IP Library Granted Patent US 12690162
Granted Patent B2
US 12690162 · App. 18/383,022 · Granted Jul 21, 2026

Single phase liquid immersion cooling system with forced cooling circuit

Inventors: Fang-Shou Lee (Taoyuan, TW); Cho-Han Lee (Taoyuan, TW); Fang Wang (Livermore, CA)
H05K7/20236H05K7/20254H05K7/20263H05K7/20272
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Quick Facts
Patent No.
US 12690162
App. No.
18/383,022
Granted
Jul 21, 2026
Kind
B2
Abstract

Disclosed is a single phase liquid immersion cooling system with a forced cooling circuit for cooling heat-generating electronic devices, such as servers. The cooling system comprises an immersion cooling unit, a heat exchanger, a first dielectric fluid circulating unit and a second dielectric fluid circulating unit. The immersion cooling unit includes a tank within which dielectric fluid and heat-generating electronic devices are maintained. The heat-generating electronic devices are provided with a radiator and submerged in the body of dielectric fluid. The first dielectric fluid circulating unit includes a first fluid inlet pipe interconnecting the heat exchanger and the tank, a first fluid outlet pipe interconnecting the heat exchanger and the tank, and a first motor pump disposed on the first fluid outlet pipe. The second dielectric fluid circulating unit includes a manifold, a second fluid outlet pipe interconnecting the manifold and the tank, a second fluid inlet pipe interconnecting the manifold and the radiator, and a second motor pump disposed on the second fluid outlet pipe.

Claims (18)

1 . A single phase liquid immersion cooling system with a forced cooling circuit for cooling at least one heat-generating electronic device, comprising:

an immersion cooling unit including a tank defining a fluid-tight space within which a dielectric fluid is maintained, wherein the at least one heat-generating electronic device is disposed within the fluid-tight space and at least partially submerged within the dielectric fluid, and the at least one heat-generating electronic device is provided with at least one radiator;

a heat exchanger;

a first dielectric fluid-circulating unit including:

a first fluid inlet pipe interconnecting the heat exchanger and the tank for guiding the dielectric fluid cooled by the heat exchanger into the tank,

a first fluid outlet pipe interconnecting the heat exchanger and the tank for guiding the dielectric fluid flowing through the at least one heat-generating electronic device into the heat exchanger so as to cool the dielectric fluid, and

at least one first motor pump disposed on the first fluid outlet pipe; and

a second dielectric fluid-circulating unit including:

a manifold,

a second fluid outlet pipe interconnecting the manifold and the tank for guiding the dielectric fluid cooled by the heat exchanger out of the tank into the manifold,

at least one second fluid inlet pipe interconnecting the manifold and the at least one radiator for guiding the dielectric fluid from the manifold into the at least one radiator, and

at least one second motor pump disposed on the second fluid outlet pipe;

wherein the immersion cooling unit further includes a guide board provided with a plurality of through holes, and the guide board is disposed between an inner-bottom surface of the tank and the at least one heat-generating electronic device; the second fluid outlet pipe has an end connected to a lower-lateral wall of the tank and positioned between the inner-bottom surface of the tank and the guide board.

2 . The single phase liquid immersion cooling system according to claim 1 , wherein the at least one radiator is a finned cooler or a cold plate.

3 . The single phase liquid immersion cooling system according to claim 1 , wherein the heat exchanger is a plate heat exchanger.

4 . The single phase liquid immersion cooling system according to claim 1 , wherein the manifold is disposed on an inner upper-lateral wall of the tank and above the at least one heat-generating electronic device, and the manifold is provided with at least one opening that is positioned in correspondence with the at least one heat-generating electronic device.

5 . The single phase liquid immersion cooling system according to claim 1 , wherein the first fluid inlet pipe has an end connected to the lower-lateral wall of the tank and positioned between the inner-bottom surface of the tank and the guide board; and

the first fluid outlet pipe has an end connected to an upper-lateral wall of the tank and positioned beneath a liquid level of the dielectric fluid.