Image sensor and method for fabricating the same
An image sensor includes a substrate, a photoelectric conversion region in the substrate with the substrate defining a substrate trench on the photoelectric conversion region, a floating diffusion region adjacent to a side surface of the substrate trench, in the substrate, a gate dielectric film that extends along the side surface and a lower surface of the substrate trench and a transfer gate electrode which includes a lower gate that fills a portion of the substrate trench on the gate dielectric film and has a first width, and an upper gate that has a second width smaller than the first width on the lower gate. The gate dielectric film includes a lower dielectric film interposed between the substrate and the lower gate and has a first thickness, and an upper dielectric film adjacent to the floating diffusion region and has a second thickness greater than the first thickness.
1 . An image sensor comprising:
a substrate;
a photoelectric conversion region in the substrate;
the substrate defining a substrate trench over the photoelectric conversion region;
a floating diffusion region adjacent to a side surface of the substrate trench, in the substrate;
a gate dielectric film that extends along the side surface and a lower surface of the substrate trench; and
a transfer gate electrode on the gate dielectric film which includes a lower gate that fills a portion of the substrate trench and has a first width, and an upper gate on the lower gate that has a second width smaller than the first width,
wherein the gate dielectric film includes a lower dielectric film which is interposed between the substrate and the lower gate and has a first thickness, and an upper dielectric film which is adjacent to the floating diffusion region and has a second thickness greater than the first thickness,
wherein a first gate trench is defined by an upper surface of the lower gate, a first side surface of the upper gate, and an element separation pattern, and
wherein a second gate trench is defined by the upper surface of the lower gate, a second side surface of the upper gate, and the upper dielectric film.
2 . The image sensor of claim 1 , wherein the photoelectric conversion region and the floating diffusion region include impurities of a same conductive type.
3 . The image sensor of claim 1 , wherein the upper dielectric film extends from the lower dielectric film to a surface of the substrate.
4 . The image sensor of claim 3 , wherein a depth of the upper dielectric film is deeper than a depth of the floating diffusion region, on the basis of the surface of the substrate.
5 . The image sensor of claim 1 ,
wherein the element separation pattern defines an active region of the substrate, the element separation pattern being in the substrate,
wherein the floating diffusion region is in the active region, and
at least a portion of the substrate trench overlaps the active region.
6 . The image sensor of claim 5 , wherein a depth of the substrate trench is deeper than a depth of the element separation pattern, on the basis of the surface of the substrate.
7 . The image sensor of claim 1 , further comprising:
a boundary film including a fluorine (F) atom, in the substrate adjacent to the upper dielectric film.
8 . The image sensor of claim 1 , wherein the transfer gate electrode further comprises a residual gate film on the lower gate that is spaced apart from the upper gate and extends along a profile of the upper dielectric film.
9 . The image sensor of claim 8 , further comprising:
a gate spacer interposed between the upper gate and the residual gate film and on the lower gate.
10 . The image sensor of claim 1 , wherein the transfer gate electrode includes a polysilicon film.
11 . The image sensor of claim 1 , wherein the gate dielectric film includes a silicon oxide film.
12 . An image sensor comprising:
a substrate;
a photoelectric conversion region in the substrate; the substrate defining a substrate trench on the photoelectric conversion region;
a floating diffusion region adjacent to a side surface of the substrate trench and in the substrate; a gate dielectric film that extends along the side surface and a lower surface of the substrate trench;
a transfer gate electrode on the gate dielectric film which includes a lower gate that fills a portion of the substrate trench, an upper gate on the lower gate that is spaced apart from a side surface of the gate dielectric film, and a residual gate film on the lower gate that extends along the gate dielectric film; and
a gate spacer interposed between the upper gate and the residual gate film and on the lower gate,
wherein the gate dielectric film includes a lower dielectric film which is interposed between the substrate and the lower gate and has a first thickness, and an upper dielectric film which is interposed between the floating diffusion region, and the residual gate film and has a second thickness greater than the first thickness:
wherein a first gate trench is defined by an upper surface of the lower gate and a first side surface of the upper gate,
wherein a second gate trench is defined by the upper surface of the lower gate, a second side surface of the upper gate, and the upper dielectric film, and
wherein the gate spacer fills at least a portion of the second gate trench.
13 . The image sensor of claim 12 , wherein the lower gate, the upper gate, and the residual gate film are integral.
14 . The image sensor of claim 12 , further comprising:
an element separation pattern that defines an active region of the substrate, in the substrate,
wherein the floating diffusion region is in the active region,
the substrate trench overlaps the active region and the element separation pattern, and
the gate spacer is further interposed between the upper gate and the element separation pattern.
15 . The image sensor of claim 14 , wherein a portion of the gate dielectric film is not interposed between the upper gate and the element separation pattern.
16 . The image sensor of claim 12 , further comprising:
a boundary film including a fluorine (F) atom, in the substrate adjacent to the upper dielectric film.
17 . The image sensor of claim 12 , wherein a depth of formation of the upper dielectric film on the basis of the surface of the substrate is 1 Å (0.1 nm) to 1100 Å (110.0 nm).
18 . The image sensor of claim 12 , wherein a first width of the lower gate is greater than a second width of the upper gate.
19 . An image sensor comprising:
a first substrate including a first side and a second side opposite to each other;
a photoelectric conversion region in the first substrate;
a transfer gate electrode which is at least partially embedded in the first substrate and on the first side of the first substrate;
a gate dielectric film interposed between the first substrate and the transfer gate electrode;
a floating diffusion region adjacent to a side surface of the transfer gate electrode and in the first substrate;
a first wiring structure electrically connected to at least one of the transfer gate electrode or the floating diffusion region and on the first side of the first substrate; and
a microlens on the second side of the first substrate,
wherein the transfer gate electrode includes a lower gate adjacent to the photoelectric conversion region, and an upper gate spaced apart from a side surface of the gate dielectric film, and
the gate dielectric film includes a lower dielectric film which is interposed between the first substrate and the lower gate and has a first thickness, and an upper dielectric film which is adjacent to the floating diffusion region and has a second thickness greater than the first thickness,
wherein a first gate trench is defined by an upper surface of the lower gate, a first side surface of the upper gate, and an element separation pattern, and
wherein a second gate trench is defined by the upper surface of the lower gate, a second side surface of the upper gate, and the upper dielectric film.
20 . The image sensor of claim 19 , further comprising:
a second substrate which includes a third side facing the first side of the first substrate, and a fourth side opposite to the third side;
a peripheral circuit element on the third side of the second substrate; and
a second wiring structure electrically connected to the peripheral circuit element, on the third side of the second substrate,
wherein the second wiring structure is attached onto the first wiring structure.