Semiconductor device with thickening layer and method for fabricating the same
The present application discloses a semiconductor device and a method for fabricating the same. The semiconductor device includes a substrate; a word line structure including a word line dielectric layer in the substrate and including a U-shaped profile, a word line conductive layer on the word line dielectric layer and within the substrate, and a word line capping layer on the word line conductive layer; a top thickening layer including a U-shaped profile, between the word line conductive layer and the word line capping layer, and between the word line dielectric layer and the word line capping layer; a bottom capping layer on the substrate and adjacent to the word line dielectric layer; and a top capping layer covering the bottom capping layer and the word line structure. Top surfaces of the top thickening layer and the word line dielectric layer are coplanar and higher than the substrate.
1 . A semiconductor device, comprising:
a substrate;
a word line structure comprising:
a word line dielectric layer positioned in the substrate and comprising a U-shaped cross-sectional profile;
a word line conductive layer comprising a bottom conductive portion positioned on the word line dielectric layer and within the substrate, and a top conductive portion positioned on the bottom conductive portion and within the substrate; and
a word line capping layer positioned on the word line conductive layer;
a bottom thickening layer comprising a U-shaped cross-sectional profile, positioned between the bottom conductive portion and the top conductive portion, between the top conductive portion and the word line dielectric layer, and between the word line capping layer and the word line dielectric layer;
a bottom capping layer positioned on the substrate and adjacent to the word line dielectric layer; and
a top capping layer covering the bottom capping layer and the word line structure;
wherein a top surface of the bottom thickening layer and a top surface of the word line dielectric layer are coplanar and are at a vertical level higher than a top surface of the substrate;
wherein the bottom thickening layer comprises a high-k material, an oxide, a nitride, an oxynitride or combinations thereof.
2 . The semiconductor device of claim 1 , further comprising a top thickening layer, wherein the top thickening layer comprises a U-shaped cross-sectional profile and is positioned between the top conductive portion and the word line capping layer, and between the word line capping layer and the bottom thickening layer.
3 . The semiconductor device of claim 2 , wherein a top surface of the top thickening layer and the top surface of the bottom thickening layer are coplanar.
4 . The semiconductor device of claim 2 , wherein a top surface of the word line capping layer is at a vertical level higher than the vertical level of the top surface of the bottom thickening layer.
5 . The semiconductor device of claim 4 , wherein the top surface of the word line capping layer is curved.
6 . The semiconductor device of claim 4 , wherein a top surface of the bottom capping layer is at a vertical level higher than the vertical level of the top surface of the bottom thickening layer.
7 . The semiconductor device of claim 2 , wherein the top surface of the bottom capping layer is curved.
8 . The semiconductor device of claim 2 , further comprising a bottom barrier layer positioned between the bottom conductive portion and the word line dielectric layer.
9 . The semiconductor device of claim 8 , further comprising a middle barrier layer positioned between the bottom conductive portion and the bottom thickening layer.
10 . The semiconductor device of claim 8 , wherein the bottom barrier layer comprises titanium nitride, titanium, or a combination thereof.
11 . The semiconductor device of claim 9 , wherein the middle barrier layer comprises titanium nitride, titanium, or a combination thereof titanium nitride, titanium, or a combination thereof.
12 . A method for fabricating a semiconductor device, comprising:
providing a substrate, forming a bottom capping layer on the substrate, and forming a word line trench through the substrate and extending to the substrate;
conformally forming a word line dielectric layer on the word line trench;
forming a bottom conductive portion on the word line dielectric layer and within the word line trench;
conformally forming a layer of first thickening material on the bottom conductive portion, the word line dielectric layer, and the bottom capping layer;
forming a top conductive portion on the layer of first thickening material and within the word line trench;
conformally forming a layer of second thickening material on the top conductive portion and the layer of first thickening material;
forming a layer of top insulating material on the layer of second thickening material, completely filling the word line trench;
removing portions of the second thickening material, the first thickening material, and the top insulating material to respectively form a top thickening layer, a bottom thickening layer, and a word line capping layer while concurrently recessing the word line dielectric layer; and
forming a top capping layer covering the bottom capping layer, the word line dielectric layer, the word line capping layer, the bottom thickening layer, and the top thickening layer.
13 . The method for fabricating the semiconductor device of claim 12 , wherein a top surface of the bottom thickening layer, a top surface of the top thickening layer, and a top surface of the word line dielectric layer are coplanar after the word line dielectric layer is recessed.
14 . The method for fabricating the semiconductor device of claim 13 , wherein a top surface of the bottom capping layer is at a vertical level higher than the top surface of the word line dielectric layer after the word line dielectric layer is recessed.
15 . The method for fabricating the semiconductor device of claim 13 , wherein a top surface of the word line capping layer is at a vertical level higher than the top surface of the word line dielectric layer after the word line dielectric layer is recessed.
16 . The method for fabricating the semiconductor device of claim 13 , wherein the bottom capping layer and the top capping layer comprise the same material.
17 . The method for fabricating the semiconductor device of claim 13 , wherein the bottom thickening layer and the top thickening layer comprise the same material.