Semiconductor device production method
A method for efficiently producing circuit patterns (semiconductor devices) that allows for effortless pickup of circuit patterns after dicing. The method includes producing a semiconductor substrate with circuit patterns formed on a first surface; forming a first laminate by bonding a first support through a first adhesive layer to the first surface; forming a second laminate by bonding a second support through a second adhesive layer having a dot pattern to a second surface opposite to the first surface; debonding the first support from the second laminate; and picking up the circuit patterns from the second support.
1 . A semiconductor device production method comprising:
producing a semiconductor substrate with circuit patterns formed on a first surface;
forming a first laminate by bonding a first support through a first adhesive layer to the first surface;
forming a second laminate by bonding a second support through a second adhesive layer having a dot pattern to a second surface opposite to the first surface;
debonding the first support from the second laminate; and
picking up the circuit patterns from the second support.
2 . The semiconductor device production method according to claim 1 , wherein the dot pattern of the second adhesive layer is provided at least in a certain region between the semiconductor substrate and the second support.
3 . The semiconductor device production method according to claim 1 , wherein the dot pattern is formed by exposure and development processing using a resist.
4 . The semiconductor device production method according to claim 1 , wherein when bonding the second support to the semiconductor substrate, a plurality of dots are interposed between the circuit patterns and the second support.
5 . The semiconductor device production method according to claim 1 , wherein adhesion of the second adhesive layer interposed between the semiconductor substrate and the second support is lower than that of the first adhesive layer interposed between the semiconductor substrate and the first support.
6 . The semiconductor device production method according to claim 1 , wherein a pressing force used in bonding the semiconductor substrate and the first support is greater than that used in bonding the semiconductor substrate and the second support.
7 . The semiconductor device production method according to claim 1 , further comprising grinding the semiconductor substrate in the first laminate.
8 . The semiconductor device production method according to claim 1 , further comprising dicing the semiconductor substrate of the first laminate to individualize each circuit pattern.
9 . The semiconductor device production method according to claim 1 ,
wherein, in the first laminate, a reaction layer that undergoes alteration upon exposure to light is provided between the semiconductor substrate and the first adhesive layer,
and wherein the method comprises irradiating the reaction layer with the light to allow debonding of the first support from the second laminate.
10 . The semiconductor device production method according to claim 9 , wherein the first support is a glass substrate, and
the light is irradiated onto the reaction layer through the glass substrate.
11 . The semiconductor device production method according to claim 1 , comprising debonding the first support from the second laminate, followed by cleaning the circuit patterns with a cleaning fluid,
wherein the cleaning fluid dissolves the first adhesive layer while having inability or limited ability to dissolve the second adhesive layer.
12 . The semiconductor device production method according to claim 1 , wherein the first adhesive layer is formed using a thermoplastic adhesive.
13 . The semiconductor device production method according to claim 1 , wherein the second adhesive layer is formed using a cationic-polymerization-type negative resist, a radical-polymerization-type negative resist, or a photo-crosslinking-type negative resist.