IP Library › Granted Patent US 12690367

Granted Patent B2

US 12690367 · App. 18/297,663 · Granted Jul 21, 2026

Display device, including a sealing layer with different thicknesses and manufacturing method thereof

Inventor: Arichika Ishida (Tokyo, JP)

Assignee: MAGNOLIA WHITE CORPORATION

H10K59/871 H10K59/873 H10K71/00 H10K59/122 H10K2102/351

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Quick Facts

Patent No.: US 12690367
App. No.: 18/297,663
Granted: Jul 21, 2026
Kind: B2

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Abstract

According to one embodiment, a display device includes a lower electrode, a rib including a pixel aperture, a partition on the rib, an upper electrode contacting the partition, an organic layer between the lower and upper electrodes, and a sealing layer covering a display element and the partition, the display element including the lower electrode, the upper electrode and the organic layer. The sealing layer includes a first portion which is located above the rib and has a first thickness, and a second portion which is located above the lower electrode exposed from the rib through the pixel aperture and has a second thickness less than the first thickness.

Claims (66)

1 . A display device comprising:

a lower electrode;

a rib which covers an end portion of the lower electrode and comprises a pixel aperture from which part of the lower electrode is exposed;

a partition provided on the rib;

an upper electrode which faces the lower electrode and is in contact with the partition;

an organic layer which is provided between the lower electrode and the upper electrode and emits light based on a potential difference between the lower electrode and the upper electrode; and

a sealing layer which continuously covers a display element and the partition, the display element including the lower electrode, the upper electrode and the organic layer, wherein

the sealing layer includes:

a first portion which is located above the rib and has a first thickness; and

a second portion which is located above the lower electrode exposed from the rib through the pixel aperture and has a second thickness less than the first thickness.

2 . The display device of claim 1 , wherein

the first portion surrounds the second portion as seen in plan view.

3 . The display device of claim 1 , wherein

the second thickness is less than or equal to half the first thickness.

4 . The display device of claim 1 , wherein

the first thickness is greater than a height of the partition, and

the second thickness is less than the height of the partition.

5 . The display device of claim 1 , wherein

the first thickness is greater than or equal to 1.0 μm, and

the second thickness is less than 1.0 μm.

6 . The display device of claim 5 , wherein

the second thickness is greater than or equal to 0.1 μm.

7 . The display device of claim 1 , wherein

a distance between the partition and the second portion is greater than or equal to a height of the partition.

8 . The display device of claim 1 , wherein

the partition comprises:

a lower portion provided on the rib; and

an upper portion provided on the lower portion and protruding relative to a side surface of the lower portion,

the upper electrode is in contact with the side surface, and

the first portion covers part of the side surface.

9 . A manufacturing method of a display device, including:

forming a lower electrode above a substrate;

forming a rib which covers an end portion of the lower electrode and comprises a pixel aperture from which part of the lower electrode is exposed;

forming a partition on the rib;

forming an organic layer which covers the lower electrode through the pixel aperture;

forming an upper electrode which covers the organic layer and is in contact with the partition;

forming a sealing layer which continuously covers a display element and the partition, the display element including the lower electrode, the upper electrode and the organic layer; and

reducing a thickness of, of the sealing layer, a portion located above the lower electrode exposed from the rib through the pixel aperture.

10 . The manufacturing method of claim 9 , wherein

the reducing the thickness includes:

providing a resist on, of the sealing layer, a portion which covers the partition; and

reducing a thickness of, of the sealing layer, a portion exposed from the resist by etching.

11 . The manufacturing method of claim 9 , wherein

after the reduction of the thickness, the sealing layer includes:

a first portion which is located above the rib and has a first thickness; and

a second portion which is located above the lower electrode exposed from the rib through the pixel aperture and has a second thickness less than the first thickness.

12 . The manufacturing method of claim 11 , wherein

the first portion surrounds the second portion as seen in plan view.

13 . The manufacturing method of claim 11 , wherein