Arrangement for cooling a power module, and power module

Inventors: Bernd Roppelt (Unterhaid, DE); Jens Schmenger (Forchheim, DE); Thomas Schwinn (Herzogenaurach, DE); Roman Kögler (Nuremberg, DE); Alexander Luft (Nuremberg, DE)

Assignee: SIEMENS AKTIENGESELLSCHAFT

H05K7/209 H05K7/20418

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Quick Facts

Patent No.: US 12690175
App. No.: 18/021,033
Granted: Jul 21, 2026
Kind: B2

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Abstract

An arrangement for cooling a power module with at least one power unit in a housing is provide, the arrangement having at least one heat sink, in which the arrangement for cooling has at least one heat-sink cover, and at least a part of the power module, in particular the housing, at least a part of the heat sink and/or at least a part of the heat-sink cover are/is configured in such a way that, after attachment of the heat-sink cover, the heat sink is fixed in the housing, in particular by way of clamping, through interaction of the configuration of heat sink, heat-sink cover and/or housing. Also, a power module having such an arrangement for cooling a power module is provided.

Claims (12)

1 . An arrangement for cooling a power module with at least one power unit in a housing, the arrangement comprising:

at least one heat sink;

at least one heat-sink cover, wherein at least a part of the at least one heat sink and at least a part of the at least one heat-sink cover are configured in such a way that the at least one heat sink is fixed in the housing through interaction of a configuration of the at least one heat sink and the at least one heat-sink cover;

wherein the configuration is a force fit of the at least one heat sink and the at least one heat-sink cover;

wherein the force fit is configured by way of formation of at least one snap-action hook in the at least one heat-sink cover and a cutout in the at least one heat sink.

2 . The arrangement as claimed in claim 1 , wherein the at least one power unit is fixed on the at least one heat sink by way of adhesive bonding, soldering, and/or sintering.

3 . The arrangement as claimed in claim 1 , wherein, for the force fit, there are formed elevations which engage with the cutouts formed in the at least one heat sink for receiving the elevations.

4 . The arrangement as claimed in claim 1 , wherein the at least one heat- sink cover and/or the at least one heat sink are/is configured in such a way that, when the at least one heat sink is fixed in the housing at least one channel for air-stream guidance is formed.

5 . The arrangement as claimed in claim 4 , wherein as a formation of the at least one channel, the at least one heat-sink cover and/or the at least one heat sink are/is configured in such a way that, at least between at least one outermost cooling rib of the at least one heat sink and the at least one heat-sink cover, there is formed a spacing which is configured in such a way that an air stream for cooling is guided along the at least one outermost rib.

6 . The arrangement of claim 1 , wherein, as a result of the configuration of the at least one heat sink, the at least one heat-sink cover, and/or the housing, the at least one heat sink is not directly fastened to the housing.

7 . The arrangement as claimed in claim 1 , wherein the at least one heat sink includes a plurality of ribs extending therefrom, and the at least one heat-sink cover is placed on the at least one heat sink on a side opposite the plurality of ribs.

8 . The arrangement as claimed in claim 1 , wherein the at least one snap-action hook is formed as a protrusion extending from the at least one heat-sink cover, and wherein the cutout is formed as a corresponding recess in the at least one heat sink for receiving the protrusion.