Integrated circuit package with multiple interconnects
An integrated circuit (IC) package includes a mold compound. A first interconnect of the IC package is encased in the mold compound. The first interconnect includes a first set of leads protruding from a first side of the mold compound along a first row and a second set of leads protruding from a second side of the mold compound along a second row, wherein the first row and the second row are in a first plane. A second interconnect of the IC package is also encased in the mold compound. The second interconnect includes a third set of leads protruding from the first side of the mold compound along a third row and a fourth set of leads protruding from the second side of the mold compound along a fourth row. The third row and the fourth row are in a second plane.
1 . An integrated circuit (IC) package comprising:
a mold compound;
a first interconnect encased in the mold compound, the first interconnect comprising a first set of leads protruding from a first side of the mold compound along a first row and a second set of leads protruding from a second side of the mold compound along a second row, wherein the first row and the second row are in a first plane and the first side of the mold compound opposes the second side of the mold compound; and
a second interconnect encased in the mold compound, the second interconnect comprising a third set of leads protruding from the first side of the mold compound along a third row and a fourth set of leads protruding from the second side of the mold compound along a fourth row, wherein the third row and the fourth row are in a second plane spaced apart from the first plane.
2 . The IC package of claim 1 , wherein the first interconnect comprises a die pad, the IC package further comprising a die mounted on the die pad.
3 . The IC package of claim 1 , wherein the first interconnect comprises a first die pad and the second interconnect comprises a second die pad, and the IC package further comprises a first die mounted on the first die pad and a second die mounted on the second die pad.
4 . The IC package of claim 1 , wherein the first set of leads and the second set of leads have a first length, and the third set of leads and the fourth set of leads have a second length, wherein the second length is greater than the first length.
5 . The IC package of claim 1 , wherein the first set of leads and the third set of leads extend in a first nonlinear direction from the first side of the mold compound to a third plane, and the second set of leads and the fourth set of leads extend in a second nonlinear direction from the second side of the mold compound to the third plane, the third plane being spaced apart from the first plane and the second plane.
6 . The IC package of claim 5 , wherein the first set of leads and the third set of leads interleave along a first row of the third plane.
7 . The IC package of claim 6 , wherein the second set of leads and the fourth set of leads interleave along a second row of the third plane that is spaced apart from the first row of the third plane.
8 . The IC package of claim 7 , wherein a third side of the mold compound is on the third plane.
9 . The IC package of claim 7 , wherein the leads along the first row of the third plane and the second row of the third plane have a pitch of about 0.5 to 0.32 millimeters (mm).
10 . The IC package of claim 7 , wherein the leads along the first row of the third plane and the second row of the third plane have a pitch of about 0.32 millimeters (mm).
11 . The IC package of claim 7 , wherein the leads along the first row of the third plane and the second row of the third plane have a pitch that is about equal to a sum of half of a width of a lead of the leads along the first row of the third plane and a metal spacing of the first interconnect.