Substrate processing apparatus and method for manufacturing semiconductor device
A substrate processing apparatus includes: a processing tank configured to store a solution capable of processing a substrate; a supply configured to supply the solution to the processing tank; a holding member having an openable and closable support portion capable of sandwiching the substrate, the holding member configured to hold the substrate in the processing tank; a first drive mechanism configured to move the holding member in a first direction along a substrate surface; and a guide disposed between the support portion and the supply in the processing tank and configured to guide a rotational movement of the substrate in the first direction.
1 . A substrate processing system comprising:
a substrate;
a processing tank configured to store a solution capable of processing the substrate;
a supply configured to supply the solution to the processing tank;
a lifter having an openable and closable support portion capable of sandwiching the substrate, the lifter configured to hold the substrate in the processing tank;
a first motor configured to move the lifter in a first direction that is aligned with a major surface of the substrate; and
a guide disposed between the support portion and the supply in the processing tank and configured to guide a rotational movement of the substrate;
wherein the guide has a first guide, a second guide, and a third guide between the first guide and the second guide, and wherein a distance from a left end portion of the first guide to a right end portion of the second guide is equal to or greater than a length of a circumference of the substrate, so as to rotate the substrate at least once.
2 . The substrate processing system according to claim 1 , wherein the lifter further has a shaft portion and a head portion supported by the shaft portion, and the support portion has a pair of support members extending downward from the head portion.
3 . The substrate processing system according to claim 2 , further comprising a third motor configured to open and close the pair of support members.
4 . The substrate processing system according to claim 1 , wherein the supply has a supply port configured to discharge the solution, the supply port configured to increase a flow rate of the solution as a distance from the substrate to the supply port increases.
5 . The substrate processing system according to claim 1 , wherein a cross section of the guide along a plane including a third direction and the first direction is formed in an arc shape recessed downward, the third direction intersecting the first direction and a second direction.
6 . The substrate processing system according to claim 1 , wherein a recess portion extending along a direction of movement of the substrate is disposed on a surface of the guide facing the support portion.
7 . The substrate processing system according to claim 1 , further comprising a second motor configured to move the lifter in a third direction intersecting both of the first direction and a second direction intersecting the first direction.
8 . The substrate processing system according to claim 1 , wherein the supply has a supply port configured to discharge the solution, and the guide has a slit penetrating the guide at a position above a corresponding supply port.
9 . The substrate processing system according to claim 1 , wherein the supply has a supply port configured to discharge the solution, and a space between the first guide and the second guide corresponds to a position above the supply port.
10 . The substrate processing system according to claim 1 , wherein the first motor is configured to reduce a movement speed of the lifter as a distance from the substrate to the supply port increases.