Apparatus for clamping a substrate on a mono-polar electrostatic chuck for deposition of photoresist films
Apparatuses for clamping a substrate on a mono-polar electrostatic chuck for deposition of photoresist films are disclosed. In an example, a lift-pin assembly includes a first metal spring, a first metal above and coupled to the first metal spring, a second metal spring above and coupled to the first metal, a second metal above and coupled to the second metal spring, and a ceramic above and coupled to the second metal.
1 . A lift-pin assembly, comprising:
a first metal spring;
a first metal above and coupled to the first metal spring;
a ceramic above and coupled to the first metal; and
a second metal spring above and coupled to the first metal, and a second metal above and coupled to the second metal spring, wherein the ceramic is above and coupled to the second metal.
2 . The lift pin assembly of claim 1 , wherein the first metal spring provides a consistent ground path for the lift-pin assembly.
3 . The lift pin assembly of claim 1 , wherein the first metal spring provides compliance for the lift-pin assembly.
4 . The lift pin assembly of claim 1 , wherein the first metal spring provides guided linear motion for the lift-pin assembly.
5 . The lift pin assembly of claim 1 , wherein the second metal spring provides contact pressure for the lift-pin assembly.
6 . The lift pin assembly of claim 1 , wherein the ceramic is for supporting a wafer, and wherein the ceramic comprises SiC.
7 . A mono-polar electrostatic chuck, comprising:
a chuck body;
a plurality of lift-pin holes in the chuck body; and
a plurality of lift-pins, individual ones of the plurality of lift-pins in corresponding ones of the plurality of lift-pin holes, wherein each of the plurality of lift-pins comprises:
a first metal spring;
a first metal above and coupled to the first metal spring;
a second metal spring above and coupled to the first metal;
a second metal above and coupled to the second metal spring; and
a ceramic above and coupled to the second metal.
8 . The mono-polar electrostatic chuck of claim 7 , wherein the first metal spring of each of the plurality of lift-pins provides a consistent ground path for the lift-pin assembly.
9 . The mono-polar electrostatic chuck of claim 7 , wherein the first metal spring of each of the plurality of lift-pins provides compliance for the lift-pin assembly.
10 . The mono-polar electrostatic chuck of claim 7 , wherein the first metal spring of each of the plurality of lift-pins provides guided linear motion for the lift-pin assembly.
11 . The mono-polar electrostatic chuck of claim 7 , wherein the second metal spring of each of the plurality of lift-pins provides back pressure for the lift-pin assembly.
12 . The mono-polar electrostatic chuck of claim 7 , wherein the second metal spring of each of the plurality of lift-pins provides contact pressure for the lift-pin assembly.
13 . The mono-polar electrostatic chuck of claim 7 , wherein the ceramic of each of the plurality of lift-pins is for supporting a wafer, and wherein the ceramic comprises SiC.
14 . A system, comprising:
a chamber;
a plasma source within or coupled to the chamber; and
a mono-polar electrostatic chuck within the chamber, the mono-polar electrostatic chuck comprising:
a chuck body;
a plurality of lift-pin holes in the chuck body; and
a plurality of lift-pins, individual ones of the plurality of lift-pins in corresponding ones of the plurality of lift-pin holes, wherein each of the plurality of lift-pins comprises:
a first metal spring;
a first metal above and coupled to the first metal spring;
a second metal spring above and coupled to the first metal;
a second metal above and coupled to the second metal spring; and
a ceramic above and coupled to the second metal.
15 . The system of claim 14 , wherein the first metal spring of each of the plurality of lift-pins of the mono-polar electrostatic chuck provides a consistent ground path for the lift-pin assembly.
16 . The system of claim 14 , wherein the first metal spring of each of the plurality of lift-pins of the mono-polar electrostatic chuck provides compliance for the lift-pin assembly.
17 . The system of claim 14 , wherein the first metal spring of each of the plurality of lift-pins of the mono-polar electrostatic chuck provides guided linear motion for the lift-pin assembly.
18 . The system of claim 14 , wherein the second metal spring of each of the plurality of lift-pins of the mono-polar electrostatic chuck provides back pressure for the lift-pin assembly, and wherein the second metal spring of each of the plurality of lift-pins of the mono-polar electrostatic chuck provides contact pressure for the lift-pin assembly.
19 . The system of claim 14 , wherein the ceramic of each of the plurality of lift-pins of the mono-polar electrostatic chuck is for supporting a wafer, and wherein the ceramic comprises SiC.