hardness of the FPC molding tape.
6 . The flexible printed circuit encapsulation structure according to claim 3 , wherein a side of the FPC molding tape facing the FPC board body is provided with an attachment part, a surface shape of the attachment part is the same as a bending shape of the deformation part, and the attachment part is fitted to the deformation part.
7 . The flexible printed circuit encapsulation structure according to claim 3 , wherein left and right ends of the FPC molding tape are respectively provided with plug blocks, and two plug blocks are respectively plugged into the two inner connectors.
8 . The flexible printed circuit encapsulation structure according to claim 7 , wherein a slit is formed at a junction of the plug block and the FPC molding tape, and the FPC board body passes through the slit.