Substrate processing method
In substrate processing using the batch processing unit and the single substrate processing unit, the entire substrate processing is efficiently advanced. A substrate processing method includes: a process of calculating a required period of time that is a period of time taken for the substrates to complete the substrate processing in the single substrate processing unit according to a standby number that is a number of the substrates after being subjected to chemical liquid processing in the batch processing unit and before being subjected to drying processing in single substrate processing unit; and a process of controlling a start timing of the chemical liquid processing in the batch processing unit to make the required period of time shorter than a period of time taken for the chemical liquid processing in the batch processing unit.
1 . A substrate processing method for performing substrate processing by using a batch processing unit that performs said substrate processing including chemical liquid processing on a plurality of substrates, and at least one single substrate processing unit that performs said substrate processing including drying processing on one of said substrates, the method comprising:
a process of calculating a required period of time that is a period of time taken for said substrates to complete said substrate processing in said at least one single substrate processing unit according to a standby number that is a number of said substrates after being subjected to said chemical liquid processing in said batch processing unit and before being subjected to said drying processing in said at least one single substrate processing unit; and
a process of controlling a start timing of said chemical liquid processing in said batch processing unit to make said required period of time shorter than a period of time taken for said chemical liquid processing in said batch processing unit.
2 . The substrate processing method according to claim 1 , wherein said required period of time includes a remaining period of time for said substrate processing in progress.
3 . The substrate processing method according to claim 1 , the method further comprising a process of performing cleaning processing by immersing said plurality of substrates in a cleaning tank after being subjected to said chemical liquid processing in said batch processing unit,
wherein said process of calculating said required period of time is a process of calculating said required period of time including a period of time taken for said cleaning processing according to said standby number of said substrates immersed in said cleaning tank.
4 . The substrate processing method according to claim 1 , the method further comprising a process of performing cleaning processing on said substrates before being subjected to said drying processing in said at least one single substrate processing unit.
5 . The substrate processing method according to claim 4 , wherein said process of calculating said required period of time is a process of calculating said required period of time including a period of time taken for said cleaning processing according to said standby number of said substrates before moving from said batch processing unit to said at least one single substrate processing unit.
6 . The substrate processing method according to claim 1 ,
wherein said chemical liquid processing is performed in said batch processing unit by immersing said substrates in a chemical liquid tank,
the method further comprising a process of performing cleaning processing by immersing said plurality of substrates after being subjected to said chemical liquid processing in a cleaning tank in said batch processing unit,
wherein said chemical liquid tank includes a first region in which said chemical liquid processing is started at a first start timing, and a second region in which said chemical liquid processing is started at a second start timing that is a timing different from said first start timing, and
said cleaning tank includes a third region in which said cleaning processing is performed on said substrates subjected to said chemical liquid processing in said first region, and a fourth region in which said cleaning processing is performed on said substrates subjected to said chemical liquid processing in said second region.
7 . The substrate processing method according to claim 1 , wherein said required period of time includes a period of time taken for said substrates to move from said batch processing unit to said at least one single substrate processing unit.
8 . The substrate processing method according to claim 1 , wherein said required period of time includes a period of time taken for posture changing for said substrates subjected to said substrate processing in said batch processing unit to be subjected to said substrate processing in said at least one single substrate processing unit.
9 . The substrate processing method according to claim 1 , wherein in a case where said standby number of said substrates are distributed to a plurality of single substrate processing units, said required period of time includes a period of time taken for said substrate processing to be repeatedly performed in one of said plurality of single substrate processing units.
10 . A substrate processing method for performing substrate processing by using a batch processing unit that performs said substrate processing including chemical liquid processing on a plurality of substrates, and at least one single substrate processing unit that performs said substrate processing including drying processing on one of said substrates, the method comprising:
a process of calculating a required period of time that is a period of time taken for said substrates to complete said substrate processing in said at least one single substrate processing unit according to a standby number that is a number of said substrates after being subjected to said chemical liquid processing in said batch processing unit and before being subjected to said drying processing in said at least one single substrate processing unit; and
a process of changing a processing number of said substrates in said batch processing unit to make said required period of time shorter than a period of time taken for said chemical liquid processing in said batch processing unit.
11 . The substrate processing method according to claim 3 , the method further comprising a process of performing cleaning processing by immersing said plurality of substrates in a cleaning tank after being subjected to said chemical liquid processing in said batch processing unit,
wherein said process of calculating said required period of time is a process of calculating said required period of time including a period of time taken for said cleaning processing according to said standby number of said substrates immersed in said cleaning tank.
12 . The substrate processing method according to claim 3 , the method further comprising a process of performing cleaning processing on said substrates before being subjected to said drying processing in said at least one single substrate processing unit.
13 . The substrate processing method according to claim 12 , wherein said process of calculating said required period of time is a process of calculating said required period of time including a period of time taken for said cleaning processing according to said standby number of said substrates before moving from said batch processing unit to said at least one single substrate processing unit.
14 . The substrate processing method according to claim 10 ,
wherein said chemical liquid processing is performed in said batch processing unit by immersing said substrates in a chemical liquid tank,
the method further comprising a process of performing cleaning processing by immersing said plurality of substrates after being subjected to said chemical liquid processing in a cleaning tank in said batch processing unit,
wherein said chemical liquid tank includes a first region in which said chemical liquid processing is started at a first start timing, and a second region in which said chemical liquid processing is started at a second start timing that is a timing different from said first start timing, and
said cleaning tank includes a third region in which said cleaning processing is performed on said substrates subjected to said chemical liquid processing in said first region, and a fourth region in which said cleaning processing is performed on said substrates subjected to said chemical liquid processing in said second region.
15 . The substrate processing method according to claim 3 , wherein said required period of time includes a period of time taken for said substrates to move from said batch processing unit to said at least one single substrate processing unit.
16 . The substrate processing method according to claim 3 , wherein said required period of time includes a period of time taken for posture changing for said substrates subjected to said substrate processing in said batch processing unit to be subjected to said substrate processing in said at least one single substrate processing unit.
17 . The substrate processing method according to claim 3 , wherein in a case where said standby number of said substrates are distributed to a plurality of single substrate processing units, said required period of time includes a period of time taken for said substrate processing to be repeatedly performed in one of said at least one single substrate processing units.