IP Library Granted Patent US 12690240
Granted Patent B2
US 12690240 · App. 18/618,394 · Granted Jul 21, 2026

Multilayered substrate

Inventor: Yoshinobu Narita (Hitachi, JP)
Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
H10D62/10H10D62/8503H10D62/854
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Quick Facts
Patent No.
US 12690240
App. No.
18/618,394
Granted
Jul 21, 2026
Kind
B2
Abstract

A multilayered substrate comprises: an underlying substrate; and a gallium nitride layer epitaxially grown above the underlying substrate and comprising gallium nitride containing silicon; the gallium nitride layer having a top surface with a radius of 50 mm or more, the gallium nitride layer having a thickness of 4 μm or more, wherein a silicon concentration on the top surface of the gallium nitride layer has a distribution in which an outer circumferential silicon concentration at a radial position 10 mm from an edge of the top surface is higher than a central silicon concentration at a center of the top surface, the central silicon concentration is 4×10 15 cm −3 or more and less than 2×10 16 cm −3 , and an outer circumferential silicon contamination concentration, which is an excess of the outer circumferential silicon concentration from the central silicon concentration, is 1.2×10 15 cm −3 or less.

Claims (10)

1 . A multilayered substrate, comprising:

an underlying substrate; and

a gallium nitride layer epitaxially grown above the underlying substrate and comprising gallium nitride containing silicon;

the gallium nitride layer having a top surface with a radius of 50 mm or more,

the gallium nitride layer having a thickness of 4 μm or more,

wherein a silicon concentration in the top surface of the gallium nitride layer has a distribution in which an outer circumferential silicon concentration at a radial position 10 mm from an edge of the top surface is higher than a central silicon concentration at a center of the top surface,

the central silicon concentration is 4×10 15 cm −3 or more and less than 2×10 16 cm −3 , and

an outer circumferential silicon contamination concentration, which is an excess of the outer circumferential silicon concentration from the central silicon concentration, is 1.2×10 15 cm −3 or less.

2 . The multilayered substrate according to claim 1 , wherein in a circular region inside an annular region with a width of 20 mm from an edge of the top surface, the excess of the silicon concentration in the top surface of the gallium nitride layer from the central silicon concentration, is 0.4×10 15 cm −3 or less.

3 . The multilayered substrate according to claim 1 , wherein the silicon concentration in the top surface of the gallium nitride layer has a distribution in which an intermediate silicon concentration at a radial position 30 mm from a center of the top surface is higher than the central silicon concentration and lower than the outer circumferential silicon concentration.