Heat sink for active compute blade connector

Inventors: Pierre Lamy (Paris, FR); Romain Berquier (Les Clayes-sous-Bois, FR)

Assignees: BULL SAS; LE COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES

H05K7/20254 H05K7/20772 G02B6/4268 G06F1/20

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Quick Facts

Patent No.: US 12690164
App. No.: 18/469,722
Granted: Jul 21, 2026
Kind: B2

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Abstract

A liquid-cooled heat sink for a plurality of compute blade connectors, including an elongated shaped body defining on one of its faces a heat collection surface of the plurality of connectors. The heat collection surface includes a plurality of interfacing zones arranged consecutively along the heat collection surface, wherein each interfacing zone is configured to interface with a connector of the plurality of connectors in order to collect the heat, and wherein the heat sink includes at least one stiffener mounted on the body.

Claims (32)

1 . A liquid-cooled heat sink for a plurality of compute blade connectors, said liquid-cooled heat sink comprising:

an elongated shaped body defining, on one outer face of a plurality of outer faces of said elongated shaped body, a heat collection surface, and

at least one stiffener mounted on said outer face of the elongated shaped body, the elongated shaped body being made of aluminum, and the at least one stiffener being made of steel,

wherein said elongated shaped body comprises an inlet port of a cooling liquid and an outlet port of the cooling liquid, and wherein said elongated shaped body is configured to convey the cooling liquid through a cooling circuit between said inlet port and said outlet port,

wherein said heat collection surface comprises a plurality of interfacing zones arranged consecutively along the heat collection surface, and

wherein each interfacing zone of said plurality of interfacing zones is configured to interface with one connector of the plurality of compute blade connectors in order to collect heat to transfer the heat to the cooling circuit.

2 . The liquid-cooled heat sink according to claim 1 , wherein the at least one stiffener is arranged at least along a portion of the plurality of interfacing zones.

3 . The liquid-cooled heat sink according to claim 1 , wherein the at least one stiffener is arranged at least along an entire length of the plurality of interfacing zones.

4 . The liquid-cooled heat sink according to claim 1 , wherein the at least one stiffener is arranged at least over an entire length of the heat collection surface.

5 . The liquid-cooled heat sink according to claim 1 , wherein the at least one stiffener has a U shape extending along a longitudinal edge and two lateral edges of the elongated shaped body.

6 . The liquid-cooled heat sink according to claim 1 , wherein the plurality of interfacing zones are delimited by an edge of the elongated shaped body.

7 . The liquid-cooled heat sink according to claim 1 , wherein the plurality of interfacing zones comprise at least eight interfacing zones.

8 . The liquid-cooled heat sink according to claim 1 , wherein the inlet port is located at a first end of the elongated shaped body and the outlet port is located at a second end of the elongated shaped body, opposite the first end.

9 . The liquid-cooled heat sink according to claim 1 , wherein the elongated shaped body has a substantially rectangular overall shape.

10 . The liquid-cooled heat sink according to claim 1 , wherein a ratio of a length of the elongated shaped body over a width of the elongated shaped body is greater than two.

11 . A supercomputer compute blade comprising:

at least one electronic board comprising at least one processor, a plurality of connectors, and a heat sink,

wherein said heat sink comprises

an elongated shaped body defining, on one outer face of a plurality of outer faces of said elongated shaped body, a heat collection surface, and

at least one stiffener mounted on said outer face of the elongated shaped body, the elongated shaped body being made of aluminum, and the at least one stiffener being made of steel,

wherein said heat collection surface comprises a plurality of interfacing zones arranged consecutively along the heat collection surface, and

wherein said heat sink is fastened to the at least one electronic board such that each connector of said plurality of connectors interfaces with one interfacing zone of the plurality of interfacing zones of said heat sink, in order to collect heat to transfer the heat to the cooling circuit.

12 . The supercomputer compute blade of claim 11 , wherein the plurality of connectors are OSFP type connectors.

13 . A method for manufacturing a liquid-cooled heat sink for a plurality of compute blade connectors, said method comprising:

creating an elongated shaped body defining, on one outer face of a plurality of outer faces of said elongated shaped body, a heat collection surface, the elongated shaped body being made of aluminum,

wherein said elongated shaped body comprises an inlet port for a cooling liquid and an outlet port for said cooling liquid,

wherein said elongated shaped body is configured to convey the cooling liquid through a cooling circuit between said inlet port and said outlet port,

wherein said heat collection surface comprises a plurality of interfacing zones arranged consecutively along the heat collection surface,

creating at least one stiffener configured to be mounted on said outer face of the elongated shaped body, the at least one stiffener being made of steel,

mounting the at least one stiffener at least partially along said outer face of the elongated shaped body.