Display substrate and preparation method thereof, and display device

1 . A display substrate, comprising a display region and a binding region located at one side of the display region, wherein

the display region comprises a driving structure layer, an organic insulating layer disposed on the driving structure layer and a light-emitting element disposed on the organic insulating layer, the driving structure layer comprises a pixel driving circuit, and the light-emitting element is connected with the pixel driving circuit;

the binding region comprises a binding structure layer, an organic insulating layer and an isolation dam disposed on the binding structure layer, and an inorganic encapsulation layer disposed on the organic insulating layer and the isolation dam, the binding structure layer comprises a power line connected with the pixel driving circuit;

at least one isolation groove is disposed on the organic insulating layer of the binding region, the inorganic encapsulation layer covers the isolation groove and wraps the isolation dam, and the distance between the isolation groove and an edge of the display region is smaller than the distance between the isolation dam and the edge of the display region;

the isolation dam comprises a first isolation dam and a second isolation dam, and the light-emitting element comprises a cathode; and

the isolation groove is not overlapped with an organic encapsulation layer, and/or a distance between the organic encapsulation layer and the cathode is smaller than a distance between the organic encapsulation layer and the first isolation dam.

2 . The display substrate according to claim 1 , wherein

the distance between the first isolation dam and the edge of the display region is smaller than the distance between the second isolation dam and the edge of the display region; and

the distance between the isolation groove and the edge of the display region is smaller than the distance between the first isolation dam and the edge of the display region.

3 . The display substrate according to claim 2 , wherein

the light-emitting element further comprises an anode, a pixel definition layer, an organic light-emitting layer, the pixel definition layer and the cathode extend to the binding region; and

along the direction away from the display region, the distance between an edge of the cathode and the edge of the display region in the binding region is smaller than the distance between the isolation groove and the edge of the display region.

4 . The display substrate according to claim 1 , wherein a width of the isolation groove is 20 μm to 70 μm along the direction away from the display region; or

the power line comprises a first power line and a second power line, and the isolation groove is disposed on the first power line, or disposed on the second power line, or disposed between the first power line and the second power line.

5 . The display substrate according to claim 4 , wherein along the direction of the edge of the display region, an orthographic projection of the isolation groove on a substrate comprises an orthographic projection of the first power line on the substrate;

or,

the display substrate further comprises an edge region which comprises a circuit structure layer and an organic insulating layer disposed on the circuit structure layer, a gap is disposed on the organic insulating layer, and the isolation groove of the binding region is communicated with the gap of the edge region;

or,

the first power line comprises a first strip block and a second strip block, the first strip block extends along a direction of the edge of the display region, the second strip block extends along a direction away from the display region, and an end of the second strip block adjacent to the display region is connected with the first strip block to form a T-shaped structure; and

the second voltage line is located at one side of the first strip block away from the display region, the isolation dam is disposed on the second strip block and the second power line, and the isolation groove is disposed on the first strip block;

or,

the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate and a first power line and a second power line disposed on the composite insulating layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a first power line and a second power line disposed on the composite insulating layer, and a fifth insulating layer disposed on the first power line and the second power line;

the organic insulating layer disposed on the binding structure layer comprises a first flat layer; and

the composite insulating layer comprises a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer which are stacked on the substrate;

or,

the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate and a first power line and a second power line disposed on the composite insulating layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a first power line and a second power line disposed on the composite insulating layer, and a fifth insulating layer disposed on the first power line and the second power line;

the organic insulating layer disposed on the binding structure layer comprises a first flat layer; and

the composite insulating layer comprises a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer which are stacked on the substrate;

or,

the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a fifth insulating layer disposed on the composite insulating layer, a first flat layer disposed on the fifth insulating layer, and a first power line and a second power line disposed on the first flat layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a first power line and a second power line disposed on the composite insulating layer, a fifth insulating layer disposed on the first power line and the second power line, and a first flat layer disposed on the fifth insulating layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a second connection electrode and a third connection electrode disposed on the composite insulating layer, a fifth insulating layer covering the second connection electrode and the third connection electrode, a first flat layer disposed on the fifth insulating layer, and a first power line and a second power line disposed on the first flat layer, the first power line is connected with the second connection electrode through a via, and the second power line is connected with the third connection electrode through the via;

the organic insulating layer disposed on the binding structure layer comprises a second flat layer; and

the composite insulating layer comprises a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer which are stacked on the substrate.

6 . The display substrate according to claim 1 , wherein

an edge of the power line is provided with a wave structure; and

the wave structure is disposed on the edge of the power line on one side of the isolation groove away from the display region, or the wave structure is disposed on the edge of the power line on one side of the isolation dam away from the display region, or the wave structure is disposed on the edge of the power line in an area where the power line overlaps with the isolation dam.

7 . The display substrate according to claim 6 , wherein the wave structure comprises a plurality of protrusions disposed at intervals, and a protrusion height of the protrusion is 30 μm to 60 μm.

8 . A display device, comprising the display substrate according to claim 1 .

9 . A display substrate, comprising a display region and a binding region located at one side of the display region, wherein

the display region comprises a driving structure layer, an organic insulating layer disposed on the driving structure layer and a light-emitting element disposed on the organic insulating layer, the driving structure layer comprises a pixel driving circuit, and the light-emitting element is connected with the pixel driving circuit;

the binding region comprises a binding structure layer, an organic insulating layer and an isolation dam disposed on the binding structure layer, and an inorganic encapsulation layer disposed on the organic insulating layer and the isolation dam, the binding structure layer comprises a power line connected with the pixel driving circuit;

at least one isolation groove is disposed on the organic insulating layer of the binding region, the inorganic encapsulation layer covers the isolation groove and wraps the isolation dam, and the distance between the isolation groove and an edge of the display region is smaller than the distance between the isolation dam and the edge of the display region;

the isolation dam comprises a first isolation dam and a second isolation dam, and the light-emitting element comprises a cathode; and

the first isolation dam is not overlapped with an organic encapsulation layer, and/or a distance between the isolation groove and the cathode is smaller than a distance between the cathode and the first isolation dam.

10 . The display substrate according to claim 9 , wherein

the distance between the first isolation dam and the edge of the display region is smaller than the distance between the second isolation dam and the edge of the display region; and

the distance between the isolation groove and the edge of the display region is smaller than the distance between the first isolation dam and the edge of the display region.

11 . The display substrate according to claim 10 , wherein

the light-emitting element further comprises an anode, a pixel definition layer, an organic light-emitting layer, the pixel definition layer and the cathode extend to the binding region; and

along the direction away from the display region, the distance between an edge of the cathode and the edge of the display region in the binding region is smaller than the distance between the isolation groove and the edge of the display region.

12 . The display substrate according to claim 9 , wherein a width of the isolation groove is 20 μm to 70 μm along the direction away from the display region; or

the power line comprises a first power line and a second power line, and the isolation groove is disposed on the first power line, or disposed on the second power line, or disposed between the first power line and the second power line.

13 . The display substrate according to claim 12 , wherein along the direction of the edge of the display region, an orthographic projection of the isolation groove on a substrate comprises an orthographic projection of the first power line on the substrate;

or,

the display substrate further comprises an edge region which comprises a circuit structure layer and an organic insulating layer disposed on the circuit structure layer, a gap is disposed on the organic insulating layer, and the isolation groove of the binding region is communicated with the gap of the edge region;

or,

the first power line comprises a first strip block and a second strip block, the first strip block extends along a direction of the edge of the display region, the second strip block extends along a direction away from the display region, and an end of the second strip block adjacent to the display region is connected with the first strip block to form a T-shaped structure; and

the second voltage line is located at one side of the first strip block away from the display region, the isolation dam is disposed on the second strip block and the second power line, and the isolation groove is disposed on the first strip block;

or,

the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate and a first power line and a second power line disposed on the composite insulating layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a first power line and a second power line disposed on the composite insulating layer, and a fifth insulating layer disposed on the first power line and the second power line;

the organic insulating layer disposed on the binding structure layer comprises a first flat layer; and

the composite insulating layer comprises a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer which are stacked on the substrate;

or,

the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate and a first power line and a second power line disposed on the composite insulating layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a first power line and a second power line disposed on the composite insulating layer, and a fifth insulating layer disposed on the first power line and the second power line;

the organic insulating layer disposed on the binding structure layer comprises a first flat layer; and

the composite insulating layer comprises a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer which are stacked on the substrate;

or,

the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a fifth insulating layer disposed on the composite insulating layer, a first flat layer disposed on the fifth insulating layer, and a first power line and a second power line disposed on the first flat layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a first power line and a second power line disposed on the composite insulating layer, a fifth insulating layer disposed on the first power line and the second power line, and a first flat layer disposed on the fifth insulating layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a second connection electrode and a third connection electrode disposed on the composite insulating layer, a fifth insulating layer covering the second connection electrode and the third connection electrode, a first flat layer disposed on the fifth insulating layer, and a first power line and a second power line disposed on the first flat layer, the first power line is connected with the second connection electrode through a via, and the second power line is connected with the third connection electrode through the via;

the organic insulating layer disposed on the binding structure layer comprises a second flat layer; and

the composite insulating layer comprises a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer which are stacked on the substrate.

14 . The display substrate according to claim 13 , wherein the binding region further comprises an isolation area disposed on the binding structure layer, the isolation groove exposes a surface of the second power line, the first isolation dam and the second isolation dam are disposed on the second power line of the isolation area, and surfaces of the second power line and the composite insulating layer are exposed in an area outside the first isolation dam and the second isolation dam.

15 . The display substrate according to claim 14 , wherein the inorganic encapsulation layer comprises a first encapsulation layer and a third encapsulation layer which are stacked, the first encapsulation layer and the third encapsulation layer of an inorganic material cover the isolation groove and the isolation area, and wrap the first isolation dam and the second isolation dam.

16 . The display substrate according to claim 9 , wherein

an edge of the power line is provided with a wave structure; and

the wave structure is disposed on the edge of the power line on one side of the isolation groove away from the display region, or the wave structure is disposed on the edge of the power line on one side of the isolation dam away from the display region, or the wave structure is disposed on the edge of the power line in an area where the power line overlaps with the isolation dam.

17 . The display substrate according to claim 16 , wherein the wave structure comprises a plurality of protrusions disposed at intervals, and a protrusion height of the protrusion is 30 μm to 60 μm.

18 . The display substrate according to claim 9 , wherein a distance between an edge of the isolation groove adjacent to the first isolation dam and an edge of the first isolation dam adjacent to the isolation groove is about 40 μm to about 60 μm.

19 . A preparation method of a display substrate, the display substrate comprising a display region and a binding region located at one side of the display region, the preparation method comprising:

forming a driving structure layer and a binding structure layer in the display region and the binding region respectively, wherein the driving structure layer comprises a pixel driving circuit, and the binding structure layer comprises a power line connected with the pixel driving circuit;

forming an organic insulating layer on the driving structure layer and the binding structure layer, wherein at least one isolation groove is formed on the organic insulating layer on the binding structure layer;

forming a light-emitting element and an isolation dam in the display region and the binding region respectively, wherein the light-emitting element is connected with the pixel driving circuit, and the distance between the isolation groove and an edge of the display region is smaller than the distance between the isolation dam and the edge of the display region; and

forming a composite encapsulation layer and an inorganic encapsulation layer in the display region and the binding region, respectively, wherein the inorganic encapsulation layer covers the isolation groove and wraps the isolation dam, wherein the composite encapsulation layer comprises an organic encapsulation layer, and the isolation dam is not overlapped with the organic encapsulation layer.

20 . The preparation method according to claim 19 , wherein

the forming a light-emitting element and an isolation dam in the display region and the binding region respectively comprises: forming a light-emitting element in the display region, wherein the light-emitting element is connected with the pixel driving circuit; and

forming a first isolation dam and a second isolation dam in the binding region, wherein the distance between the first isolation dam and the edge of the display region is smaller than the distance between the second isolation dam and the edge of the display region, and the distance between the isolation groove and the edge of the display region is smaller than the distance between the first isolation dam and the edge of the display region;

or,

the power line comprises a first power line and a second power line,

the isolation groove is disposed on the first power line, or disposed on the second power line, or disposed between the first power line and the second power line, and

the width of the isolation groove is 20 μm to 70 μm along the direction away from the display region;

or,

the display substrate further comprises an edge region, and

the preparation method further comprises: forming a circuit structure layer on the edge region, and forming an organic insulating layer on the circuit structure layer, wherein

at least one gap is formed on the organic insulating layer, and the isolation groove of the binding region is communicated with the gap of the edge region and formed by the same process;

or,

the display substrate further comprises an edge region, and

the preparation method further comprises: forming a circuit structure layer on the edge region, and forming an organic insulating layer on the circuit structure layer, wherein

at least one gap is formed on the organic insulating layer, and the isolation groove of the binding region is communicated with the gap of the edge region and formed by the same process;

or,

wherein the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate and a first power line and a second power line disposed on the composite insulating layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a first power line and a second power line disposed on the composite insulating layer, and a fifth insulating layer disposed on the first power line and the second power line; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a fifth insulating layer disposed on the composite insulating layer, a first flat layer disposed on the fifth insulating layer, and a first power line and a second power line disposed on the first flat layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a first power line and a second power line disposed on the composite insulating layer, a fifth insulating layer disposed on the first power line and the second power line, and a first flat layer disposed on the fifth insulating layer; or, the binding structure layer of the binding region comprises a composite insulating layer disposed on the substrate, a second connection electrode and a third connection electrode disposed on the composite insulating layer, a fifth insulating layer covering the second connection electrode and the third connection electrode, a first flat layer disposed on the fifth insulating layer, and a first power line and a second power line disposed on the first flat layer, the first power line is connected with the second connection electrode through a via, and the second power line is connected with the third connection electrode through the via;

the organic insulating layer disposed on the binding structure layer comprises a first flat layer or comprises a second flat layer; and

the composite insulating layer comprises a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer which are stacked on the substrate;

or,

an edge of the power line is provided with a wave structure;

the wave structure is disposed on the edge of the power line on one side of the isolation groove away from the display region, or the wave structure is disposed on the edge of the power line on one side of the isolation dam away from the display region, or the wave structure is disposed on the edge of the power line in an area where the power line overlaps with the isolation dam; and

the wave structure comprises a plurality of protrusions disposed at intervals, and a protrusion height of the protrusions is 30 μm to 60 μm.