Large format continuous imaging system

1 . An inspection apparatus for detecting anomalies, comprising:

at least one time delay integrated (TDI) linear sensor that has a TDI linear sensor length, a TDI linear sensor optical input, and a TDI linear sensor data output; and

a plurality of optical assemblies positioned adjacent to and spaced apart from each other, wherein each of the plurality of optical assemblies is positioned with an optical output focused on a segment of the TDI linear sensor length and an optical input with an input field-of-view (FOV) positioned to receive a portion of a surface under examination, wherein the optical assemblies are microscope bodies, and wherein each of the optical assemblies has a different focal plane.

2 . The inspection apparatus of claim 1 , wherein the TDI linear sensor length is approximately 80 mm.

3 . The inspection apparatus of claim 1 , further comprising:

a platform with an upper surface for supporting an object with the surface under examination and with a motion assembly configured to move the platform; and

a controller in communication with the motion assembly to move the platform in relation to the optical input of the plurality of optical assemblies.

4 . The inspection apparatus of claim 3 , wherein the controller moves the platform to adjust a distance between the optical input and the surface under examination.

5 . The inspection apparatus of claim 3 , wherein the controller is in communication with the motion assembly, the plurality of optical assemblies, and the TDI linear sensor and is configured to scan an entire surface of a substrate.

6 . The inspection apparatus of claim 5 , wherein the substrate has chiplets bonded to the substrate.

7 . The inspection apparatus of claim 3 , wherein the controller is in communication with the motion assembly, the optical assemblies, and the TDI linear sensor and is configured to scan a carrier with singulated chiplets.

8 . An inspection apparatus for detecting anomalies, comprising:

at least one time delay integrated (TDI) linear sensor that has a TDI linear sensor length, a TDI linear sensor optical input, and a TDI linear sensor data output;

a plurality of optical assemblies positioned adjacent to each other, wherein each of the plurality of optical assemblies is positioned with an optical output focused on a segment of the TDI linear sensor length and an optical input with an input field-of-view (FOV) positioned to receive a portion of a surface under examination;

a platform with an upper surface for supporting an object with the surface under examination and with a motion assembly configured to move the platform;

a controller in communication with the motion assembly to move the platform in relation to the optical input of the plurality of optical assemblies; and

an integrated Z-profiler with a laser-based auto-focus module configured to determine a Z-profile of the surface under examination prior to acquisition of a surface image by the TDI linear sensor; or

an external Z-profiler configured to provide a Z-profile of the surface under examination prior to acquisition of a surface image by the TDI linear sensor, wherein the external Z-profiler is in communication with the controller.

9 . The inspection apparatus of claim 1 , wherein the plurality of optical assemblies have a similar focus and FOV.

10 . The inspection apparatus of claim 1 , wherein at least one of the plurality of optical assemblies incorporates epi-illumination or darkfield illumination.

11 . The inspection apparatus of claim 1 , wherein at least one of the plurality of optical assemblies has a tunable lens that adjusts a focal plane of the at least one of the plurality of optical assemblies.

12 . An inspection apparatus for detecting anomalies, comprising:

at least one time delay integrated (TDI) linear sensor that has a TDI linear sensor length of approximately 50 mm to approximately 160 mm, a TDI linear sensor optical input, and a TDI linear sensor data output;

a plurality of optical assemblies positioned adjacent to each other, wherein each of the plurality of optical assemblies is positioned with an optical output focused on a segment of the TDI linear sensor length and an optical input with an input field-of-view (FOV) positioned to receive a portion of a surface under examination;

a platform with an upper surface for supporting an object with the surface under examination and with a 4-axis motion assembly that moves the platform;

a controller in communication with the 4-axis motion assembly, the plurality of optical assemblies, and the TDI linear sensor and is configured to scan an entire surface of a substrate or a carrier; and

a Z-profiler that determines a Z-profile of the surface under examination prior to acquisition of a surface image by the TDI linear sensor.

13 . The inspection apparatus of claim 12 , wherein the substrate has chiplets bonded to the substrate.

14 . The inspection apparatus of claim 12 , wherein the plurality of optical assemblies have a similar focus and FOV.

15 . The inspection apparatus of claim 12 , wherein at least one of the plurality of optical assemblies incorporates epi-illumination or darkfield illumination.

16 . The inspection apparatus of claim 12 , wherein at least one of the plurality of optical assemblies has a tunable lens that adjusts a focal plane of the at least one of the plurality of optical assemblies.

17 . An inspection apparatus for detecting anomalies, comprising:

at least one time delay integrated (TDI) linear sensor that has a TDI linear sensor length of approximately 50 mm to approximately 160 mm, a TDI linear sensor optical input, and a TDI linear sensor data output;

a plurality of optical assemblies positioned adjacent to each other, wherein each of the plurality of optical assemblies is positioned with an optical output focused on a segment of the TDI linear sensor length and an optical input with an input field-of-view (FOV) positioned to receive a portion of a surface under examination;

a platform with an upper surface for supporting an object with the surface under examination and with a 4-axis motion assembly configured to move the platform;

a controller in communication with the 4-axis motion assembly, the plurality of optical assemblies, and the TDI linear sensor and is configured to scan an entire surface of a substrate or a carrier; and

an integrated Z-profiler with a laser-based auto-focus module configured to determine a Z-profile of the surface under examination prior to acquisition of a surface image by the TDI linear sensor; or

an external Z-profiler configured to provide a Z-profile of the surface under examination prior to acquisition of a surface image by the TDI linear sensor, wherein the external Z-profiler is in communication with the controller.

18 . A method of obtaining inspection data, comprising:

determining a Z-profile of a surface of a substrate or carrier under examination prior to acquisition of a surface image;

scanning across the surface of the substrate or carrier with a plurality of optical assemblies positioned adjacent to each other;

receiving image data from the surface into the plurality of optical assemblies which is focused onto a single time delay integration (TDI) linear sensor, wherein each optical assembly focuses image data on a different portion of the TDI linear sensor;

reconstructing the image data from the TDI linear sensor to form reconstructed image data and mapping the reconstructed image data to a location on the surface;

analyzing the reconstructed image data and location data to determine locations of anomalies and form a defectivity map of the surface; and

forming inferences based on the defectivity map and performing a corrective action based on the inferences.

19 . The method of claim 18 , wherein the corrective action includes marking chiplets as defective and removing the chiplets from a bonder selection pool.

20 . The method of claim 18 , wherein the corrective action includes augmenting a pre-bonding process to mitigate future anomalies.