IP Library › Granted Patent US 12690176
Granted Patent B2
US 12690176 · App. 18/020,887 · Granted Jul 21, 2026

Power module having at least one power unit

Inventors: Roman Kögler (Nuremberg, DE); Alexander Luft (Nuremberg, DE); Bernd Roppelt (Unterhald, DE); Jens Schmenger (Forchheim, DE); Thomas Schwinn (Herzogenaurach, DE)
Assignee: Siemens Aktiengesellschaft
H05K7/20909H05K5/03H05K7/20154
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Quick Facts
Patent No.
US 12690176
App. No.
18/020,887
Granted
Jul 21, 2026
Kind
B2
Abstract

A power module includes a power unit. The power unit includes a power semiconductor and a substrate. In order to improve the reliability of the power module, the substrate of the power unit is directly connected in an integrally bonded manner to a surface of a heat sink. The power unit is surrounded at least partially by a housing. The housing includes a housing frame which is connected liquid-tight to the surface of the heat sink and formed from a first dielectric material, and a housing cover which is connected to the housing frame to close the housing and is formed from a second dielectric material.

Claims (29)

1 . A power module, comprising:

a power unit comprising a power semiconductor and a substrate, said substrate directly connected in an integrally bonded manner to a surface of a heat sink; and

a housing at least partially surrounding the power unit and comprising a housing frame which is connected liquid-tight to the surface of the heat sink and is formed from a first dielectric material, and a housing cover which is configured to close the housing and is detachably connected to the housing frame in a non-destructive manner, said housing cover formed from a second dielectric material which differs from the first dielectric material, wherein the first dielectric material has a higher dielectric strength, a higher temperature stability, and a higher mechanical rigidity than the second dielectric material.

2 . The power module of claim 1 , wherein the housing cover is detachably connected to the housing frame in a non-positive connection at a protrusion formed on the housing frame.

3 . The power module of the claim 1 , wherein the housing cover is detachably connected to the housing frame in a positive connection by a snap connection produced by an elastically deformable region of the lower mechanical rigidity housing cover which is hooked into the housing frame.

4 . The power module of claim 1 , wherein the first dielectric material contains a reaction resin and/or has a fiber content of 50% to 75%.

5 . The power module of claim 1 , wherein the first dielectric material contains a reaction resin and/or has a fiber content of 60% to 65%.

6 . The power module of claim 1 , wherein the second dielectric material contains a thermoplastic material and/or has a fiber content of 5% to 15%.

7 . The power module of claim 1 , further comprising:

a power board arranged primarily parallel to the surface of the heat sink;

orthogonal contacts connecting the power board to the power unit;

wherein the housing cover has recesses for passage of the orthogonal contacts.

8 . The power module of claim 7 , wherein the power board comprises a metallization which is at least partially recessed.

9 . A power converter, comprising the power module of claim 1 .

10 . A method for producing a power module comprising a power unit, the method comprising:

directly connecting in an integrally bonded manner a substrate of the power unit to a surface of a heat sink;

arranging a housing around the power unit, wherein the housing comprises a housing frame formed from a first dielectric material and a housing cover formed from a second dielectric material which differs from the first dielectric material, wherein the first dielectric material has a higher dielectric strength, a higher temperature stability, and a higher mechanical rigidity than the second dielectric material;

connecting the housing frame liquid-tight to the surface of the heat sink; and

closing the housing by detachably connecting the housing cover to the housing frame in a non-destructive manner.

11 . The method of claim 10 , further comprising positively connecting the housing cover to the housing frame by a snap connection produced by an elastically deformable region of the lower mechanical rigidity housing cover which is hooked into the housing frame.

12 . The method of claim 10 , further comprising detachably connecting the housing cover to the housing frame in a non-positive connection at a protrusion formed on the housing frame.

13 . The method of claim 10 , further comprising:

arranging a power board essentially parallel to the surface of the heat sink;

forming the housing cover with recesses for passage of orthogonal contacts; and

connecting the power board to the power unit via the orthogonal contacts.

14 . The power module of claim 1 , further comprising a soft encapsulation provided within the housing frame.

15 . The power module of claim 14 , wherein the housing is filled to just below the housing cover with the soft encapsulation.

16 . The method of claim 10 , further comprising providing a soft encapsulation within the housing frame.

17 . The method of claim 10 , wherein the housing is filled to just below the housing cover with the soft encapsulation.