Heat radiation structure, electronic apparatus, and method for manufacturing same
A heat radiation structure includes a metal mesh brought into contact with the surface of a die, and a heat receiving plate configured to sandwich the mesh between the surface of the die and the heat receiving plate. The mesh is impregnated with a liquid metal at least at a portion brought into contact with the surface of the die and has a shape in which intersection points of vertical and horizontal element wires are crushed in a thickness direction of the mesh. The mesh has a flat portion formed on the surface side of the element wire at each intersection point.
1 . A heat radiation structure for an electrical component which generates heat, comprising:
a metal mesh in direct contact with a surface of the electrical component; and
a heat radiator that sandwiches the metal mesh between the surface of the electrical component and the heat radiator,
wherein the metal mesh is impregnated with a heat transfer fluid at least at a portion in contact with the surface of the electrical component and has a shape in which intersection points of vertical and horizontal element wires are flattened in a thickness direction of the metal mesh.
2 . The heat radiation structure according to claim 1 , wherein the metal mesh has a flat portion at which a flattened element wire interfaces either the electrical component or the heat radiator.
3 . The heat radiation structure according to claim 1 , wherein the metal mesh includes a heating element contacting range part which is impregnated with the heat transfer fluid in a central portion of the metal mesh and receives heat by directly contacting the surface of the electrical component, and
a pair of heating element non-contacting range parts which extend continuously from both sides of the heating element contacting range part and are free of contact with the surface of the electrical component, and
wherein the pair of heating element non-contacting range parts are fixed to the heat radiator through respective sheet materials.
4 . The heat radiation structure according to claim 3 , wherein the pair of heating element non-contacting range parts are sandwiched by the pair of respective sheet materials.
5 . The heat radiation structure according to claim 1 , including a board and a semiconductor chip mounted on the board,
wherein the semiconductor chip includes a substrate and a die, and
wherein the electrical component is the die.
6 . An electronic apparatus having an electrical component which generates heat, comprising:
a metal mesh in direct contact with a surface of the electrical component; and
a heat radiator that sandwiches the metal mesh between the surface of the electrical component and the heat radiator,
wherein the metal mesh is impregnated with a heat transfer fluid at least at a portion in contact with the surface of the electrical component and has a shape in which intersection points of vertical and horizontal element wires are flattened in a thickness direction of the metal mesh.
7 . A method for manufacturing an electronic apparatus having an electrical component which generates heat, comprising the steps of:
applying a pressing force on a metal mesh;
impregnating the metal mesh with a heat transfer fluid; and
sandwiching the metal mesh between a surface of the electrical component and a heat radiator, whereby the metal mesh is in direct contact with the surface of the electrical component.