Electronic display device with horizontal connection electrode connecting power lines in peripheral region
An electronic device includes a substrate, a conductive structure disposed on the substrate, and a first insulating island disposed on the conductive structure. The conductive structure includes a first conductive component, a second conductive component, and a third conductive component. The third conductive component is disposed on the first conductive component and the second conductive component. The third conductive component is electrically connected to the first conductive component and the second conductive component. In a cross-sectional view of the electronic device, the width of the first insulating island is greater than the width of the third conductive component.
1 . An electronic device, comprising:
a substrate;
a conductive structure disposed on the substrate and comprising a first conductive component, a second conductive component, and a third conductive component, wherein the third conductive component is disposed on the first conductive component and the second conductive component and electrically connected to the first conductive component and the second conductive component;
a first insulating island disposed on the conductive structure;
a first insulating layer disposed between the second conductive component and the third conductive component, wherein the first insulating layer has a plurality of first via holes, and the third conductive component is electrically connected to the second conductive component through the plurality of first via holes, and in a cross-sectional view of the electronic device, a width of the first insulating island is greater than a width of the third conductive component.
2 . The electronic device as claimed in claim 1 , wherein in the cross-sectional view of the electronic device, a thickness of the first insulating island is greater than a first distance between a highest height and a lowest height of the third conductive component.
3 . The electronic device as claimed in claim 2 , wherein a ratio of the thickness of the first insulating island to the first distance is greater than 1.1.
4 . The electronic device as claimed in claim 1 , wherein in the cross-sectional view of the electronic device, a side of the third conductive component is adjacent to a side of the first insulating island, and a minimum distance between the side of the third conductive component and the side of the first insulating island is greater than 1 micron (um).
5 . The electronic device as claimed in claim 1 , wherein a portion of the first insulating island is disposed in the plurality of first via holes.
6 . The electronic device as claimed in claim 1 , further comprising a second insulating layer disposed between the first conductive component and the second conductive component, wherein the second conductive component overlaps the first conductive component.
7 . The electronic device as claimed in claim 1 , further comprising a second insulating layer disposed between the first conductive component and the second conductive component, wherein the second conductive component and the first conductive component do not overlap.
8 . The electronic device as claimed in claim 1 , wherein the first conductive component and the second conductive component are made from the same layer.
9 . The electronic device as claimed in claim 1 , wherein the first conductive component and the second conductive component comprises metals and the third conductive component comprises transparent conductive materials.
10 . The electronic device as claimed in claim 1 , wherein the substrate comprises an active area and a peripheral area adjacent to the active area and the conductive structure is disposed in the peripheral area.
11 . The electronic device as claimed in claim 10 , further comprising a second insulating island disposed in the active area, wherein materials of the second insulating island are the same as those of the first insulating island that is disposed in the peripheral area.
12 . The electronic device as claimed in claim 11 , further comprising a fourth insulating island disposed in the peripheral area, wherein materials of the fourth insulating island are the same as those of the first insulating island that is disposed in the peripheral area.
13 . The electronic device as claimed in claim 12 , wherein a height of the second insulating island is greater than or equal to a height of the fourth insulating island.
14 . The electronic device as claimed in claim 12 , wherein a height of the first insulating island is lower than a height of at least one of the second insulating island and the fourth insulating island.
15 . The electronic device as claimed in claim 10 , further comprising a transistor disposed in the peripheral area and a third insulating island disposed on the transistor, wherein the transistor comprises a semiconductor component, and in the cross-sectional view of the electronic device, a width of the third insulating island is greater than a width of the semiconductor component.
16 . The electronic device as claimed in claim 10 , further comprising a plurality of transistors disposed in the peripheral area and a third insulating island disposed on the plurality of transistors, wherein each of the plurality of transistors comprises a semiconductor component, and in the cross-sectional view of the electronic device, a width of the third insulating island is greater than a sum of widths of the semiconductor components.
17 . The electronic device as claimed in claim 16 , wherein the third insulating island comprises a plurality of sub-insulating islands, and each sub-insulating island covers at least one of the plurality of transistors.
18 . The electronic device as claimed in claim 17 , wherein in the cross-sectional view of the electronic device, a width of each sub-insulating island is greater than a width of the semiconductor component of the covered transistor.
19 . The electronic device as claimed in claim 18 , wherein the third insulating island further comprises connecting portions connecting adjacent sub-insulating islands of the plurality of sub-insulating islands.